Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias
Alain Fourmigue,Giovanni Beltrame,Gabriela Nicolescu +2 more
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TLDR
This work introduces an efficient algorithm based on the Finite Difference Method to compute the transient temperature in liquid-cooled 3D ICs, showing a 5x speedup versus state-of-the-art models, while maintaining the same level of accuracy.Abstract:
Three-dimensional integrated circuits (3D ICs) with advanced cooling systems are emerging as a viable solution for many-core platforms. These architectures generate a high and rapidly changing thermal flux. Their design requires accurate transient thermal models. Several models have been proposed, either with limited capabilities, or poor simulation performance. This work introduces an efficient algorithm based on the Finite Difference Method to compute the transient temperature in liquid-cooled 3D ICs. Our experiments show a 5x speedup versus state-of-the-art models, while maintaining the same level of accuracy, and demonstrate the effect of large through silicon vias arrays on thermal dissipation.read more
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References
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Book
Numerical Methods for Engineers
TL;DR: Numerical methods for engineers , Numerical method for engineers, and more.
Journal ArticleDOI
A Supernodal Approach to Sparse Partial Pivoting
TL;DR: A sparse LU code is developed that is significantly faster than earlier partial pivoting codes and compared with UMFPACK, which uses a multifrontal approach; the code is very competitive in time and storage requirements, especially for large problems.
Numerical methods for engineers
TL;DR: The fifth edition of "Numerical Methods for Engineers" continues its tradition of excellence and expanded breadth of engineering disciplines covered is especially evident in the problems, which now cover such areas as biotechnology and biomedical engineering.
Proceedings ArticleDOI
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
TL;DR: 3D-ICE, a compact transient thermal model (CTTM) for the thermal simulation of 3D ICs with multiple inter-tier microchannel liquid cooling, is presented, which offers significant speed-up over a typical commercial computational fluid dynamics simulation tool while preserving accuracy.
28.5 A 1.2V 12.8GB/s 2Gb Mobile Wide-I/O DRAM with 4×128 I/Os Using TSV-Based Stacking
Jung-Sik Kim,Ho-Cheol Lee,Donghyuk Lee,Hyong-Ryol Hwang,Sooman Hwang,Jin-Guk Kim,Jang-Woo Ryu,Sang-Kyu Kang,So-Young Kim,Ho-Young Kim,Jong-Min Bang,Hyunyoon Cho,Min-Soo Jang,Cheolmin Han,Jung-Bae Lee,Kye-Hyun Kyung,Joo-Sun Choi,Young-Hyun Jun +17 more
TL;DR: A 1Gb single data rate (SDR) Wide-I/O mobile SDRAM with 4 channels and 512 DQ pins, featuring 12.8GB/s data bandwidth is designed.