Journal ArticleDOI
Electronic packaging in the 1990s: the perspective from Europe
H. Wessely,O. Fritz,M. Horn,P. Klimke,W. Koschnick,K.-H. Schmidt +5 more
- Vol. 14, Iss: 2, pp 272-284
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TLDR
In this paper, a new generation of microwiring boards has been introduced, based on Cu/polymer layers on a polyimide base or metal/Polymer layers in a multilayer ceramic or silicon base for high-end technologies.Abstract:
Aspects of electronic packaging for mainframe applications are reviewed. A new generation of microwiring boards has been introduced, based on Cu/polymer layers on a polyimide base or metal/polymer layers on a multilayer ceramic or silicon base for high-end technologies. Advanced multilayer printed circuit boards will fulfil the requirements for low-end applications for the late 90s. In order to satisfy the desired reduction in line delay by packaging components on both sides of large-size wiring substrates, wiring technology is being challenged by miniaturized line structures and increased wiring density. High circuit integration, associated with revolutionary developments in device technology, reduction in chip-feature size, and a packaging technology based on multichip modules, has led to a significant increase in power dissipation and related flux. >read more
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Patent
Stacked multi-chip modules and method of manufacturing
TL;DR: In this paper, a circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface is described, and a method of manufacturing this circuit assembly is also disclosed.
Journal ArticleDOI
Multichip packaging-a tutorial
TL;DR: Several aspects of multichip module technology, including its functions, leverages, applications, and markets, are reviewed in this article, where the packaging technologies used in multi-chip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed.
Proceedings ArticleDOI
Some present and future trends in power electronic converters
J.D. van Wyk,J.A. Ferreira +1 more
TL;DR: Some trends for power electronic converters are evaluated in this paper, with emphasis on component and subcircuit technology, power converter technology, and integrated converter technology and possible future trends are also considered.
Patent
High-density/long-via laminated connector
TL;DR: A high-density laminated connector comprises a plurality of layers of rigid dielectric material which are laminated together as discussed by the authors, which allows precise dimensions of the connecter and, thus, accurate attachment of adjacent circuit boards.
Journal ArticleDOI
Multiobjective optimal placement of convectively cooled electronic components on printed wiring boards
TL;DR: In this paper, a solution methodology for multiobjective optimization problems in the context of models for the placement of components on printed wiring boards (PWB's) is presented, which combines the use of a flow and heat transfer solver, a genetic algorithm for the adaptive search of optimal or near-optimal solutions, and a multi objective optimization strategy [Pareto optimization or multiattribute utility analysis (MUA)].