Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials
26 Apr 2010-pp 1-6
TL;DR: In this paper, the authors compare the most common unified viscoplastic models in the local and finite element levels for the decision upon the most efficient model for a tin-based solder token as the test material.
Abstract: Solder materials are critical packaging compounds and due to usually weakest melting temperature among packaging constitutive materials, thus, they are frequently subjected to a multitude of physical phenomena: creep, fatigue and combined hardening effects. The complexity and interaction of such factors must be considered in suitable way in the mechanical behaviour modelling using the appropriate material behaviour laws. The choice of the mechanical model depends on several factors such as the complexity of constitutive equations to be integrated, the availability and suitability of implementation in the FE codes, the number of parameters to be identified, the capability of the model to represent the most common physical features of the material… Following these observations and in order to deal with this critical remarks, comparisons between the most common unified viscoplastic models should be done in the local and finite element levels for the decision upon the most efficient model. That is the aim of this paper with application to a tin based solder token as the test material.
Citations
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TL;DR: In this article, the effect of temperature fluctuations on a number of various solder materials namely SAC105, SAC305 and Sn-36Pb-2Ag was investigated.
11 citations
01 Dec 1988
TL;DR: In this paper, a set of internal variable type constitutive equations which model large elastic-viscoplastic deformations of metals at high temperatures is formulated, and the values for the material parameters appearing in these functions are determined.
Abstract: : A set of internal variable type constitutive equations which model large elastic-viscoplastic deformations of metals at high temperatures is formulated. For a first-order representation of large deformation constitutive behavior we use a scalar as an internal variable to represent the isotropic resistance to plastic flow offered by the internal state of the material. Hot compression tests on an iron-2% silicon alloy have been conducted. Based on these experiments, specific viscoplastic constitutive functions are proposed, and the values for the material parameters appearing in these functions are determined. The constitutive equations with these functions and material parameters accurately reproduce the basic tests and also accurately predict the response of the metal to some critical experiments which were not used to determine the material parameters in the constitutive functions. Keywords: Deformation; Strain(Mechanics); Stresses; Metals; Plastic properties; Strength (Mechanics); Time dependence; Strain rate; Environments.
2 citations
References
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TL;DR: In this paper, a set of phenomenological, internal variable type constitutive equations describing the elevated temperature deformation of metals is developed, which can faithfully account for strain-hardening, the restoration processes of recovery and recrystallization and strain rate and temperature history effects.
523 citations
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01 Jan 1996
TL;DR: In this paper, Krausz et al. proposed a small strain Viscoplasticity theory based on overstress and showed that it can be used to model the role of Dislocation Substructure during Class M and Exponential Creep.
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439 citations
"Efficiency and robustness of some b..." refers background in this paper
...Jumps tests The aim of these tests is to evaluate the capability of the models to represent trans ient stages and to take into account the loading history [15]....
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TL;DR: In this paper, a unified viscoplastic constitutive law, the Anand model, was applied to represent the inelastic deformation behavior for solders used in electronic packaging.
Abstract: A unified viscoplastic constitutive law, the Anand model, was applied to represent the inelastic deformation behavior for solders used in electronic packaging. The material parameters of the constitutive relations for 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, and 97.5Pb2.5Sn solders were determined from separated constitutive relations and experimental results. The achieved unified Anand model for solders were tested for constant strain rate testing, steady-state plastic flow and stress/strain responses under cyclic loading. It is concluded that the Anand model can be applied for representing the inelastic deformation behavior of solders at high homologous temperature and can be recommended for finite element simulation of the stress/strain responses of solder joints in service. @DOI: 10.1115/1.1371781#
307 citations
"Efficiency and robustness of some b..." refers methods in this paper
...We can include Anand [I] and the separated viscoplastic models [2] among these categories....
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01 Jan 1996
TL;DR: In this article, the relation between materials and mechanics is discussed, and a state-varying approach is proposed for state-variable modeling of superalloys based on the principles of mechanics.
Abstract: RELATIONSHIPS BETWEEN MATERIAL AND MECHANICAL PROPERTIES. Physical Basis of Inelasticity. Tensile, Compressive, and Cyclic Characteristics of Metals. Creep of Metals. MULTIAXIAL PLASTICITY AND CREEP. Principles of Mechanics. Yield Surface Plasticity and Classical Creep Modeling. STATE-VARIABLE APPROACH. Foundation of State-Variable Modeling. Multiaxial and Thermomechanical Modeling. Single-Crystal Superalloys. Finite-Element Methods. Appendices. Index.
186 citations
"Efficiency and robustness of some b..." refers background in this paper
...Then, its formulation is mainly related to the high temperature creep mechanisms such dislocation climb and dislocation glide , creep dislocation, etc [9]....
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TL;DR: In this paper, the multiple backstress nonlinear kinematic hardening model of Moosbrugger and McDowell was extended to thermomechanical cyclic loading conditions, with certain components independent of the degree of isotropic hardening.
143 citations
"Efficiency and robustness of some b..." refers background in this paper
...On the other point of view, and inspite of the complexity of their constitutive equations, some kind of unified viscoplastic such as McDowell [3], Basaran et al....
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