Germanium Based Field-Effect Transistors: Challenges and Opportunities
Patrick S. Goley,Mantu K. Hudait +1 more
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This work reviews the two major remaining challenges that Ge based devices must overcome if they are to replace Si as the channel material, namely, heterogeneous integration of Ge on Si substrates, and developing a suitable gate stack.Abstract:
The performance of strained silicon (Si) as the channel material for today's metal-oxide-semiconductor field-effect transistors may be reaching a plateau. New channel materials with high carrier mobility are being investigated as alternatives and have the potential to unlock an era of ultra-low-power and high-speed microelectronic devices. Chief among these new materials is germanium (Ge). This work reviews the two major remaining challenges that Ge based devices must overcome if they are to replace Si as the channel material, namely, heterogeneous integration of Ge on Si substrates, and developing a suitable gate stack. Next, Ge is compared to compound III-V materials in terms of p-channel device performance to review how it became the first choice for PMOS devices. Different Ge device architectures, including surface channel and quantum well configurations, are reviewed. Finally, state-of-the-art Ge device results and future prospects are also discussed.read more
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High-K materials and metal gates for CMOS applications
John Robertson,Robert M. Wallace +1 more
TL;DR: In this article, a review of the high-K gate stack is presented, including the choice of oxides, their deposition, their structural and metallurgical behaviour, atomic diffusion, interface structure, their electronic structure, band offsets, electronic defects, charge trapping and conduction mechanisms, reliability, mobility degradation and oxygen scavenging.
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Synthesis and Characterization of Hexagonal Boron Nitride as a Gate Dielectric
TL;DR: An interesting coincidence of a critical thickness of 10 nm was identified in both the CVD growth behavior and in the breakdown electric field strength and leakage current mechanism, indicating that the electrical properties of the cVD h-BN film depended significantly on the film growth mode and the resultant film quality.
Journal ArticleDOI
Enabling Energy Efficiency and Polarity Control in Germanium Nanowire Transistors by Individually Gated Nanojunctions
Jens Trommer,Andre Heinzig,Uwe Mühle,Uwe Mühle,Markus Löffler,Annett Winzer,Paul M. Jordan,Jurgen Beister,Tim Baldauf,Marion Geidel,B. Adolphi,Ehrenfried Zschech,Thomas Mikolajick,Walter M. Weber +13 more
TL;DR: Finite-element drift-diffusion simulations reveal that both leakage current suppression and polarity control can also be achieved at highly scaled geometries, providing solutions for future energy-efficient systems.
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Ultra-doped n-type germanium thin films for sensing in the mid-infrared
Slawomir Prucnal,Fang Liu,Matthias Voelskow,Lasse Vines,Lars Rebohle,Denny Lang,Yonder Berencén,Stefan Andric,Roman Boettger,Manfred Helm,Manfred Helm,Shengqiang Zhou,Wolfgang Skorupa +12 more
TL;DR: Ion implantation followed by rear side flash-lamp annealing (r-FLA) is used for the fabrication of heavily doped n-type Ge with high mobility, which enables to exploit the plasmonic properties of Ge for sensing in the mid-infrared spectral range.
Journal ArticleDOI
Bending induced electrical response variations in ultra-thin flexible chips and device modeling
TL;DR: In this paper, the effects of bending on the response of devices on ultra-thin chips in terms of variations in electrical parameters such as mobility, threshold voltage, and device performance (static and dynamic).
References
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BookDOI
Advanced Gate Stacks for High-Mobility Semiconductors
Abstract: Strained-Si CMOS Technology.- High Current Drivability MOSFET Fabricated on Si(110) Surface.- Advanced High-Mobility Semiconductor-on-Insulator Materials.- Passivation and Characterization of Germanium Surfaces.- Interface Engineering for High-? Ge MOSFETs.- Effect of Surface Nitridation on the Electrical Characteristics of Germanium High-?/Metal Gate Metal-Oxide-Semiconductor Devices.- Modeling of Growth of High-? Oxides on Semiconductors.- Physical, Chemical, and Electrical Characterization of High-? Dielectrics on Ge and GaAs.- Point Defects in Stacks of High-? Metal Oxides on Ge: Contrast with the Si Case.- High ? Gate Dielectrics for Compound Semiconductors.- Interface Properties of High-? Dielectrics on Germanium.- A Theoretical View on the Dielectric Properties of Crystalline and Amorphous High-? Materials and Films.- Germanium Nanodevices and Technology.- Opportunities and Challenges of Germanium Channel MOSFETs.- Germanium Deep-Submicron p-FET and n-FET Devices, Fabricated on Germanium-On-Insulator Substrates.- Processing and Characterization of III-V Compound Semiconductor MOSFETs Using Atomic Layer Deposited Gate Dielectrics.- Fabrication of MBE High-? MOSFETs in a Standard CMOS Flow.
Proceedings ArticleDOI
Record I ON /I OFF performance for 65nm Ge pMOSFET and novel Si passivation scheme for improved EOT scalability
Jerome Mitard,B. De Jaeger,Frederik Leys,Geert Hellings,Koen Martens,Geert Eneman,David P. Brunco,Roger Loo,Jing-Cheng Lin,Denis Shamiryan,T. Vandeweyer,Gillis Winderickx,E. Vrancken,C.H. Yu,K. De Meyer,Matty Caymax,Luigi Pantisano,Marc Meuris,M.M. Heyns +18 more
TL;DR: In this paper, a 65 nm Ge pFET with a record performance of Ion = 478muA/mum and Ioff,s= 37nA /mum @Vdd= -1V.
Proceedings ArticleDOI
Understanding mobility mechanisms in extremely scaled HfO 2 (EOT 0.42 nm) using remote interfacial layer scavenging technique and V t -tuning dipoles with gate-first process
Takashi Ando,Martin M. Frank,Kisik Choi,Chang Hwan Choi,John Bruley,Marinus Hopstaken,Matthew Copel,Eduard A. Cartier,Andreas Kerber,Alessandro C. Callegari,Dianne L. Lacey,Stephen L. Brown,Qingyun Yang,Vijay Narayanan +13 more
TL;DR: A novel “remote interfacial layer (IL) scavenging” technique yielding a record-setting equivalent oxide thickness (EOT) of 0.42 nm using a HfO2-based MOSFET high-к gate dielectric is demonstrated.