Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging
TL;DR: In this paper, the authors describe the feasibility of a cooling system with miniature heat pipes embedded in a direct bonded copper (DBC) structure, which eliminates the existence of a thermal interface between the device and the cooling system.
Abstract: Thermal dissipation in power electronics systems is becoming an extremely important issue with the continuous growth of power density in their components. The primary cause of failure in this equipment is excessive temperatures in the critical components, such as semiconductors and transformers. This problem is particularly important in power electronic systems for space applications. These systems are usually housed in completely sealed enclosures for safety reasons. The effective management of heat removal from a sealed enclosure poses a major thermal-design challenge since the cooling of these systems primarily rely on natural convection. In this context, the presented paper treats the heat pipes as effective heat transfer devices that can be used to raise the thermal conductive path in order to spread a concentrated heat source over a larger surface area. As a result, the high heat flux at the heat source can be reduced to a smaller and manageable level that can be dissipated through conventional cooling methods. The objective of our work is to describe the feasibility of a cooling system with miniature heat pipes embedded in a direct bonded copper (DBC) structure. The advantage of this type of heat pipe is the possibility for implementation of the component layout on the heat pipe itself, which eliminates the existence of a thermal interface between the device and the cooling system
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TL;DR: A quick and efficient evaluation judgment for the thermal management of the IGBTs depended on the requirements on the junction-to-case thermal resistance and equivalent heat transfer coefficient of the test samples is proposed.
Abstract: As an increasing attention towards sustainable development of energy and environment, the power electronics (PEs) are gaining more and more attraction on various energy systems. The insulated gate bipolar transistor (IGBT), as one of the PEs with numerous advantages and potentials for development of higher voltage and current ratings, has been used in a board range of applications. However, the continuing miniaturization and rapid increasing power ratings of IGBTs have remarkable high heat flux, which requires complex thermal management. In this paper, studies of the thermal management on IGBTs are generally reviewed including analyzing, comparing, and classifying the results originating from these researches. The thermal models to accurately calculate the dynamic heat dissipation are divided into analytical models, numerical models, and thermal network models, respectively. The thermal resistances of current IGBT modules are also studied. According to the current products on a number of IGBTs, we observe that the junction-to-case thermal resistance generally decreases inversely in terms of the total thermal power. In addition, the cooling solutions of IGBTs are reviewed and the performance of the various solutions are studied and compared. At last, we have proposed a quick and efficient evaluation judgment for the thermal management of the IGBTs depended on the requirements on the junction-to-case thermal resistance and equivalent heat transfer coefficient of the test samples.
171 citations
TL;DR: In this paper, the performance of a heat pipe using silver nanoparticles dispersed in DI (De-Ionized) water has been investigated for removing heat from power transistors in electronics and processors in computers.
95 citations
TL;DR: In this paper, only passive thermal solutions used on LED module will be studied and new thermal interface materials and passive thermal solution applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module.
Abstract: Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module.
64 citations
TL;DR: In this article, a liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated, where GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used.
Abstract: Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.
58 citations
TL;DR: In this paper, a two-phase closed thermosiphon (TPCT) with a thin, porous copper coating is compared with an uncoated TPCT, and the effects of the inclination angle, power input and thin copper coating on the performance of the TPCTs are explored.
48 citations
References
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01 Mar 1995
TL;DR: In this article, the authors present a detailed analysis of non-conventional heat pipe properties, including variable conductance heat pipes, and their properties in terms of heat transfer and mass transfer.
Abstract: Preface Nomenclature 1.Introduction 2.Solid-Liquid-Vapor Phenomena, Driving Forces and Interfacial Heat and Mass Transfer 3.Steady Hydrodynamic and Thermal Characteristics 4.Heat Transfer Limitations 5.Continuum Transient and Frozen Startup Behavior of Heat Pipes 6.Two-Phase Closed Thermosyphons 7.Rotating and Revolving Heat Pipes 8.Variable Conductance Heat Pipes 9.Capillary Pumped Loop and Loop Heat Pipe Systems 10.Micro/Miniature Heat Pipe Characteristics and Operating Limitations 11.Heat Pipe Heat Exchangers 12.Analysis of Nonconventional Heat Pipes 13.Special Effects on Heat Pipes 14.Heat Pipe Fabrication, Processing, and Testing Appendix A:Thermophysical Properties Appedix B:Experimental Heat Pipe Results Index
1,516 citations
"Heat Pipe Integrated in Direct Bond..." refers background in this paper
...The length of the heat pipe is divided into three parts: evaporator, adiabatic section, and condenser [3]–[5]....
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TL;DR: In this article, micro heat pipes and spreaders are integrated within the low temperature cofire ceramic (LTCC) substrate for spreading heat in both radial and axial directions, achieving power densities in excess of 300 W/cm/sup 2/C.
Abstract: With projected power densities above 100 W/cm/sup 2/ for devices, new methods for thermal management from the heat generation at the die to heat removal to the ambient must be addressed. By integrating micro heat pipes directly within the ceramic substrate, effective thermal conductivity for spreading heat in both radial and axial directions was achieved. New materials and processes were developed to fabricate the unique components required to handle high thermal loads. Enhanced thermal vias to minimize the thermal impedance through the ceramic in the evaporator and condenser sections were developed, increasing the effective thermal conductivity from 2.63 to near 250 W/m-/spl deg/C. The use of an organic insert fabricated into the desired complex shape using rapid prototyping methods, coupled with the viscoelastic flow of the low temperature cofire ceramic (LTCC) during lamination, allowed complex shapes to be developed while ensuring uniform green tape density during lamination prior to tape firing. Large cavities, three-dimensional fine structures and porous wicks for capillary 3-D flow have been utilized to fabricate the heat pipes. Heat pipes and spreaders, utilizing water as the working fluid, have been demonstrated operating with power densities in excess of 300 W/cm/sup 2/.
53 citations
"Heat Pipe Integrated in Direct Bond..." refers background in this paper
...present a heat pipe prototype fabricated with ceramic materials [6], [7]....
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31 Aug 1998
TL;DR: In this paper, the 3D MCI cooler is used to measure heat dissipation and flow rates of a 3D DBC substrate, which is an ideal solution for very high power applications.
Abstract: Between two insulating DBC substrates (Al/sub 2/O/sub 3/ or AlN) there are structured copper foils bonded together by DBC technology, to build a three dimensional system of micro channels The large internal surface of the highly conductive copper allows an extremely efficient cooling of the DBC substrates The DBC layout is customer specified and both DBCs are mounted to the top and the bottom of the water cooler This compact cooling system designed to the customer's requirements gives four times the system offered efficient cooling of conventional module assemblies with liquid cooling Due to the low weight and the relatively small dimensions the water cooled DBC substrate is an ideal solution for very high power applications In detail we describe the following items: (i) the 3D MCI cooler; (ii) water for cooling; measurement of heat dissipation and flow rates; (iii) results of water flow measurement; and (iv) results of thermal dissipation measurement
13 citations
"Heat Pipe Integrated in Direct Bond..." refers background in this paper
...DBC [1], [2] consists of a ceramic isolator, Al O (alumina) or aluminium–nitride (AlN), onto which solid copper is bonded in a high temperature melting/diffusion process (Fig....
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