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Journal ArticleDOI

Estimation of principal thermal conductivities of layered honeycomb composites using ANN–GA based inverse technique

TL;DR: In this paper, a novel experimental technique for the simultaneous estimation of principal thermal conductivities of a layered honeycomb composite widely used in aerospace structures was developed, where a new standard test material exhibiting structural anisotropy with respect to thermal transport was first conceptualized, designed and fabricated.
About: This article is published in International Journal of Thermal Sciences.The article was published on 2017-01-01. It has received 34 citations till now. The article focuses on the topics: Thermal contact conductance & Thermal conductivity.
Citations
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Journal ArticleDOI
TL;DR: In this paper, five ML frameworks are introduced including physics-separated ML (PSML), physics-evaluated ML (PEML or Type II ML), physicsintegrated ML(PIML) and physics-recovered ML (PRML or Type IV ML) for thermal fluid simulation.

74 citations

Journal ArticleDOI
TL;DR: This study demonstrates that the proposed fusion of computational mechanics and machine learning is an effective way of tackling complex inverse problems.

43 citations


Cites methods from "Estimation of principal thermal con..."

  • ...[24] used ANN with genetic algorithms to solve inverse modelling for heat conduction problems....

    [...]

Journal ArticleDOI
TL;DR: In this paper, a double-sided square guarded hot plate (SGHP) was designed specifically for testing low to moderate thermal conductivity materials having thermal conductivities in the range of 0.02-3.0 Wm−1K−1.

25 citations

Journal ArticleDOI
TL;DR: In this article, an adaptive neuro-fuzzy inference system (ANFIS) is proposed for the prediction and optimization of condensation heat transfer coefficient and pressure drops along an inclined smooth tube.

19 citations


Cites background from "Estimation of principal thermal con..."

  • ...significant attention within a wide range of mechanical engineering applications during the last few years [1-4]....

    [...]

Journal ArticleDOI
TL;DR: In this paper, the authors proposed a computational heat conduction model to estimate the thermal conductivity of composites with high volume fraction of filler particles distributed randomly in the base matrix, which accounts for percolation effect.

18 citations

References
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Journal ArticleDOI
TL;DR: In this article, a methodology is introduced for predicting the effective thermal conductivity of arbitrary particulate composites with interfacial thermal resistance in terms of an effective medium approach combined with the essential concept of Kapitza thermal contact resistance.
Abstract: A methodology is introduced for predicting the effective thermal conductivity of arbitrary particulate composites with interfacial thermal resistance in terms of an effective medium approach combined with the essential concept of Kapitza thermal contact resistance. Results of the present model are compared to existing models and available experimental results. The proposed approach rediscovers the existing theoretical results for simple limiting cases. The comparisons between the predicted and experimental results of particulate diamond reinforced ZnS matrix and cordierite matrix composites and the particulate SiC reinforced Al matrix composite show good agreement. Numerical calculations of these different sets of composites show very interesting predictions concerning the effects of the particle shape and size and the interfacial thermal resistance.

1,638 citations

Book
01 Jan 2000
TL;DR: Inverse heat transfer: Fundamentals and Applications, Second Edition as mentioned in this paper includes techniques within the Bayesian framework of statistics for the solution of inverse problems and their applications for solving problems in convective, conductive, radiative, and multi-physics problems.
Abstract: This book introduces the fundamental concepts of inverse heat transfer solutions and their applications for solving problems in convective, conductive, radiative, and multi-physics problems. Inverse Heat Transfer: Fundamentals and Applications, Second Edition includes techniques within the Bayesian framework of statistics for the solution of inverse problems. By modernizing the classic work of the late Professor M. Necati Ozisik and adding new examples and problems, this new edition provides a powerful tool for instructors, researchers, and graduate students studying thermal-fluid systems and heat transfer. FEATURES Introduces the fundamental concepts of inverse heat transfer Presents in systematic fashion the basic steps of powerful inverse solution techniques Develops inverse techniques of parameter estimation, function estimation, and state estimation Applies these inverse techniques to the solution of practical inverse heat transfer problems Shows inverse techniques for conduction, convection, radiation, and multi-physics phenomena M. Necati Ozisik (1923–2008) retired in 1998 as Professor Emeritus of North Carolina State University’s Mechanical and Aerospace Engineering Department. Helcio R. B. Orlande is a Professor of Mechanical Engineering at the Federal University of Rio de Janeiro (UFRJ), where he was the Department Head from 2006 to 2007.

933 citations

Book
01 Jan 1997
TL;DR: In this article, the core of a honeycomb core is used to design a sandwich core, and the sandwich fabrication process is described. Other honeycomb applications include: Sandwich fabrication. Sandwich panel repair.
Abstract: Introduction. Honeycomb core. Sandwich design. Honeycomb processes. Sandwich fabrication. Structural applications. Other honeycomb applications. Honeycomb and sandwich testing. Sandwich panel repair. Appendix. Index.

341 citations

Book ChapterDOI
01 Jan 2002
TL;DR: In this paper, the authors compile, compile, and correlate property information for materials used in cryogenics, including oxygen free copper, 6061-T6 aluminum, G-10 fiberglass epoxy, 718 Inconel, Kevlar, Niobium titanium (NbTi), beryllium copper, polyamide (nylon), polyimide, 304 stainless steel, Teflon, and Ti-6Al-4V titanium alloy.
Abstract: NIST has published at least two references compiling cryogenic material properties. These include the Handbook on Materials for Superconducting Machinery and the LNG Materials & Fluids. Neither has been updated since 1977 and are currently out of print. While there is a great deal of published data on cryogenic material properties, it is often difficult to find and not in a form that is convenient to use. We have begun a new program to collect, compile, and correlate property information for materials used in cryogenics. The initial phase of this program has focused on picking simple models to use for thermal conductivity, thermal expansion, and specific heat. We have broken down the temperature scale into four ranges: a) less than 4 K, b) 4 K to 77 K, c) 77 K to 300 K, and d) 300 K to the melting point. Initial materials that we have compiled include oxygen free copper, 6061-T6 aluminum, G-10 fiberglass epoxy, 718 Inconel, Kevlar, niobium titanium (NbTi), beryllium copper, polyamide (nylon), polyimide, 304 stainless steel, Teflon, and Ti-6Al-4V titanium alloy. Correlations are given for each material and property over some of the temperature range. We will continue to add new materials and increase the temperature range. We hope to offer these material properties as subroutines that can be called from your own code or from within commercial software packages. We will also identify where new measurements need to be made to give complete property prediction from 50 mK to the melting point.

238 citations

Journal ArticleDOI
TL;DR: In this article, the thermal conductivity of metal-matrix composites, which are potential electronic packaging materials, is calculated using effective medium theory and finite element techniques, and it is shown that if the small particles (in a bimodal distribution) have a radius less than 2.5 μm in SiC/Al, their addition reduces the thermal performance of the composite.
Abstract: The thermal conductivity of metal‐matrix composites, which are potential electronic packaging materials, is calculated using effective medium theory and finite‐element techniques. The thermal boundary resistance, which occurs at the interface between the metal and the included phase (typically ceramic particles), has a large effect for small particle sizes. It is found that SiC particles in Al must have radii in excess of 10 μm to obtain the full benefit of the ceramic phase on the thermal conductivity. Bimodal distributions of particle size are considered, since these are often used to fabricate high‐volume fraction composites. It is found that if the small particles (in a bimodal distribution) have a radius less than 2.5 μm in SiC/Al their addition reduces the thermal conductivity of the composite. Diamond‐containing composites, which have large thermal boundary resistance effects, are analyzed. Comparison of the effective medium theory results to finite‐element calculations for axisymmetric unit‐cell models in three dimensions and to simulation results on disordered arrays of particles in two dimensions confirms the validity of the theory.

166 citations