Evidence for the domination of heavy holes and lattice scattering in SnTe from electrical transport measurements on polycrystalline thin films

High thermoelectric performance by resonant dopant indium in nanostructured SnTe

Abstract: From an environmental perspective, lead-free SnTe would be preferable for solid-state waste heat recovery if its thermoelectric figure-of-merit could be brought close to that of the lead-containing chalcogenides. In this work, we studied the thermoelectric properties of nanostructured SnTe with different dopants, and found indium-doped SnTe showed extraordinarily large Seebeck coefficients that cannot be explained properly by the conventional two-valence band model. We attributed this enhancement of Seebeck coefficients to resonant levels created by the indium impurities inside the valence band, supported by the first-principles simulations. This, together with the lower thermal conductivity resulting from the decreased grain size by ball milling and hot pressing, improved both the peak and average nondimensional figure-of-merit (ZT) significantly. A peak ZT of ∼1.1 was obtained in 0.25 atom % In-doped SnTe at about 873 K.

The mean free path of electrons in metals

Abstract: (2001). The mean free path of electrons in metals. Advances in Physics: Vol. 50, No. 6, pp. 499-537.

Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

Abstract: In this paper, the total resistivity of a thin metal film is calculated from a model in which three types of electron scattering mechanisms are simultaneously operative: an isotropic background scattering (due to the combined effects of phonons and point defects), scattering due to a distribution of planar potentials (grain boundaries), and scattering due to the external surfaces. The intrinsic or bulk resistivity is obtained by solving a Boltzmann equation in which both grain-boundary and background scattering are accounted for. The total resistivity is obtained by imposing boundary conditions due to the external surfaces (as in the Fuchs theory) on this Boltzmann equation. Interpretation of published data on grain-boundary scattering in bulk materials in terms of the calculated intrinsic resistivity, and of thin-film data in terms of the calculated total resistivity suggests that (i) the grain-boundary reflection coefficient in Al is \ensuremath{\approx} 0.15, while it is somewhat higher in Cu; (ii) the observed thickness dependence of the resistivity in thin films is due to grain-boundary scattering as well as to the Fuchs size effect; and (iii) the common observation that single-crystal films possess lower resistivities than polycrystalline films may be accounted for by grain-boundary effects rather than by differences in the nature of surface scattering.

The conductivity of thin metallic films according to the electron theory of metals

Abstract: The conductivity of thin films of the alkali metals has recently been measured in the H. W. Wills Physical Laboratory, Bristol*. It was found that as the thickness of the film is decreased to that of a few atomic layers the conductivity drops below that of the bulk metal. In the papers quoted the hypothesis was put forward that this effect is due to the shortening of the mean free paths of the conduction electrons of the metal by collisions with the boundaries of the film. The experimental results were compared with a formula derived on the basis of this hypothesis. This formula was, however, obtained subject to a number of simplifying assumptions, and it is the first purpose of this paper to obtain a more accurate formula. I also compare this formula with experiment, and make certain deductions about the surfaces of thin films.

Electrical resistivity model for polycrystalline films: the case of specular reflection at external surfaces

Abstract: A model is developed for estimating effects due to electron scattering from grain boundaries, occurring simultaneously with background scattering. Since grain‐boundary effects are negligible in bulk materials, the model is particularly relevant to polycrystalline metal films in which a very fine‐grained structure is often found. It is shown by solution of the appropriate Boltzmann equation, that the total resistivity can be strongly dominated by grain‐boundary scattering. If grain size increases with film thickness, a marked dependence of resistivity on thickness exists, even when scattering from external surfaces is negligible or is completely specular.