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Patent

Electroless gold-plating method and electronic component

TL;DR: In this paper, the authors proposed a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which the electroless nickel plating, electroless palladium plating and electroless metal plating are deposited.
Abstract: PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT
Citations
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Patent
28 Dec 2012
TL;DR: In this paper, the authors describe a catalyst solution consisting of a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom, which is useful for a catalyzing an electroless process for plating metal on nonconductive surfaces.
Abstract: A catalyst solution includes a precious metal nanoparticle and a polymer having a carboxyl group and a nitrogen atom. The catalyst solution is useful for a catalyzing an electroless process for plating metal on non-conductive surfaces.

13 citations

Patent
28 Nov 2012
TL;DR: In this article, a method for arranging a metal palladium layer in a conducting layer of a printed circuit board and a layered structure thereof is described, where the thickness of the gold layer can be greatly reduced so as to achieve the effect of lowering the material cost.
Abstract: The invention relates to a method for arranging a metal palladium layer in a conducting layer of a printed circuit board and a layered structure thereof. The method comprises the following steps of: firstly, coating copper on an insulating substrate, and baking the substrate; then, sequentially carrying out the processes of drilling, copper precipitation, line manufacturing and insulating layer solder resisting so as to obtain a half-finished product of a board body; and finally, sequentially carrying out the processes of nickel precipitation, palladium precipitation and gold precipitation to the line part of the half-finished product of the board body. In the process of plating soft gold on the printed circuit board, a metal palladium layer is arranged between a nickel layer and a gold layer, so that the thickness of the gold layer can be greatly reduced so as to achieve the effect of lowering the material cost.

13 citations

Patent
21 Aug 2015
TL;DR: In this article, an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance, was presented.
Abstract: The present invention has an object to provide an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance. In order to achieve the object, as a reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target by electroless plating, an electroless plating solution containing a water-soluble gold compound, citric acid or a citrate salt, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt, hexamethylenetetramine, and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups is adopted.

4 citations

Patent
11 Jan 2012
TL;DR: In this paper, a manufacturing method of a substrate with fine metal patterns is proposed to prevent abnormal metal precipitation on the surface of a resin base when non-electrolyte nickel palladium gold plating processing is performed on the surfaces of fine metal pattern on a substrate such as the terminal part of a print circuit board.
Abstract: The invention provides a manufacturing method of a substrate with fine metal patterns The method enables prevention of abnormal metal precipitation on the surface of a resin base when non-electrolyte nickel palladium gold plating processing is performed on the surface of fine metal patterns on a substrate such as the terminal part of a print circuit board Meanwhile, by the method, high-quality substrate with plating processing faces having fine metal patterns, print circuit boards and semiconductor devices can be obtained The manufacturing method of the substrate with fine metal patterns comprises the steps of embedding the lower part of a fine metal pattern in a trench equipped on a supporting surface of a substrate made of resin, performing non-electrolyte nickel palladium gold plating processing on the fine metal pattern part which is not in contact with the surface of the trench and making the ratio between the height X the plating area projects on the support surface and the minimum distance Y between patterns (X/Y)less than 08

4 citations

Patent
04 Aug 2010
TL;DR: In this article, an electroless plating method was proposed to improve reflectivity of light and to prevent discoloration of a silver-plated film under a high temperature condition, which included applying palladium treatment on a Ni-P plating film formed on an article to be plated.
Abstract: PROBLEM TO BE SOLVED: To improve reflectivity of light and to prevent discoloration of a silver-plated film under a high temperature condition.SOLUTION: An electroless plating method includes: a palladium treatment step of applying palladium treatment on a Ni-P plating film formed on an article to be plated; and an electroless silver plating step of applying an electroless silver plating to the article to be plated to which the palladium treatment is applied.

3 citations

References
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Patent
05 Apr 2006
TL;DR: In this article, a connection terminal is obtained by sequentially forming an electroless nickel plated film 3, an electrophoresis-free palladium plated (EPSP) film 4 on a conductive terminal.
Abstract: PROBLEM TO BE SOLVED: To provide a connection terminal which is excellent in connection reliability in soldering and with which the achievement of wire bonding is not disturbed by heat treatment. SOLUTION: The connection terminal is obtained by sequentially forming an electroless nickel plated film 3, an electroless palladium plated film 4 and an electroless gold plated film 5 on a conductive terminal 2. The thickness of the electroless nickel plated film 3 is within a range of 0.1-0.5 μm. COPYRIGHT: (C)2007,JPO&INPIT

22 citations

Patent
21 Oct 2002
TL;DR: In this paper, the authors proposed an electroless gold plating solution which can form a good plating film on an Electroless Nickel Plating film and can minimize the corrosion of the nickel plating.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless gold plating solution which can form a good plating film on an electroless nickel plating film and can minimize the corrosion of the nickel plating film. SOLUTION: The electroless gold plating film contains (i) a water-soluble gold compound, (ii) a complexing agent, (iii) at least one component selected from the group consisting of acids including chalcogen elements of an oxidation number 2 to 4 and their salts, (iv) at least one component selected from the group consisting of hydrazine and its derivative, and (v) a compound having an ethylene group including ≥2 imono groups within the molecule and having a substituent in some cases between the nitrogen atoms of the imino group. COPYRIGHT: (C)2004,JPO

16 citations

Patent
06 Jun 2005
TL;DR: In this paper, the problem of providing a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and providing a manufacturing method of the same, is addressed.
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board permitting normal electrical connection between an electrode and a connecting pad of an electronic component all the time, and provide a manufacturing method of the same. SOLUTION: In a wiring board, a connecting pad 2a (2b) comprising copper is formed on the surface of an insulating substrate having a wiring conductor, and the surface of the connecting pad 2a (2b) is successively coated with an electroless nickel plating film 11, a reduction type electroless palladium plating film 12 and a substitutional reduction type electroless gold plating film 13. There is provided also a manufacturing method of the same. COPYRIGHT: (C)2007,JPO&INPIT

15 citations

Patent
14 Apr 1997
TL;DR: In this paper, the Ni-B plating contg. 0.01 to 10% B is first formed at a thickness of 0.005 to 5 μm and then Au is plated in superposing thereon.
Abstract: PROBLEM TO BE SOLVED: To form plating layers having a high bonding property without using Ni-P plating by plating Ni-B of a specific thickness as ground surface plating on the soldering parts and bonding parts of semiconductors and electronic parts and plating Pd thereon at a specific thickness. SOLUTION: The Ni-B plating contg. 0.01 to 10% B is first formed at a thickness of 0.01 to 20 μm on the soldering parts and wire bonding parts of the electronic parts, such as semiconductor elements and lead frames. The Pd is then plated at a thickness of 0.005 to 10 μm thereon and further, in some cases, Au is plated in superposing thereon at a thickness of 0.005 to 5 μm. The plating having a good bonding property, such as the excellent resistivity to solder erosion, good wettability of deposited metal, high strength of adhesion, excellent heat resistance, etc., may be formed without applying the Ni-P which is used thus far as the ground surface plating and has defects. The quality and the reliability of semiconductors and electronic parts are improved.

13 citations

Patent
16 Jul 2002
TL;DR: In this paper, the authors propose a process for producing a substrate, having a terminal electrode exhibiting a high bonding strength to a bonding wire and solder and a strength sufficient for enduring flip-chip mounting.
Abstract: PROBLEM TO BE SOLVED: To provide a process for producing a substrate, having a terminal electrode exhibiting a high bonding strength to a bonding wire and solder and a strength sufficient for enduring flip-chip mounting. SOLUTION: On a underlying layer of Cu, or the like, formed on a substrate body, an Ni film or an Ni alloy film, a Pd film or a Pd alloy film, and an Au film are deposited sequentially and then heat treated at 200-300°C, for not longer than 120 sec, thus alloying the Pd film or the Pd alloy film and the Au film. COPYRIGHT: (C)2004,JPO

9 citations