Patent
Gas-liquid forced turbulence cooling
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TLDR
A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation as mentioned in this paper.Abstract:
A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.read more
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References
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Patent
Forced-convection, liquid-cooled, microchannel heat sinks
TL;DR: A microchannel heat sink as discussed by the authors is used to cool a high power electronic device such as an integrated circuit comprising a plurality of channels in close thermal contact to the integrated circuit and through which a liquid is passed to create either a developing laminar flow or a turbulent flow.
Journal ArticleDOI
Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid
TL;DR: In this paper, an experimental study of boiling heat transfer from a simulated microelectronic component immersed in a stagnant pool of dielectric Fluorinert (FC-72) is presented.
Journal ArticleDOI
Pool Boiling Heat Transfer From Enhanced Surfaces to Dielectric Fluids
P. J. Marto,V. J. Lepere +1 more
TL;DR: In this article, the authors used a 15.8 mm o.d. plain copper tube and three copper enhanced surfaces: a Union Carbide High Flux surface, a Hitachi Thermoexcell-E surface and a Wieland Gewa-T surface.
Patent
Immersion cooled high density electronic assembly
TL;DR: An immersion cooling system for high density electronic assemblies such as computers includes a container holding an inert cooling liquid, and stacks of circuit modules arranged in a generally radial pattern within the container as mentioned in this paper.
Patent
Cooling system having thermally induced circulation
Richard C. Chu,Un-Pah Hwang +1 more
TL;DR: In this paper, the authors describe how a platoon of MODULAR PACKAGED HEAT GENERATING ELECTRONIC COMPONENTS are co-cooled so as to remain within predefined operating temperature limits.