Journal ArticleDOI
Fabrication of micromechanical devices from polysilicon films with smooth surfaces
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TLDR
The use of these films in micromechanical devices has been restricted because hydrogen fluoride-etched structures are covered by an etch residue that leads to contact welding.About:
This article is published in Sensors and Actuators.The article was published on 1989-11-15. It has received 194 citations till now. The article focuses on the topics: Surface roughness & Surface tension.read more
Citations
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Journal ArticleDOI
Surface micromachining for microelectromechanical systems
TL;DR: Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films as discussed by the authors, which typically requires that they be freed from the planar substrate.
Journal ArticleDOI
Stiction in surface micromachining
TL;DR: In this article, four major adhesion mechanisms have been analyzed: capillary forces, hydrogen bridging, electrostatic forces and van der Waals forces, and they have been successfully reduced.
Journal ArticleDOI
Micromachined pressure sensors: review and recent developments
William P. Eaton,James H. Smith +1 more
TL;DR: In this paper, the authors reviewed the history of micromachined pressure sensors and examined new developments in the field of pressure sensors, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachines, optical, resonant, and smart pressure sensors.
Journal ArticleDOI
Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory
Carlos H. Mastrangelo,C.H. Hsu +1 more
TL;DR: In this article, the authors examined the deflection, mechanical stability, and adhesion of thin micromechanical structure under capillary forces and divided these phenomena into two separate stages of mechanical collapse and adhesive to the underlying substrate.
Journal ArticleDOI
Electrostatic micro torsion mirrors for an optical switch matrix
TL;DR: In this paper, a new type of compact optical switch using silicon micromachining technique was developed using torsion mirrors supported by thin polysilicon beams (16 /spl mu/m wide, 320 /spl m/m long, and 0.4 /spl mm/m thick) arranged in a 2/spl times/2 matrix.
References
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Journal ArticleDOI
Silicon‐to‐silicon direct bonding method
TL;DR: In this paper, it was found that strong bonding takes place when a pair of clean, mirror-polished silicon surfaces are contacted at room temperature after hydrophilic surface formation.
Journal ArticleDOI
Integrated fabrication of polysilicon mechanisms
TL;DR: In this paper, a planar polysilicon mechanism incorporating lower and higher kinematic pairs (or joints) was described, which is compatible with silicon microfabrication technology.
Journal ArticleDOI
Fine-grained polysilicon films with built-in tensile strain
TL;DR: In this paper, the authors demonstrate that polysilicon films with built-in tensile-strain can be achieved and that any physical size limitations due to compressive-buckling in poly-silicon micromechanical structures can be eliminated.
Proceedings ArticleDOI
Mechanical properties of fine grained polysilicon-the repeatability issue
TL;DR: In this paper, Young's modulus, Poisson's ratio, shear modulus and internal strain for fine-grained polysilicon as a function of processing conditions are presented.
Pin joints, gears, springs, cranks, and other novel micromechanical structures
TL;DR: The first fabrication of micrometer-scaled pin joints, gears, springs, cranks, and sliders made with silicon planar technology was reported in this article, where the movable mechanical elements are built on layers that are later removed to free them so that translation and rotation can take place.
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Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory
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