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Journal ArticleDOI

Electronic structure and energy band offsets for ultrathin silicon nitride on Si(1 0 0)

30 Jun 2003-Applied Surface Science (North-Holland)-Vol. 216, Iss: 1, pp 252-257
TL;DR: In this article, chemical bonding features, energy band offsets and defect state density distributions have been studied using high-resolution X-ray photoelectron spectroscopy and total photo-electron yield analysis.
About: This article is published in Applied Surface Science.The article was published on 2003-06-30. It has received 29 citations till now. The article focuses on the topics: Band gap & Semimetal.
Citations
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Journal ArticleDOI
TL;DR: Amorphous oxide semiconductor (AOS) thin-film transistors (TFTs) invented only one decade ago are now being commercialized for active-matrix liquid crystal display (AMLCD) backplane applications.
Abstract: Amorphous oxide semiconductor (AOS) thin-film transistors (TFTs) invented only one decade ago are now being commercialized for active-matrix liquid crystal display (AMLCD) backplane applications. They also appear to be well positioned for other flat-panel display applications such as active-matrix organic light-emitting diode (AMOLED) applications, electrophoretic displays, and transparent displays. The objectives of this contribution are to overview AOS materials design; assess indium gallium zinc oxide (IGZO) TFTs for AMLCD and AMOLED applications; identify several technical topics meriting future scrutiny before they can be confidently relied upon as providing a solid scientific foundation for underpinning AOS TFT technology; and briefly speculate on the future of AOS TFTs for display and non-display applications.

152 citations

Journal ArticleDOI
TL;DR: In this paper, the authors report on the band offsets of yttrium oxide (Y2O3) on various relaxed and strained semiconductor substrates, such as silicon (Si), germanium (Ge), and silicon GEM, by using x-ray photoelectron spectroscopy.
Abstract: In this work, we report on the band offsets of yttrium oxide (Y2O3) on various relaxed and strained semiconductor substrates, such as silicon (Si), germanium (Ge), and silicon germanium (SiGe). By using the example of Y2O3/Si, important experimental aspects in using photoemission to determine band offsets are discussed. We then discuss the various values of band offsets of Y2O3 on the different substrates that we obtained by using x-ray photoelectron spectroscopy. Finally, we show that presputtering 3 A of metallic Y [equivalent to 1 ML (monolayer) coverage] before the deposition of Y2O3 affects the band lineup by reducing the resultant valence band offsets. We explain the observed band offsets by using an interfacial layer model.

44 citations

Journal ArticleDOI
TL;DR: A comparison of the oxygen uptake on the clean and nitrided surfaces shows quantitatively that the decrease in dangling bond concentration is responsible for the reduced activity of the nitriding surface toward oxidation, and therefore dangling bonds are the initial adsorption site for both gaseous oxygen atoms and molecules.
Abstract: The nitridation of Si(100) by ammonia and the subsequent oxidation of the nitrided surface by both gaseous atomic and molecular oxygen was investigated under ultrahigh vacuum (UHV) conditions using X-ray photoelectron spectroscopy (XPS). Nitridation of Si(100) by the thermal decomposition of NH 3 results in the formation of a subsurface nitride and a decrease in the concentration of surface dangling bond sites. On the basis of changes in the N1s spectra obtained after NH 3 adsorption and decomposition, we estimate that the nitride resides about four to five layers below the vacuum- solid interface and that the concentration of surface dangling bonds after nitridation is only 59% of its value on Si(100)-(2 x 1). Oxidation of the nitrided surface is found to produce an oxide phase that remains in the outer layers of the solid and interacts only weakly with the underlying nitride for oxygen coverages up to 2.5 ML. Slight changes in the N1s spectra observed after oxidizing at 300 K are suggested to arise primarily from the introduction of strain within the nitride, and by the formation of a small amount of Si 2 =N-O species near the nitride-oxide interface. The nitrogen bonding environment changes negligibly after oxidizing at 800 K, which is indicative of greater phase separation at elevated surface temperature. Nitridation is also found to significantly reduce the reactivity of the Si(100) surface toward both atomic and molecular oxygen. A comparison of the oxygen uptake on the clean and nitrided surfaces shows quantitatively that the decrease in dangling bond concentration is responsible for the reduced activity of the nitrided surface toward oxidation, and therefore that dangling bonds are the initial adsorption site for both gaseous oxygen atoms and molecules. Increasing the surface temperature is found to promote the uptake of oxygen when O 2 is used as the oxidant, but brings about only a small enhancement in the uptake of gaseous O-atoms. The different effects of surface temperature on the uptake of O versus O 2 are interpreted in terms of the efficiency at which dangling bond pairs are regenerated on the surface at elevated temperature and the different site requirements for the adsorption of O and O 2 .

39 citations

Journal ArticleDOI
TL;DR: In this article, the chemical states and band offsets in SiN∕Si by photoemission spectroscopy and x-ray absorption spectrograms were investigated by fitting a single component, suggesting that a nitrogen atom is surrounded by three silicon and nine nitrogen atoms for the first and second nearest neighbor, respectively.
Abstract: We have investigated chemical states and band offsets in SiN∕Si by photoemission spectroscopy and x-ray absorption spectroscopy. N1s photoemission spectra in SiN for three kinds of layer-thickness films are fitted by a single component, suggesting that a nitrogen atom is surrounded by three silicon and nine nitrogen atoms for the first and the second nearest neighbor, respectively. Valence-band offsets between SiN and the Si substrates are determined to be 1.6 eV using valence-band spectra by subtracting the contribution from Si substrates. Band gap of SiN is estimated to be 5.6–5.7 eV from valence-band, N1s core level, and NK-edge-absorption spectra. Furthermore, time-dependent measurements of N1s photoemission spectra reveal that the x-ray irradiation time is a significant factor to determine the precise valence-band offsets excluding the differential charging effects.

27 citations

Journal ArticleDOI
TL;DR: In this article, the residual stress field around spherical indentations on single-crystal silicon of different crystallographic orientations is mapped by Raman microscopy, and all orientations exhibit an anisotropic stress pattern with an orientation specific symmetry.

26 citations

References
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Journal ArticleDOI
TL;DR: In this paper, the Schottky barrier heights and band offsets for high dielectric constant oxides on Pt and Si were calculated and good agreement with experiment is found for barrier heights.
Abstract: Wide-band-gap oxides such as SrTiO3 are shown to be critical tests of theories of Schottky barrier heights based on metal-induced gap states and charge neutrality levels. This theory is reviewed and used to calculate the Schottky barrier heights and band offsets for many important high dielectric constant oxides on Pt and Si. Good agreement with experiment is found for barrier heights. The band offsets for electrons on Si are found to be small for many key oxides such as SrTiO3 and Ta2O5 which limit their utility as gate oxides in future silicon field effect transistors. The calculations are extended to screen other proposed oxides such as BaZrO3. ZrO2, HfO2, La2O3, Y2O3, HfSiO4, and ZrSiO4. Predictions are also given for barrier heights of the ferroelectric oxides Pb1−xZrxTiO3 and SrBi2Ta2O9 which are used in nonvolatile memories.

1,947 citations

Journal ArticleDOI
Abstract: The determination of the energy band gaps of thin-gate insulators has been demonstrated from the onsets of the energy-loss spectra of O 1s (or N 1s) photoelectrons. The valence-band lineups of thin high-dielectric-constant (high-k) dielectrics such as Ta2O5, Al2O3, and ZrO2 formed on metals and Si(100) have also been determined by measuring the energy difference between the valence-band density-of-states curves. The energy band diagrams for metal/high-k dielectrics/Si(100) systems have been derived explicitly from considering the measured band gaps, valence-band lineups, electron affinities, and metal work functions in the systems. It is also demonstrated that total photoelectron yield spectroscopy can be used to quantify the energy distributions of both the defect states in high-k gate dielectrics and at the dielectric/Si(100) interfaces over the entire Si band gap without gate formation.

325 citations

Journal ArticleDOI
TL;DR: In this article, the chemical and electronic structures of ultrathin SiO2 thermally grown on Si(100) and Si(111) have been investigated by using Fourier-transform infrared attenuated total reflection (FT-IR-ATR) and X-ray or ultraviolet excited photoelectron spectroscopy (XPS/UPS), respectively.

165 citations

Journal ArticleDOI
TL;DR: In this article, the authors used the energy loss spectra of photoexcited electrons from core levels such as O 1s to measure the energy bandgaps of very thin insulators.

128 citations

Journal ArticleDOI
TL;DR: In this paper, a soft x-ray photoelectron spectroscopy with synchrotron radiation is used to study the interfaces of SiO2/Si(111), SiO 2/Si (100), Si O 2 /Si(100), and Si O 3 /Si 3 N 4 for device-quality ultrathin gate oxides and nitrides.
Abstract: High resolution soft x-ray photoelectron spectroscopy with synchrotron radiation is used to study the interfaces of SiO2/Si(111), SiO2/Si(100), Si(111)/Si3N4, and SiO2/Si3N4 for device-quality ultrathin gate oxides and nitrides. The thin oxides and nitrides were grown by remote plasma deposition at a temperature of 300 °C. Aftergrowth samples were further processed by rapid thermal annealing for 30 s at various temperatures from 700 to 950 °C. The Si(111)/Si3N4 samples were air exposed and formed a thin ∼6 A SiO2 layer with a Si(2p) core-level shift of 3.9 eV, thus allowing us to study both the Si(111)/Si3N4 and SiO2/Si3N4 interfaces with a single type of sample. We obtain band offsets of 4.54±0.06 eV for SiO2/Si(111) and 4.35±0.06 eV for SiO2/Si(100) with film thicknesses in the range 8–12 A. The Si(111)/Si3N4 nitrides show 1.78±0.09 eV valence-band offset for 15–21 A films. This value agrees using the additivity relationship with our independent photoemission measurements of the nitride–oxide valence-ba...

122 citations