Patent•
Electroless gold plating solution
21 Oct 2002-
TL;DR: In this paper, the authors proposed an electroless gold plating solution which can form a good plating film on an Electroless Nickel Plating film and can minimize the corrosion of the nickel plating.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless gold plating solution which can form a good plating film on an electroless nickel plating film and can minimize the corrosion of the nickel plating film. SOLUTION: The electroless gold plating film contains (i) a water-soluble gold compound, (ii) a complexing agent, (iii) at least one component selected from the group consisting of acids including chalcogen elements of an oxidation number 2 to 4 and their salts, (iv) at least one component selected from the group consisting of hydrazine and its derivative, and (v) a compound having an ethylene group including ≥2 imono groups within the molecule and having a substituent in some cases between the nitrogen atoms of the imino group. COPYRIGHT: (C)2004,JPO
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Patent•
22 Aug 2005TL;DR: An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiusulfate, thiourea, a pH regulator and a stabilizer was proposed in this paper.
Abstract: An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.
36 citations
Patent•
16 Apr 2007
TL;DR: In this paper, the authors proposed a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which the electroless nickel plating, electroless palladium plating and electroless metal plating are deposited.
Abstract: PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT
18 citations
Patent•
05 Dec 2007
TL;DR: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R 1 to R 4 as discussed by the authors.
Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R 1 —NH—C 2 H 4 —NH—R 2 or (CH 2 —NH—C 2 H 4 —NH—CH 2 ) n—R 4 (wherein R 1 to R 4 represent —OH, —CH 3 , —CH 2 OH, —C 2 H 4 OH, —CH 2 N(CH 3 ) 2 , —CH 2 NH(CH 2 OH), —CH 2 NH(C 2 H 4 OH), —C 2 H 4 NH(CH 2 OH), —C 2 H 4 NH(C 2 H 4 OH), —CH 2 N(CH 2 OH) 2 , —CH 2 N(C 2 H 4 OH) 2 , —C 2 H 4 N(CH 2 OH) 2 or —C 2 H 4 N(C 2 H 4 OH) 2 , and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
18 citations
Patent•
14 Apr 2008
TL;DR: In this article, an electroless gold plating bath is used to form a plated laminate with a thickness of not smaller than 0.15 μm, which can be used for wire bonding or wire bonding.
Abstract: Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a completing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R 1 —NH—C 2 H 4 —NH—R 2 or R 3 —(CH 2 —NH—C 2 H 4 —NH—CH 2 ) n —R 4 . The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath. Especially, an electroless gold plating film having a thickness of not smaller than 0.15 μm can be efficiently, effectively formed by use of one plating bath in one step, thereby enabling the process to be simplified along with an attendant advantage in cost.
17 citations
Patent•
17 Jan 2007
TL;DR: In this paper, the reduction precipitation type electroless gold plating liquid is used to directly deposit a gold-plating film on a palladium film, which is favorable for the surface treatment of a conductor circuit of a printed circuit board.
Abstract: PROBLEM TO BE SOLVED: To provide a reduction precipitation type electroless gold plating liquid which can be directly precipitated on a palladium film, and is favorable, in particular, for the surface treatment of a conductor circuit of a printed circuit board. SOLUTION: The reduction precipitation type electroless gold plating liquid which is used to directly deposit a gold plating film on a palladium film consists of an aqueous solution containing a water-soluble gold compound, a reducing agent and a complexing agent, and contains at least one kind of compound selected from a group consisting of formaldehyde bisulfites, rongalit, and hydrazines as the reducing agent. An electroless nickel plating film, an electroless palladium plating film, and an electroless gold plating film deposited by using the reduction precipitation type electroless gold plating liquid are successively deposited on the conductor part of the printed circuit board. COPYRIGHT: (C)2008,JPO&INPIT
13 citations
References
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Patent•
10 Jun 1998
TL;DR: In this paper, a negative electrode is prepared by bonding metal particles, capable of electrochemically absorbing and releasing alkali metal ions or alkaline metal atoms, having an average particle size of 1 μm or less, and a conductive material different from the metal particles.
Abstract: PROBLEM TO BE SOLVED: To provide a nonaqueous secondary battery capable of exhibiting high capacity, small capacity drop accompanying the charging/discharging cycles, and capable of manufacturing in a simple process suitable for an industrial production. SOLUTION: A negative electrode is prepared by bonding metal particles, capable of electrochemically absorbing and releasing alkali metal ions or alkali metal atoms, having an average particle size of 1 μm or less, and a conductive material different from the metal particles, having an average particle size of 1 μm or less to a current collector with a binder. The metal particles are particles of at least one metal selected from among the group comprising Al, Si, Sn, Pb, As, Sb, Bi, Zn, Cd, Ag, Au, Pt, Pd, Mg, Na, and K. COPYRIGHT: (C)2000,JPO
14 citations
Patent•
06 Dec 1991
TL;DR: In this article, the authors proposed a method to make it possible to continuously use an electroless gold plating soln. over a long period of time while maintaining a constant plating rate and uniformity of deposited films by keeping the concn. of cyanide ions in the soln within a certain range.
Abstract: PURPOSE:To make it possible to continuously use an electroless gold plating soln. over a long period of time while maintaining a constant plating rate and uniformity of deposited films by keeping the concn. of cyanide ions in the plating soln. within a certain range without deteriorating the performance of the plating soln. CONSTITUTION:When electroless gold plating is carried out with a plating soln. contg. gold cyanide, alkali cyanide, a reducing agent, alkali hydroxide, a crystal regulating agent and a stabilizing agent, an aldehyde or ketone compd. is added at the time of replenishing gold cyanide.
5 citations
Patent•
05 Nov 1998
TL;DR: In this article, a water soluble gold compd, a complexing agent which stabilizes gold ions into a plating soln, but substantially does not dissolve nickel, cobalt or palladium and a gold precipitation inhibitor capable of suppressing the partial and excessive etching of the base metal generated at the time of executing gold plating.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless gold plating soln. forming a gold plating film extremely excellent in adhesion between the substitution gold plating film to be formed and a base metal film selected from the groups of nickel, cobalt, palladium and alloys contg. these metals and to provide a method of executing electroless gold plating treatment by using it. SOLUTION: As essential components, this soln. contains the following (a) to (c): (a) a water soluble gold compd., (b) a complexing agent which stabilizes gold ions into a plating soln. but substantially does not dissolve nickel, cobalt or palladium and (c) a gold precipitation inhibitor capable of suppressing the partial and excessive etching of the base metal generated at the time of executing gold plating by substitution reaction with the base metal.
3 citations
Patent•
10 Sep 1998
TL;DR: In this article, a catalyst-type electroless gold plating liquid without containing cyanide compds is prepared by incorporating gold salts such as gold sodium sulfite and sodium chloroaurate by about 1 to 10 g/L calculated in terms of gold ion.
Abstract: PROBLEM TO BE SOLVED: To obtain a plating liquid with decreased toxicity which keeps good pattern plating property and which enables stable and thick plating for a long time by adding compds. IIIb, Vb elements to a catalyst-type plating liquid containing gold salts, complexing agent, reducing agent, pH buffer or the like without incorporating cyanide compds. SOLUTION: A catalyst-type electroless gold plating liquid without containing cyanide compds. is prepared by incorporating gold salts such as gold sodium sulfite and sodium chloroaurate by about 1 to 10 g/L calculated in terms of gold ion, complexing agent such as sodium thiosulfate and sodium sulfite by about 5 to 100 g/L, reducing agent such as thiourea by about 0.5 to 5 g/L, and pH buffer such as sodium tetraborate by about 5 to 60 g/L. Further, compds. of IIIb, Vb elements are incorporated as additives by about 1×10-3 to 1 g/L to the plating liquid. The IIIb elements are preferably Ga and In, and the Vb elements are preferably Sb and Bi. The additives produce S ion and insoluble compd. from the sulfite ion to prevent decomposition of the plating liquid or failure in plating precipitation. COPYRIGHT: (C)2000,JPO
1 citations