Electroless plating on III–V compound semiconductors
About: This article is published in Solid-state Electronics.The article was published on 1965-08-01. It has received 2 citations till now.
Citations
More filters
TL;DR: In this article, a three-layer Pd/Ru/Au electrolessly deposited ohmic contact to p-InGaAs, suitable for use in a self-aligned process, was presented.
Abstract: A three-layer Pd/Ru/Au electrolessly deposited ohmic contact to p-InGaAs, suitable for use in a self-aligned process, is presented. Cross-sectional transmission electron microscopy shows that the electrolessly plated metal layers are dense with a thin uniform reaction between the Pd and InGaAs. This contact metallization remains shallow and electrically stable even after aging for 4 h at 250°C. An average specific contact resistance of (1.6 ± 0.6) × 10 -6 Ω cm 2 was obtained for as-deposited contacts with an HCl surface treatment. When a UV ozone and NH 4 OH surface treatment was used, specific contact resistances as low as (2.1 ± 0.9) X 10 -7 Ω cm 2 were obtained.
10 citations
4 citations
References
More filters
Journal Article•
TL;DR: In this article, a process was developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current, which was brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution.
Abstract: A process has been developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current. The deposition of nickel is brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution. The reaction is catalytic and, under the prescribed conditions of concentration and pH, no reduction occurs in the solution unless certain metals, such as steel or nickel, are introduced into the bath. The reduction then occurs only at the surface of the immersed metal with the production of a coating of nickel of 96 to 97 percent purity.
392 citations
TL;DR: In this article, a process was developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current, which was brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution.
Abstract: A process has been developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current. The deposition of nickel is brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution. The reaction is catalytic and, under the prescribed conditions of concentration and pH, no reduction occurs in the solution unless certain metals, such as steel or nickel, are introduced into the bath. The reduction then occurs only at the surface of the immersed metal with the production of a coating of nickel of 96 to 97 percent purity.
385 citations