Journal ArticleDOI
Grain growth behaviour of the Al-Cu eutectic alloy during superplastic deformation
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TLDR
Grain growth behavior of the Al-Cu eutectic alloy was investigated as a function of strain (e), strain rate and deformation temperature (T) over as discussed by the authors, where grain size increases with increase in strain and temperature.Abstract:
Grain growth behaviour of the Al-Cu eutectic alloy was investigated as a function of strain (e), strain rate
$$(\dot \varepsilon )$$
and deformation temperature (T) over
$$\dot \varepsilon $$
= 10−2 s−1 and T=400 to 540°C The grain size increases with increase in strain and temperature Upon deformation to a fixed strain, the grain growth is generally seen to be more at lower strain rates The rates of overall grain growth
$$(\dot d_{\varepsilon ,t} )$$
and due to deformation alone
$$(\dot d_\varepsilon )$$
, however, increase with increasing strain rate according to
$$\dot d_{\varepsilon ,t} \propto \dot \varepsilon ^{086} $$
and
$$\dot d_{\varepsilon ,t} \propto \dot \varepsilon ^{064} $$
, respectively The increase in the grain growth rate with strain rate is attributed primarily to the shorter time involved at higher strain rate for reaching a fixed strain The activation energy for grain growth under superplastic conditions is estimated to be 79 kJ mol−1read more
Citations
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Journal ArticleDOI
Low Temperature Superplasticity and Its Deformation Mechanism in Grain Refinement of Al-Mg Alloy by Multi-Axial Alternative Forging
TL;DR: In this article, the role of grain boundary sliding (GBS), intragranular deformation and the change of microstructure during superplastic deformation have been investigated for ultrafine-grained Al-Mg alloy with a grain size of less than 1 μm using Multi-Axial Alternative Forging (MAF) technique.
Journal ArticleDOI
Development of hardness homogeneity and superplastic behavior in an aluminum–copper eutectic alloy processed by high-pressure torsion
TL;DR: In this paper, an Al-33% Cu eutectic alloy was processed by high pressure torsion (HPT) at a pressure of 6.0 GPa for 1/4 to 10 turns, and tensile tests were conducted at a temperature of 723 K on specimens processed through 5 and 10 turns of HPT.
Journal ArticleDOI
Superplasticity, flow and fracture mechanism in an Al–12.7Si–0.7Mg alloy
TL;DR: In this paper, the superplastic behavior of an Al-12.7mass%Si−0.7 mass%Mg alloy was investigated under different conditions and a maximum elongation to failure of 379% was demonstrated with a strain rate sensitivity, m, of 0.52 and an activation energy for flow, Q, of 156.7 KJ/mol at 793 K at an initial strain rate of 1.67×10 −4 ǫs −1, which is close to the lattice diffusion activation energy of aluminum.
Journal ArticleDOI
Study of dynamic grain growth by electron microscopy and EBSD.
TL;DR: Of a particular interest are results related to behaviour of CuAl2 in superplastic Al‐33wt%Cu during deformation, including several problems with the use of EBSD in this alloy.
Journal ArticleDOI
Effect of hydrogen on high temperature flow behavior of near α-Ti alloy
S.M. Jagadeesh Babu,Bhagwati Prasad Kashyap,Nityanand Prabhu,Rajeev Kapoor,R.N. Singh,J.K. Chakravartty +5 more
TL;DR: In this paper, the effect of hydrogen on high temperature flow behavior of VT20, a near α-Ti alloy, was studied using differential strain rate compression tests, and the results indicated that the deformation mechanism is the grain boundary sliding accommodated by lattice diffusion.
References
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Journal ArticleDOI
Diffusion in migrating interfaces
TL;DR: In this article, the diffusion coefficients of Al atoms in migrating grain boundaries were measured and found to be several orders of magnitude larger than the corresponding coefficients reported for stationary boundaries, suggesting that the diffusion process in migrating interfaces occurs by long range atomic jumps of the diffusing atoms along the boundary (non-localized diffusion).
Journal ArticleDOI
Structural Changes during Superplastic Deformation of the Al–Cu Eutectic Alloy
TL;DR: In this article, microstructural changes that occur during superplastic deformation of the Al-Cu eutectic alloy are considered, and it is shown that considerable modification occurs to the shapes and distribution of the inter-metallic CuAl2 particles during deformation.
Journal ArticleDOI
Rheological and metallurgical discussion of superplastic behaviour
M. Suery,B. Baudelet +1 more
Journal ArticleDOI
Interface diffusion in the Al-CuAl2 eutectic
E. Ho,G.C. Weatherly +1 more
TL;DR: In this paper, the authors measured the rate of migration of a triple junction formed between a sub-boundary in the Al and the lamellar interface and found that the interface diffusion coefficient was 1.1 × 10 3 exp [−(23,300/ RT )] between 350 and 500°C.
Journal ArticleDOI
Grain-Boundary Sliding
R. L. Bell,N. B. W. Thompson +1 more
TL;DR: In this paper, it was shown that when bicrystals are subjected to a constant shear stress parallel to the boundary plane, the grain boundary sliding velocity decreases with time 1−4.
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