Proceedings Article•
Double resonance transition from rectangular waveguide to Substrate Integrated Waveguide
08 Apr 2013-pp 3353-3354
TL;DR: In this paper, a simple right-angle transition between a rectangular waveguide and a substrate integrated waveguide (SIW) is proposed, where two slots etched in the broad wall of the SIW are used to create double resonance behavior that results in a broad bandwidth of the element.
Abstract: In this paper the authors present a simple right-angle transition between a rectangular waveguide (RWG) and Substrate Integrated Waveguide (SIW). The coupling between both waveguide types is realised by using two slots etched in the broad wall of the SIW. Different lengths of the slots create a double resonance behaviour that results in a broad bandwidth of the element. The standard flange of the rectangular waveguide can be easily flush-mounted to the substrate of the SIW, and therefore, the proposed component has a simple mechanical configuration. A sample transition is designed to work in the lower part of the Ka-band. The simulation results show that the proposed component has the return loss better than 15 dB in the bandwidth of 1.9 GHz. The insertion loss is better than 1 dB including the losses of a short section of SIW.
Citations
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Patent•
13 Jun 2014TL;DR: In this article, an integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the material and a second side opposite to the first side, and an integrated antenna structure arranged between the first and second isolating layers.
Abstract: An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.
18 citations
Patent•
13 Jun 2014TL;DR: In this paper, the authors proposed a radio frequency coupling structure consisting of a dielectric layer, a first electrically conductive layer comprising a first transition structure, and an integrated waveguide structure.
Abstract: A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.
11 citations
Patent•
29 Aug 2014TL;DR: In this article, a radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at first and second sides of a first dielectric substrate, respectively.
Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.
8 citations
Patent•
13 Jun 2014TL;DR: In this article, an integrated circuit package comprises a dielectric material, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and receiving a radio frequency signal arranged between the first and second electrically isolating layers.
Abstract: An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.
7 citations
Patent•
26 Oct 2016TL;DR: In this article, a radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at first and second sides of a first dielectric substrate, respectively.
Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises first and second coupling structures. Each coupling structure has a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The first and second coupling structures are symmetrically arranged with the first electrically conductive layers closer to each other than the second electrically conductive layers are to each other.
5 citations
References
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17 Nov 2003
TL;DR: Current state-of-the-art of circuit design and implementation platforms based on this new concept are reviewed and discussed in detail and future research and development trends are discussed with reference to low-cost innovative design of millimeter-wave and optoelectronic integrated circuits.
Abstract: A new generation of high-frequency integrated circuits is presented, which is called substrate integrated circuits (SICs). Current state-of-the-art of circuit design and implementation platforms based on this new concept are reviewed and discussed in detail. Different possibilities and numerous advantages of the SICs are shown for microwave, millimeter-wave and optoelectronics applications. Practical examples are illustrated with theoretical and experimental results for substrate integrated waveguide (SIW), substrate integrated slab waveguide (SISW) and substrate integrated nonradiating dielectric (SINRD) guide circuits. Future research and development trends are also discussed with reference to low-cost innovative design of millimeter-wave and optoelectronic integrated circuits.
660 citations
"Double resonance transition from re..." refers background in this paper
...The Substrate Integrated Waveguide (SIW) is a type of transmission line that belongs to a bigger family of the socalled Substrate Integrated Circuits (SICs), which received much attention in recent years [1]....
[...]
24 May 2012
TL;DR: Millimeter-wave and terahertz antenna technologies are overviewed including the conventional and nonconventional planar/nonplanar antenna structures based on different platforms with respect to theoretical and experimental results in connection with electrical and mechanical performances.
Abstract: Significant advances in the development of millimeter-wave and terahertz (30-10 000 GHz) technologies have been made to cope with the increasing interest in this still not fully explored electromagnetic spectrum. The nature of electromagnetic waves over this frequency range is well suited for the development of high-resolution imaging applications, molecular-sensitive spectroscopic devices, and ultrabroadband wireless communications. In this paper, millimeter-wave and terahertz antenna technologies are overviewed including the conventional and nonconventional planar/nonplanar antenna structures based on different platforms. As a promising technological platform, substrate-integrated circuits (SICs) attract more and more attention. Various substrate-integrated waveguide (SIW) schemes and other synthesized guide techniques have been widely employed in the design of antennas and arrays. Different types of substrate-integrated antennas and beamforming networks are discussed with respect to theoretical and experimental results in connection with electrical and mechanical performances.
160 citations
"Double resonance transition from re..." refers background in this paper
...Therefore, it is an excellent candidate for beamforming network transmission line of antenna arrays, especially at millimetre-wave frequencies where high conductor losses prevent using other types of planar guides such as microstrip, strip and coplanar waveguide lines [2]....
[...]
TL;DR: In this article, a compact and broad-band integrated transition between laminated waveguide in a multilayer low-temperature co-fired ceramic (LTCC) substrate and standard air-filled rectangular waveguide is presented.
Abstract: In this paper, a compact and broad-band integrated transition between laminated waveguide in a multilayer low-temperature co-fired ceramic (LTCC) substrate and standard air-filled rectangular waveguide is presented. A parallel inter-coupled two-pole filter equivalent circuit is employed to interpret the working mechanism of the transition and to predict the performance. A Ka-band prototype of the proposed broad-band transition is designed and fabricated in an LTCC substrate. The simulated and measured results of the prototyped transition show good agreement. It has been demonstrated, through the experimental results of the Ka-band prototype that the proposed transition configuration gives an effective bandwidth of over 8% with -15-dB return loss and average -0.4-dB insertion loss over the bandwidth at the Ka frequency band.
71 citations
"Double resonance transition from re..." refers methods in this paper
...In [10], [11] the SIW was fabricated in LTCC technology and resonating cavities were employed to obtain a broadband operation....
[...]
TL;DR: In this paper, a Ka-band broadband transition between an air-filled waveguide and a substrate integrated waveguide (SIW) is proposed by using a radial probe inserted into the height-tapered metal waveguide.
Abstract: A Ka-band broadband transition between an air-filled waveguide and a substrate integrated waveguide (SIW) is proposed. The transition is realised by using a radial probe inserted into the height-tapered metal waveguide. Results show that an insertion loss less than 2.5 dB and a return loss better than 14 dB in the frequency band 28.3-39.5 GHz are obtained for a back-to-back structure
66 citations
"Double resonance transition from re..." refers methods in this paper
...In the in-line transitions matching between both guides is done either by using probes [3]–[5] or probes together with a waveguide taper [6], [7]....
[...]
TL;DR: In this article, a new substrate-integrated waveguide to air-filled rectangular waveguide (WR-10) transition for use at millimetre-wave frequencies is proposed.
Abstract: Proposed is a new substrate-integrated waveguide to air-filled rectangular waveguide (WR-10) transition for use at millimetre-wave frequencies. The transition combines the features of low return loss and low insertion loss over the 42 GHz bandwidth and it can be manufactured without a high degree of complexity. A 75-115 GHz band prototype of the proposed broadband transition is designed and fabricated. Simulated and measured results of the prototyped back-to-back transition show good agreement.
56 citations
"Double resonance transition from re..." refers methods in this paper
...In the in-line transitions matching between both guides is done either by using probes [3]–[5] or probes together with a waveguide taper [6], [7]....
[...]