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Group IV direct band gap photonics: Methods, Challenges and Opportunities

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TLDR
The concept of direct band gap group IV materials offers a paradigm change for Si-photonics concerning the monolithic implementation of light emitters: the idea is to integrate fully compatible group IV material with equally favorable optical properties as the chemically incompatible group III-V-based systems.
Abstract
The concept of direct band gap group IV materials offers a paradigm change for Si-photonics concerning the monolithic implementation of light emitters: The idea is to integrate fully compatible group IV materials with equally favorable optical properties as the chemically incompatible group III-V-based systems The concept involves either mechanically applied strain on Ge or alloying of Ge with Sn and permits to drastically improve the insufficient radiative efficiency of Ge The favorable optical properties result from a modified band structure transformed from an indirect to a direct one The first demonstration of such a direct band gap laser, accomplished in GeSn, exemplifies the capability of this new concept These systems may permit a qualitative as well as a quantitative expansion of Si-photonics into traditional but also new areas of applications, provided they can be operated energy efficiently, under ambient conditions and integrated with current Si technologies This review aims to discuss the challenges along this path in terms of fabrication, characterization and fundamental understanding, and will elaborate on evoking opportunities of this new class of group IV-based laser materials

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Journal ArticleDOI

Germanium based photonic components toward a full silicon/germanium photonic platform

TL;DR: In this paper, the authors show that optical germanium-on-insulator (GeOI) substrates fabricated by the Smart Cut™ technology is a key feature for future Si-complementary metal oxide Semiconductor (CMOS) compatible laser demonstration.
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Towards monolithic integration of germanium light sources on silicon chips

TL;DR: Germanium (Ge) is a group-IV indirect band gap semiconductor, and therefore bulk Ge cannot emit light efficiently as mentioned in this paper, and significant engineering efforts are being made to convert Ge into an efficient gain material monolithically integrated on a Si chip.
Journal ArticleDOI

Epitaxial Ge0.81Sn0.19 Nanowires for Nanoscale Mid-Infrared Emitters.

TL;DR: Temperature and laser power dependent photoluminescence analyses verify the formation of a direct band gap material with emission in the mid-infrared region and values expected for unstrained Ge0.81Sn0.19 (e.g. band gap of 0.3 eV at room temperature).
Journal ArticleDOI

Accurate strain measurements in highly strained Ge microbridges

TL;DR: In this article, the Raman-strain relation at higher strain using synchrotron-based microdiffraction was established. But, the strain values are commonly deduced from Raman spectroscopy using empirical linear models only established up to 1.2%.
Journal ArticleDOI

Ferroelectric Enhanced Performance of a GeSn/Ge Dual-Nanowire Photodetector.

TL;DR: This work demonstrates a flexible GeSn/Ge dual-nanowire (NW) structure, in which the strain relaxation is achieved by the elastic deformation without introducing defects and the feature dimension is naturally at nanoscale, which suggests the flexible Ge Sn/ Ge dual-NW may open an avenue for Si-compatible optoelectronic circuits operating in the short-wavelength infrared range.
References
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Statistics of the Recombinations of Holes and Electrons

TL;DR: In this article, the statistics of the recombination of holes and electrons in semiconductors were analyzed on the basis of a model in which the recombinations occurred through the mechanism of trapping.
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Device Requirements for Optical Interconnects to Silicon Chips

TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
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Band structure, deformation potentials, and carrier mobility in strained Si, Ge, and SiGe alloys

TL;DR: In this article, the authors compute the band structure and shear deformation potentials of strained Si, Ge, and SiGe alloys, and fit the theoretical results to experimental data on the phonon-limited carrier mobilities in bulk Si and Ge.
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Mid-infrared photonics in silicon and germanium

TL;DR: In this article, the authors proposed a method to extend group IV photonics from near-infrared to midinfrared wavelengths using on-chip CMOS optoelectronic systems for use in spectroscopy, chemical and biological sensing, and free space communications.
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High-performance Ge-on-Si photodetectors

TL;DR: In this article, the authors summarized the major developments in Ge-on-Si photodetectors, including epitaxial growth and strain engineering, free-space and waveguide-integrated devices, as well as recent progress in Geon-On-Si avalanche photodets.
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