Effect of surface radiation on the transient cooling of heat sources under forced convection - A numerical study
20 May 2020-Vol. 2236, Iss: 1, pp 030001
TL;DR: In this article, a 3D numerical modeling and simulation of seven high power protruding heat sources mounted on an SMPS (Switch Mode Power Supply) board using ANSYS FLUENT (R-16) under transient heat transfer mode is presented.
Abstract: The cooling of electronic gadgets is the biggest challenge in recent years. The selection of innovative cooling techniques leads to the improvement in reliability and performance of electronic systems. Hence, the present study deals with the 3-D numerical modeling and simulation of seven high power protruding heat sources mounted on an SMPS (Switch Mode Power Supply) board using ANSYS FLUENT (R-16) under transient heat transfer mode. The heat sources are cooled under air medium using a velocity of 15 m/s and the heat dissipation rate is 10 W/cm2. The objective is to study the surface radiation effect on the cooling of these heat sources under forced convection and to analyze the heating and cooling cycle of the heat sources. Four different surface conditions (ɛ = 0.90, Non-metallic paint), (ɛ = 0.86, Gray surface, ɛ = 0.8, Steel oxidised paint) and (ɛ = 0.65, Fe-Cast surface) are considered to analyze the radiation effect and the values are compared with respect to the polished surface (ɛ = 0.1). It has been concluded that the surface radiation reduces the temperature of the heat sources by 18 to 25% and helps in better cooling. The time taken for both charging (heating) and discharging (cooling) of the heat sources are also reported for the above emissivity values, and it has been found that charging (heating) takes more time as compare to discharging (cooling) of the heat sources. To generalize the problem, a correlation is put forward for the non-dimensional temperature excess (θ) of the heat sources in terms of their surface emissivity (ɛ) and cooling rate (time).
Citations
More filters
TL;DR: In this paper, the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine non-identical elec...
Abstract: The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine nonidentical elec...
5 citations
References
More filters
01 Nov 2017
TL;DR: In this paper, the numerical investigation of natural and mixed convection heat transfer on optimal distribution of five non-identical protruding discrete heat sources (Aluminium) mounted on a substrate (Bakelite) board was conducted.
Abstract: The paper deals with the numerical investigation of natural and mixed convection heat transfer on optimal distribution of five non-identical protruding discrete heat sources (Aluminium) mounted on a substrate (Bakelite) board. The heat sources are subjected to a uniform heat flux of 2000 W/m2. The temperature of heat sources along with the effect of thermal interaction between them is predicted by carrying out numerical simulations using ANSYS Icepak, and the results are validated with the existing experimental findings. The results suggest that mixed convection is a better method for cooling of discrete heat source modules. Also, the temperature of heat sources is a strong function of their shape, size, and positioning on the substrate. Effect of radiation is studied by painting the surface of heat sources by black paint. The results conclude that, under natural convection heat transfer, the temperature of heat sources drops by 6-13% from polished to black painted surface, while mixed convection results in the drop by 3-15%. The numerical predictions are in strong agreement with experimental results.
10 citations
TL;DR: In this paper, the role of working fluids (air, water and FC-72) on the cooling of discrete heated modules under free, forced and mixed convection medium was investigated.
Abstract: The study has focused on the role of working fluids (air, water and FC-72) on the cooling of discrete heated modules under free, forced and mixed convection medium. Three non-identical protruding discrete heat sources are arranged at different positions on a substrate board following golden mean ratio (GMR). Numerical simulations for these heat sources are carried out using a commercial software (ANSYS-Icepak R-15) to simulate their flow and temperature fields under three different modes of heat transfer.
Results suggest that the temperature of the heat sources is a strong function of their size, position on the substrate board, the velocity of the fluid and type of working fluid used. A correlation has been proposed for the temperature of these heat sources keeping in mind their strong dependence on the afore-mentioned parameters. It has been found that water can be used for better heat removal from the heat sources due to its high boiling point. The whole idea gives a clear insight to the electronic cooling engineers regarding the selection of working fluids and modes of heat transfer for the cooling of electronic components.
8 citations