Journal ArticleDOI
Experiment and numerical investigation on optimal distribution of discrete ICs for different orientation of substrate board
V. K. Mathew,Tapano Kumar Hotta +1 more
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This article is published in International journal of ambient energy.The article was published on 2020-01-20. It has received 10 citations till now.read more
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Computational study of PCM cooling for electronic circuit of smart-phone
TL;DR: A passive phase change material cooling strategy is proposed which can utilize the advantage of isotopic heat conduction from the electronic element to give an optimum cooling strategy over the electronic aspect which help in keeping the temperature of the electronicelement below 85 °C.
Journal ArticleDOI
Phase change material based passive battery thermal management system to predict delay effect
TL;DR: In this article, the authors performed PCM-based passive thermal management study over 60 Cell 18,650 lithium-ion battery packs which are considered to be working for automobile applications, and the output field results from numerical investigation are predicted using neural network approach in which a multi-objective optimization strategy is proposed between battery pack delay effect for selected paraffin wax and RT-18 PCM against its given C-rate.
Journal ArticleDOI
Experimental investigation of substrate board orientation effect on the optimal distribution of IC chips under forced convection
V. K. Mathew,Tapano Kumar Hotta +1 more
TL;DR: In this article, steady-state experiments are conducted under the laminar forced convection heat transfer mode for cooling of seven asymmetric IC chips (heat sources) mounted at different positions on the substructure.
Journal ArticleDOI
Constructal design of heat sources with different heat generation rates for the hot spot mitigation
TL;DR: In this paper, the optimum heat generation ratio among discrete heat sources generating different amounts of heat in order to mitigate the hot spot was determined by following the constructal design method, where the average and total heat sources' heat generation rates were kept equal for every examined cases.
Journal ArticleDOI
Influence of spent air confinement on pressure distribution over a flat plate impinged by an array of jets
TL;DR: In this article, the effect of spent air confinement on the wallstatic pressure distribution over a flat plate normal to a single row of columns of columns was investigated. But the results were limited to the case of a single column of columns.
References
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Journal ArticleDOI
The optimal spacing of parallel plates cooled by forced convection
Adrian Bejan,Enrico Sciubba +1 more
TL;DR: In this paper, the optimal board-to-board spacing and maximum total heat transfer rate from a stack of parallel boards cooled by laminar forced convection was reported. But the optimal spacing is not directly related to the surface thermal condition.
Journal ArticleDOI
Thermal optimization of PCM based pin fin heat sinks: An experimental study
Rajesh Baby,Chakravarthy Balaji +1 more
TL;DR: In this paper, an experimental investigation carried out to characterize the thermal performance of different configurations of phase change material (PCM) based pin fin heat sinks was carried out and the results showed that there exists sufficient scope to optimize the thermal design of the heat sink.
Journal ArticleDOI
Heat transfer characteristics of an array of protruding elements in single phase forced convection
Suresh V. Garimella,P. A. Eibeck +1 more
TL;DR: In this paper, experiments were performed to determine the convective heat transfer coefficients for water cooling of inline and staggered arrays of 30 heated protruding elements arranged in six rows, and the data for all spacings were correlated using an array Reynolds number which accounts for a partitioning of the flow into bypass and array flows.
Journal ArticleDOI
Experimental and Numerical Study of Conjugate Heat Transfer in a Horizontal Channel Heated From Below
TL;DR: In this paper, a detailed experimental and numerical study is carried out to investigate conjugate heat transfer in a common configuration consisting of a horizontal channel with a heated section, where the basic characteristics of the flow and the associated thermal transport are studied.
Journal ArticleDOI
Air cooling characteristics of a uniform square modules array for electronic device heat sink
TL;DR: In this paper, the average heat transfer coefficient of an electronic devices heat sink with various square modules array has been experimentally investigated, and the experimental data of average Nusselt number were correlated as 0.11 Re 0.77 Pr 0.32 within ±15%, and 0.84 Re 0.58 Pr 0.25 α 0.47 within ±18%.