Patent•
Electroless tin plating on electroless nickel
11 Jul 1967-
About: The article was published on 1967-07-11. It has received 10 citations till now. The article focuses on the topics: Electroless nickel & Gold plating.
Citations
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14 Dec 1995TL;DR: In this article, a chromate oxidant was used to enhance removal characteristics for copper layers in integrated circuit fabrication, with a pH between about 6 and about 9. In one embodiment, the slurry has a pH of about 6.
Abstract: There is described a slurry for use in chemical mechanical polishing of copper layers in integrated circuit fabrication. The slurry includes a chromate oxidant, such as sodium chromate tetrahydrate (Na2 CrO4.4H2 O). The chromate oxidant provides a slightly basic slurry solution that enhances removal characteristics for copper layers. In one embodiment, the slurry has a pH between about 6 and about 9.
125 citations
Patent•
23 Aug 1996TL;DR: In this paper, chemical mechanical polishing slurry characteristics such as oxidant concentration and abrasive particle dispersion are determined using electrochemical measurement techniques, such as chronoamperometers, amperometry, chronopotentiometry, ionic conductivity, or linear sweep potentiometry.
Abstract: Chemical mechanical polishing slurry characteristics, such as oxidant concentration and abrasive particle dispersion, are determined using electrochemical measurement techniques, such as chronoamperometry, amperometry, chronopotentiometry, ionic conductivity, or linear sweep potentiometry. Slurry characteristics may be tested and monitored independent of a CMP polishing tool. Slurry characteristics may also be automatically controlled in an on-line chemical mechanical polishing process using electrochemical measurements.
59 citations
Patent•
19 Jun 1996TL;DR: In this article, a buffer is used in a semiconductor process for chemical mechanical polishing of metal layers, such as aluminum or titanium, which may include an oxidant capable of causing a passive oxide film to form on a metal based layer.
Abstract: Buffered slurries are used in a semiconductor process for chemical mechanical polishing of metal layers, such as aluminum or titanium. The slurries may comprise an oxidant capable of causing a passive oxide film to form on a metal based layer. The oxidant may comprise a diluent and may be optionally formulated with a separate oxidizing agent, such as ammonium peroxydisulfate. The slurries may include a buffer that maintains a slurry pH where the passive metal oxide film is stable. This pH may be between about 4 and about 9.
57 citations
Patent•
25 Sep 1974
TL;DR: In this article, a sacrificial corrosion resistant coating is produced where the aluminum coating on the ferrous metal surface is characterized by the presence of iron aluminide, and wherein the metal-coated braze is characterized with metal aluminides, such as nickel-aluminide.
Abstract: Ferrous metal articles, such as stainless steel articles, characterized by at least one brazed joint, in which the braze is a non-ferrous alloy are aluminized by first selectively coating the braze alloy with an aluminide-forming metal, such as nickel, and then thermally diffusing aluminum over the entire surface of the article including the selectively coated braze, such that a sacrificial corrosion resistant coating is produced wherein the aluminum coating on the ferrous metal surface is characterized by the presence of iron aluminide, and wherein the aluminum coating on the metal-coated braze is characterized by the presence of metal aluminide, such as nickel aluminide. The aluminide coatings are further enhanced by the application of a non-metallic coating, e.g., a conversion coating.
46 citations
Patent•
28 Jul 2009TL;DR: In this article, a method of fabricating an interconnection between a region of copper material and a conducting region is described, which includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition.
Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.
45 citations
References
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21 Feb 1936
TL;DR: In this article, an improved method of producing a useful coating or film on malleable, non-noble, heavy metals was proposed, such as ferrous metals or alloys such as iron and steel.
Abstract: This invention relates to the coating of malleable, non-noble heavy metals, and has for its object the provision of an improved method of producing a useful coating or film on such metals. By "malleable, non-noble, heavy metals" I mean ferrous metals or alloys such as iron and steel, zinc and...
23 citations
Patent•
24 Jan 1962
12 citations