Journal ArticleDOI
Gas Cooling Enhancement Technology for Integrated Circuit Chips
T. Kishimoto,E. Sasaki,K. Moriya +2 more
Reads0
Chats0
TLDR
In this paper, a turbulence promoting fin with low pressure loss has been developed and enhancement of the heat transfer coefficient using gas flow velocities up to 50 m/s is examined using air and helium gas as coolants.Abstract:
New approaches are described for increasing the capability of forced gas convection cooling for integrated circuit chips, using an enhanced heat transfer technique and a higher gas flow velocity in a closed-cycle flow. A turbulence promoting fin with low pressure loss has been developed and enhancement of the heat transfer coefficient using gas flow velocities up to 50 m/s is examined using air and helium gas as coolants. 'By applying these techniques, the cooling capability of a package is investigated through the use of prototype equipment. Cooling of an alumina substrate (75 mm square) mounted with 25 chips (8 mm square) can be cooled up to 200 W in an air flow of 20 m/s. In helium gas convection cooling, the allowable heat dissipation increases to 300 W or more, and fan input power decreases to about one-fifth of that needed for air convection cooling. This cooling capability is equal to that of indirect water cooling.read more
Citations
More filters
Optimal Finned Heat Sinks
TL;DR: In this paper, the authors address the volume costs or space requirements for removing heat with optimally designed finned heat sinks, and provide upper bounds on the thermal resistance of an optimal heat sink, without explicitly designing the part.
Journal ArticleDOI
A new multi-chip module using a copper polyimide multi-layer substrate
TL;DR: In this paper, a multichip module using a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors is discussed, which can transmit high-speed pulses at over 2 Gb/s.
Journal ArticleDOI
Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics
TL;DR: In this article, a method of assessing the overall cooling performance in the thermal design of electronics is presented, based on the optimization concept proposed by A. Bejan, whose original idea was related to the trade-off between heat transfer enhancement and pressure loss increase based on an assessment of entropy generation rate.
Journal ArticleDOI
Compact air-cooled heat sinks for power packages
TL;DR: In this paper, the main findings of a theoretical and experimental work carried out in the development of compact air-cooled heat sinks tailored for spot cooling of power packages are presented.
Journal ArticleDOI
Bibliography of Heat Transfer in Electronic Equipment
V. Antonetti,R. Simons +1 more
TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.
References
More filters
Journal ArticleDOI
Geometric optimization of controlled collapse interconnections
TL;DR: In this paper, the authors deal with the mechanical reliability of controlled collapse joints in modules subjected to the thermal fatigue conditions of machine usage, focusing on design variability and how the shape and dimensions of the joint and chip affect reliability.
Journal ArticleDOI
An analysis of the effect of plate thickness on laminar flow and heat transfer in interrupted-plate passages
Suhas V. Patankar,C. Prakash +1 more
TL;DR: In this article, an analysis of the flow and heat transfer in an interrupted-plate passage, which is an idealization of the offset-fin heat exchanger, is presented, where the plates are considered to be of finite thickness.
Journal ArticleDOI
A conduction-cooled module for high-performance LSI devices
Sevgin Oktay,H. C. Kammerer +1 more
TL;DR: The development and implementation of a novel packaging concept which meets the stringent and highly interactive demands on cooling, reliability, and reworkability of LSI technology, referred to as the thermal conduction module (TCM).
Book ChapterDOI
How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment
TL;DR: In this article, the effects of ambient air density on the weightflow of air delivered by an air moving device to a package requiring cooling are discussed. But the authors focus on the effect of the density of the air on the component temperature.