Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics
TL;DR: In order to develop the high quality electromagnetic interference (EMI) shielding textiles for protective clothing, polyester fabrics were electroless copper-plated as discussed by the authors, and the effects of pretreatment conditions such as scouring, etching, and catalyzation on electromagnetic interference shielding effectiveness (EMISE) and physical properties of treated fabrics were investigated.
About: This article is published in Synthetic Metals.The article was published on 2001-09-24. It has received 158 citations till now.
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TL;DR: In this article, a poly(trimethylene terephthalate) and multiwalled carbon nanotube (MWCNT) composites with varying amounts of MWCNTs were fabricated with the aim to investigate the potential of such composites as an effective light weight electromagnetic interference (EMI) shielding material in the frequency range of 12.4-18 GHz (Ku-band).
194 citations
TL;DR: Using a combination of dispersing low-cost carbon nanofibers and a small quantity of carbon nanotubes within the polystyrene matrix, the formation of a novel nanocomposite with superior microstructure and improved electromagnetic interference (EMI) shielding characteristic was demonstrated in this paper.
Abstract: Using a combination of dispersing low-cost carbon nanofibers and a small quantity of carbon nanotubes within the polystyrene matrix, we have demonstrated the formation of a novel nanocomposite with superior microstructure and improved electromagnetic interference (EMI) shielding characteristic. This nanocomposite is very promising for use as an effective and practical EMI shielding material owing to its high shielding effectiveness, light weight, low cost, and easy processability.
174 citations
TL;DR: In this paper, the effects of SiC content on the mechanical and electromagnetic properties of carbon fiber reinforced SiC matrix composites (Cf/SiC) were studied systematically.
170 citations
TL;DR: The use of nanomaterials and nanotechnology-based processes is growing at a tremendous rate in all fields of science and technology as mentioned in this paper, and textiles are also experiencing the benefits of nanotechnology in its diverse field of applications.
Abstract: The use of nanomaterials- and nanotechnology-based processes is growing at a tremendous rate in all fields of science and technology. Textile industry is also experiencing the benefits of nanotechnology in its diverse field of applications. Textile-based nanoproducts starting from nanocomposite fibers, nanofibers to intelligent high-performance polymeric nanocoatings are getting their way not only in high performance advanced applications but nanoparticles are also successfully being used in conventional textiles to impart new functionality and improved performance. Greater repeatability, reliability and robustness are the main advantages of nanotechnological advancements in textiles. Nanoparticle application during conventional textile processing techniques, such as finishing, coating and dyeing, enhances the product performance manifold and imparts hitherto unachieved functionality. New coating techniques like sol-gel, layer-by-layer, plasma polymerization etc. can develop multi-functionality, intellige...
148 citations
TL;DR: In this article, the electroless Ni-P/Cu-Ni multilayers are electroless deposited onto polyester fabric as a function of the deposition time of Ni−P and compared with Ni·P and Cu−Ni deposits.
Abstract: Nickel–phosphorus/copper–nickel (Ni–P/Cu–Ni) multilayers are electroless deposited onto polyester fabric as a function of the deposition time of Ni–P and compared with Ni–P and Cu–Ni deposits. Their surface morphology, microstructure and composition are analyzed by using scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy-dispersive X-ray (EDX). Their electromagnetic interference (EMI) shielding effectiveness (SE) is evaluated and corrosion resistance is characterized by electrochemical polarization measurements. The results show that with the same weight of the deposits, the EMI SE of the Ni–P/Cu–Ni plated fabric is higher than that of the Ni–P plated fabric, while the corrosion resistance of the Ni–P/Cu–Ni plated fabrics is better than the Cu–Ni plated fabrics. Ni–P improves corrosion resistance and greatly enhances the electromagnetic shielding property of Ni–P/Cu–Ni deposits. Furthermore, the EMI SE and corrosion resistance of the Ni–P/Cu–Ni deposits increase with the rise of deposition time of Ni–P. Therefore, electroless Ni–P/Cu–Ni plated fabric is the most appropriate material that will meet the requirements of both corrosion resistance and EMI SE in most textile applications.
108 citations
References
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TL;DR: In this paper, reaction mechanisms for each of the processes and for each type of surface considered (oxygenated or both oxygenated and nitrogenated by the plasma treatment) are proposed for direct palladium chemisorption onto nitrogenated groups.
Abstract: Before electroless plating, polymer surfaces must be sensitized and/or activated by using either the conventional two-step or one-step process. The latter stage is a compulsory one to make such surfaces catalytic, e.g., for Ni-P deposition. These processes are performed here using O{sub 2}, NH{sub 3}, or N{sub 2} plasma pretreatments. Reaction mechanisms are proposed for each of the processes and for each type of surface considered (oxygenated or both oxygenated and nitrogenated by the plasma treatment). Direct palladium chemisorption onto nitrogenated groups is highlighted. This allows one to simplify the process making the surface catalytic via elimination of the use of SnCl{sub 2} and to extend the method to any polymer. An additional interest of the plasma treatments, besides their high efficiency in grafting chemical functions, is to perform this grafting at will on selected areas which results in selective metallization.
135 citations
108 citations
88 citations
TL;DR: In this paper, the authors study the effect of modifying the Pd-ammine complex and varying the substrate doping on Pd deposition during activation and Pd AED adhesion and find that the AED of Pd on polished crystalline Si is non-adherent using this activator solution.
Abstract: The solution in which Si is immersed for activation prior to autocatalytic electroless deposition (AED) of Ni, Cu, etc. is usually HF-PdCl 2 -HCl. However, we find that the AED of Pd on polished crystalline Si, which has important applications in modern planar integrated circuit technology, is nonadherent using this activator solution. Our study of the effects of modifying this solution and varying the substrate doping on the Pd deposition during activation and Pd AED adhesion reveals the following. The activation quality and hence AED adhesion depends not on the SiO 2 etch rate of the solution but on the composition of the solution Pd complex and the substrate hole concentration. In spite of the highest Pd deposition rate during immersion, the activation quality of n-Si with doping >10 19 /cm 3 is poor unless a hole-generating stimulus (e.g., illumination) is present. A change in substrate hole concentration influences AED adhesion by altering the substrate potential and/or density of nucleation sites during activation. Similarly, a change in the Pd complex affects AED adhesion by altering the solution Pd potential. Introduction of certain ammonium compounds into the HF-PdCl 2 -HCl bath creates a specific Pd-ammine complex, most probably Pd(NH 3 ) 2 Cl 2 , which gives Pd AED adhesions of ∼9 and 4 (3) × 10 6 N/m 2 on heavily doped p-Si and lightly doped p(n)-Si, respectively, using a low SiO 2 etch rate (∼90 A/min) and a low temperature (200°C) for Pd nuclei silicidation during activation. Our results regarding the activation mechanism are believed to apply generally to all AED on Si.
38 citations
TL;DR: In this paper, a mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system.
Abstract: A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler-Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components.
34 citations