Dual‐direction high thermal conductivity polymer composites with outstanding electrical insulation and electromagnetic shielding performance
About: This article is published in Polymer Composites.The article was published on 2020-04-01. It has received 13 citations till now. The article focuses on the topics: Electromagnetic shielding & Thermal conductivity.
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TL;DR: In this article , Fe2O3 particles are deposited on carbon fibers (CF) and then utilized as fillers in boron nitride/silicone rubber (BN/SR) to fabricate sandwich structured [email protected] 2O3/(BN/R) composites.
Abstract: High integration development of electronics requires materials possessing excellent thermal conductivity, electromagnetic interference (EMI) shielding, and electrical insulation. In this work, Fe2O3 particles are deposited on carbon fibers (CF) and then utilized as fillers ([email protected]2O3) in boron nitride/silicone rubber (BN/SR) to fabricate sandwich structured [email protected]2O3/(BN/SR) composites, herein, BN/SR as top & substrate layer, and [email protected]2O3 as middle layer. Orientation of BN in [email protected]2O3/(BN/SR) composites realizes excellent in-plane thermal conductivity coefficient (λ∥), and the core-sheath structure of [email protected]2O3 achieves good EMI shielding performance by the “absorption-reflection (transmittance)-reabsorption” process of electromagnetic waves, insulation modification of CF and the sandwich structure strengthen the electrical insulation. When the amount of BN and [email protected]2O3 are 20.6 wt% and 45.5 wt%, respectively, the λ∥, EMI shielding effectiveness, volume resistance and breakdown strength of [email protected]2O3/(BN/SR) composites reach 3.86 W/(m·K), 37.7 dB, 6.2 × 1014 Ω cm and 26.8 kV/mm, respectively, which are all higher than those of commonly fabricated CF/(BN/SR) composites with same amount of BN and CF (3.83 W/(m·K), 19.4 dB, 8.6 × 1013 Ω cm and 21.4 kV/mm). [email protected]2O3/(BN/SR) composites possess better cooling effect (5.6 °C) than that of commercial silicon grease (QM850) on the testing platform of computer's central processing unit, whose functions are more abundant and have wide application prospects in electronics.
85 citations
TL;DR: In this paper, a carbon nanotube/acrylic copolymer (CNT/AC) foam was constructed by constructing a 3D porous architecture composed of a segregated CNT network impregnated with an AC polymer through a hot pressing foaming process.
70 citations
TL;DR: In this article , a low-melting-point alloy (LMPA) layered structure in epoxy resin is proposed for electronic packaging materials with heat conduction, electrical insulation and EMI shielding properties.
Abstract: Nowadays, electronic packaging materials requires electrical insulation, heat conduction and electromagnetic interference (EMI) shielding performance. With the inspiration raised by Janus materials, introducing low-melting-point alloy (LMPA) layered structure in epoxy resin is potential method to acquiring satisfying properties. The layered structure is originated from LMPA particles self-sedimentation and closely stacking. Meanwhile, LMPA particles are coated by epoxy resin that could remain the overall electrical insulation. When loading of 20 vol% LMPA, composite obtained thermal conductivity 1.23 W/mK (the LMPA side), total EMI shielding value of 35.56 dB at 30 GHz, and electrical conductivity of 5.00 × 10−8 S/cm. Further, the introduction of boron nitride nanosheet (BNNS) into the composites could promote isotropic heat conduction and improve the electrical insulation. This paper has provided novel LMPA layered structure, showing great promise for applications of electronic packaging materials with heat conduction, electrical insulation and EMI shielding properties.
16 citations
TL;DR: In this paper , the effect of nanoparticle networks on rheological behavior, electrical conductivity, and electromagnetic wave (EMW) shielding effectiveness is carried in conductive polymer composites (CPC).
Abstract: Herein, a comparative study for the effect of nanoparticle networks on rheological behavior, electrical conductivity, and electromagnetic wave (EMW) shielding effectiveness (SE) is carried in conductive polymer composites (CPC). Two different polymers, that is, poly(ε-caprolactone) (PCL) and isotactic polypropylene (iPP), which have different dispersion of multiwall carbon nanotubes (MWCNT), are used as polymer matrices. A transmission electron microscope (TEM) and a scanning electron microscope (SEM) are employed to determine the dispersion of MWCNTs in different polymer matrices. A rotational rheometer and a vector network analyzer are used to evaluate the percolation thresholds of storage modulus, complex viscosity and EMW SE, respectively. The results indicate that the EMW SE percolation thresholds are much larger than the electrical and rheological percolation thresholds. Specifically, the percolation thresholds of storage modulus and complex viscosity are 0.39 and 0.33 vol% for the MWCNT/PCL samples, and 1.57 and 1.57 vol% for the MWCNT/iPP samples, respectively. The electrical and EMW SE percolation thresholds are 0.33 and 1.99 vol%, 1.24 and 5.41 vol% for the MWCNT/PCL and MWCNT/iPP nanocomposites, respectively. The electrical and rheological percolation may happen in the samples with a sparse MWCNT network, while EMW SE percolation may require a dense MWCNT network in the samples.
7 citations
TL;DR: In this paper , a thermal conductivity (TC) of a composite with 10 wt% hydroxylated boron nitride (BN-OH) and modified polystyrene (mPS) was achieved by using a facile in-situ polymerization.
Abstract: Enhancing the heat dissipation capacity of polymer-based composites requires effectively improving the compatibility of filler in a polymer matrix. Herein, hydroxylated boron nitride (BN-OH) and modified polystyrene (mPS) are combined to achieve a high thermal conductive BN-OH@mPS composite by using a facile in-situ polymerization. Due to the strong interface interaction between BN-OH and mPS, the proposed BN-OH@mPS composite can have high thermal conductivity (TC). Specifically, the TC of the composite containing 10 wt% BN-OH can reach 1.231 W/mK, which is 142% higher than that of BN/PS manufactured by a traditional method. Additionally, such a special structure brings a delayed decomposition process of the composite, making it possess high thermal stability. Overall, this serves as a universal route for developing thermal conductive non-polar polymer/inorganic filler composites.
5 citations
References
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TL;DR: In this paper, a dielectric spectroscopy of short carbon fiber/silica composite in the frequency range from 8.2 to 12.4 GHz at temperatures between 30 and 600°C has been performed.
1,540 citations
TL;DR: In this article, the fundamental design principles of highly thermally conductive composites were discussed and the key factors influencing the thermal conductivity of polymers, such as chain structure, crystallinity, crystal form, orientation of polymer chains, and orientation of ordered domains in both thermoplastics and thermosets were addressed.
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TL;DR: Chemical graphitized r-GOs, as the thinnest and lightest material in the carbon family, exhibit high-efficiency electromagnetic interference shielding at elevated temperature, attributed to the cooperation of dipole polarization and hopping conductivity.
Abstract: Chemical graphitized r-GOs, as the thinnest and lightest material in the carbon family, exhibit high-efficiency electromagnetic interference (EMI) shielding at elevated temperature, attributed to the cooperation of dipole polarization and hopping conductivity. The r-GO composites show different temperature-dependent imaginary permittivities and EMI shielding performances with changing mass ratio.
1,358 citations
TL;DR: In this paper, the authors evaluated the dielectric properties and microwave attenuation performances over the full X-band (8.2-12.4 GHz) at a wide temperature ranging from 100 to 500 °C.
961 citations
TL;DR: In this paper, theoretical and experimental aspects of thermal conductivity in composites, from thermal energy generation to heat transfers, are reviewed, and the fundamental mechanism of thermal conduction, its mathematical aspects, and certain essential parameters to be considered in this study, such as crystallinity, phonon scattering, or filler/matrix interfaces are discussed in detail.
841 citations