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Electronic Packaging and Interconnection Handbook
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TLDR
In this article, Plastics, elastomers, and composites are discussed, along with adhesives, underfills, and coatings for printed circuit board technology.Abstract:
Table of contents
CONTRIBUTORS
PREFACE
Chapter 1: Plastics, Elastomers, and Composites
Chapter 2: Adhesives, Underfills, and Coatings
Chapter 3: Thermal Management
Chapter 4: Connector and Interconnection Technology
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
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Citations
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Journal ArticleDOI
Foldable Printed Circuit Boards on Paper Substrates
Adam C. Siegel,Scott T. Phillips,Michael D. Dickey,Nanshu Lu,Zhigang Suo,George M. Whitesides +5 more
TL;DR: Paper as discussed by the authors describes several low-cost methods for fabricating flexible electronic circuits on paper, which include metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and discrete surface-mountable electronic components that are fastened with conductive adhesive directly to the wires.
Patent
Method for forming chip scale package
Peter Elenius,Harry Hollack +1 more
TL;DR: In this article, a chip scale package design for a flip chip integrated circuit includes a redistribution metal layer upon the upper surface of a semiconductor wafer for simultaneously forming solder bump pads as well as the metal redistribution traces that electrically couple such bump pads with the conductive bond pads of the underlying integrated circuit.
Journal ArticleDOI
Electrical Characterization of Screen-Printed Circuits on the Fabric
TL;DR: In this article, a planar printed circuit on fabrics is introduced and their electrical characteristics are measured and analyzed, and a complete system composed of a fabric capacitor sensor input, a controller system on-a-chip, and an LED array display is implemented on the fabric and its operation is demonstrated successfully.
Journal ArticleDOI
MEMS post-packaging by localized heating and bonding
TL;DR: In this article, a review of engineering bases describing current technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach by localized heating and bonding, process demonstrations by selective encapsulation are presented.
Patent
Silicon condenser microphone and manufacturing method
TL;DR: In this article, a silicon condenser microphone package is described, consisting of a transducer unit, a substrate, and a cover, which is attached to the upper surface of the substrate and overlaps at least a portion of the recess.