Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU
01 May 2021-Vol. 50, Iss: 3, pp 2242-2258
About: The article was published on 2021-05-01. It has received 7 citations till now. The article focuses on the topics: Jet (fluid) & Electronics cooling.
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29 Oct 2021
TL;DR: In this paper, the state-of-the-art in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail, along with the pros and cons of these thermal management methods.
Abstract: The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices. Significant efforts have been made to develop high-efficient cooling and flexible thermal management solutions and corresponding design tools. This article reviews the latest progress and the state-of-the-art in electronic cooling, which could help inspire future research. The commonly used methods in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail. Direct cooling consists of air cooling, spray and jet impingement cooling, immersion cooling, and droplet electrowetting. As for indirect cooling, the most popular and hot topics of using microchannel, heat pipe, vapour chamber, thermoelectric, and PCM are overviewed. The effectiveness of the thermal management methods for different-level requirements of electronic cooling and the ways how heat transfer capability can be improved are also introduced in detail. Meanwhile, the pros and cons of these thermal management methods are discussed based on their inherent heat transfer performances/characteristics, optimisation methods, and relevant applications. In addition, the current challenges of electronic cooling and thermal management technologies are explored, along with the outlook of possible future advances.
17 citations
TL;DR: In this article , the effect of heat transfer rate on the performance of TEGs under both steady and transient conditions was analyzed using a liquid saturated porous medium, and the experimental results showed that power generated with Cu particles exceeds that of Al particles with 14%.
Abstract: Low-temperature heat sources are widely available in nature, they are considered to be unusable, even though the conversion of such low-grade energy into electricity (high-grade energy) is highly desirable. Thermoelectric generators (TEGs) are achieving increasing interest in converting low temperature heat into electricity. TEG suffers from low performance, improving the performance of TEG will allow there use in huge engineering applications. In this paper the effect of heat transfer rate on the performance of TEGs will be analysed under both steady and transient conditions. Enhancing heat transfer from the TEG surface will be studied using a liquid saturated porous medium. Aluminium and copper particles are used and their influences are compared to forced convection heat transfer from TEG surfaces with and without liquids. The experimental results showed that power generated with Cu particles exceeds that of Al particles with 14%. The free to forced convection power generation ratio was 26.5% for Al,36% for Cu and the enhancement of TEG performance reached 149% for liquid saturated Cu particles.
7 citations
TL;DR: In this paper, a shape memory alloy vortex generator (SMA-VG) was proposed to address the challenges associated with complex working conditions and random hotspots of electronic components, which can automatically adjust to change the flow characteristics of the microchannel, such that the cooling capacity and heat dissipation demand can be matched intelligently without external control.
6 citations
TL;DR: In this paper , an innovative bionic heat sink with micro barchan-dune-shaped humps for improving the flow and heat transfer performance of the smooth narrow channel was proposed.
5 citations
TL;DR: In this paper, the authors used thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes, which is called sustainable self-cooling framework (SSCF).
Abstract: The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this study, the TEMs are used for cooling the hotspots of computer chips, and a TEC is attached to the hotspot to reduce its temperature to an acceptable value. On the other hand, the other cold surfaces of the chip are attached to TEGs for harvesting electrical power from the chip’s wasted heat. Thereafter, this harvested electrical power (HEP) is then used to run the TEC attached to the hotspot. Since no external electrical power is needed for cooling the hotspot to an acceptable temperature, this technique is called a sustainable self-cooling framework (SSCF). In this paper, the operation principles of the SSCF to cool the hotspot, subjected to different operating conditions, are discussed. As well, considerations are given to investigate the effect of the TEM geometrical parameters, such as the P-/N-leg height and spacing between the legs in both operations of the TEC mode and TEG mode on the SSCF performance.
2 citations
References
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TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
Abstract: Thermoelectric materials are of interest for applications as heat pumps and power generators. The performance of thermoelectric devices is quantified by a figure of merit, ZT, where Z is a measure of a material's thermoelectric properties and T is the absolute temperature. A material with a figure of merit of around unity was first reported over four decades ago, but since then-despite investigation of various approaches-there has been only modest progress in finding materials with enhanced ZT values at room temperature. Here we report thin-film thermoelectric materials that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys. This amounts to a maximum observed factor of approximately 2.4 for our p-type Bi2Te3/Sb2Te3 superlattice devices. The enhancement is achieved by controlling the transport of phonons and electrons in the superlattices. Preliminary devices exhibit significant cooling (32 K at around room temperature) and the potential to pump a heat flux of up to 700 W cm-2; the localized cooling and heating occurs some 23,000 times faster than in bulk devices. We anticipate that the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications: for example, in thermochemistry-on-a-chip, DNA microarrays, fibre-optic switches and microelectrothermal systems.
4,921 citations
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.
4,214 citations
"Experimental investigation on contr..." refers methods in this paper
...The microchannel cooling method was first introduced by Tuckerman and Pease in 1981.(14) One of the advantages of this approach is its high performance in transferring and dispersing the heat of hotspots, which directed toward the attention of researchers to find innovative patterns for the cooling of electronic and information systems with high thermal flows....
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TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.
824 citations
TL;DR: In this paper, the authors reviewed the recent advances of thermoelectric materials, modeling approaches, and applications, and summarized the achievements in past decade have been summarized and the modeling techniques have been described for both the thermoelement modeling and TEC modeling.
593 citations
"Experimental investigation on contr..." refers background in this paper
...Nowadays, the researchers turned their attention to the thermoelectric cooler (TEC) unit and the growing interest in using it to dissipate heat in several areas due to its outstanding properties such as high consistency, does not have a moving part, it is a small system, light, silent, and without coolant.(18) The TEC is an electrical device intended for obtaining a temperature difference between two points....
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01 Jan 2014
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402 citations