Glass-bonded Mica—An Ideal Material for PCB

TL;DR: In this paper, an attempt has been made to prepare PCB with glass-bonded material developed at the Institute of Electronics and Information Technology (TEIT), in view of a unique combination of mechanical, thermal and electrical desirability and also for low cost of production.

Abstract: PCB fabric-ations are, at present, limited within varieties of reinforced plastic laminates. In special cases, ceramic substrates of alumina aud beryllia are also used. Glass-bonded mica also holds a good potentiality as a PCB material, especially in view of a unique combination of mechanical, thermal and electrical desirability and also for low cost of production. An attempt has been made to prepare PCB with glass-bonded material developed at the Institute. © 1983 Taylor & Francis Group, LLC.