High performance polyimides for applications in microelectronics and flat panel displays
TL;DR: In this article, a review of the recent research progresses in characterizing polyimides and their precursors and in developing low dielectric constant, light-emitting, and liquid crystal alignment layer PIs is presented.
Abstract: Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical resistance properties due to their heterocyclic imide rings and aromatic rings on the backbone. Due to these advantageous properties, PIs have found diverse applications in industry. Most PIs are insoluble because of the nature of the high chemical resistance. Thus, they are generally used as a soluble precursor polymer, which forms complexes with solvent molecules, and then finally converts to the corresponding polyimides via imidization reaction. This complexation with solvent has caused severe difficulty in the characterization of the precursor polymers. However, significant progress has recently been made on the detailed characterization of PI precursors and their imidization reaction. On the other hand, much research effort has been exerted to reduce the dielectric constant of PIs, as demanded in the microelectronics industry, through chemical modifications, as well as to develop high performance, light-emitting PIs and liquid crystal (LC) alignment layer PIs with both rubbing and rubbing-free processibility, which are desired in the flat-panel display industry. This article reviews this recent research progresses in characterizing PIs and their precursors and in developing low dielectric constant, light-emitting, and LC alignment layer PIs.
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TL;DR: Aromatic polyimides (PIs) are high-performance polymers with rigid heterocyclic imide rings and aromatic benzene rings in their macromolecular backbones as mentioned in this paper.
292 citations
TL;DR: In this paper, the recent research process in synthesizing fully aliphatic polyimides, with improved dimensional stability, high transparency and low e values, as well as the characterizations and future scope for their application in micro electric and photo-electronic industries, is reviewed.
Abstract: Polyimides are one of the most important classes of polymers used in the microelectronics and photoelectronics industries. Because of their high thermal stability, chemical resistance, and good mechanical and electric properties, polyimides are often applied in photoresists, passivation and dielectric films, soft print circuit boards, and alignment films within displays. Recently, fully aliphatic and alicyclic polyimides have found applications as optoelectronics and inter layer dielectric materials, due to their good transparencies and low dielectric constants (e). The low molecular density, polarity and rare probability of forming inter- or intra-molecular charge transfers, resulting in lowering of the dielectric constant and high transparency, are the most striking characteristics of aliphatic polyimide. However, the ultimate end use of polyimides derived from aliphatic monomers is in their targeted applications that need less stringent thermal requirements. Much research effort has been exerted in the development of aliphatic polyimide with increased thermal and mechanical stabilities, while maintaining their transparencies and low dielectric constants, by the incorporation of rigid moieties. In this article, the recent research process in synthesizing fully aliphatic polyimides, with improved dimensional stability, high transparency and low e values, as well as the characterizations and future scope for their application in micro electric and photo-electronic industries, is reviewed.
190 citations
TL;DR: A brief overview of recent progress in PI-based dielectrics for organic electronic devices and circuits is provided and an outlook of future research directions and challenges for polyimide dielectric materials is presented.
Abstract: Polymeric dielectrics play a key role in the realization of flexible organic electronics, especially for the fabrication of scalable device arrays and integrated circuits. Among a wide variety of polymeric dielectric materials, aromatic polyimides (PIs) are flexible, lightweight, and strongly resistant to high-temperature processing and corrosive etchants and, therefore, have become promising candidates as gate dielectrics with good feasibility in manufacturing organic electronic devices. More significantly, the characteristics of PIs can be conveniently modulated by the design of their chemical structures. Herein, from the perspective of structure optimization and interface engineering, a brief overview of recent progress in PI-based dielectrics for organic electronic devices and circuits is provided. Also, an outlook of future research directions and challenges for polyimide dielectric materials is presented.
156 citations
TL;DR: A series of thermally stable aromatic polyimides were synthesized using commercially available five and six-membered ring anhydrides and 2,6-diaminotriptycene derivatives as mentioned in this paper.
Abstract: A series of soluble, thermally stable aromatic polyimides were synthesized using commercially available five- and six-membered ring anhydrides and 2,6-diaminotriptycene derivatives. All of these triptycene polyimides (TPIs) were soluble in common organic solvents despite their completely aromatic structure due to the three-dimensional triptycene structure that prevents strong interchain interactions. Low solution viscosities (0.07−0.47 dL/g) and versatile solubilities allow for easy solution processing of these polymers. Nanoporosity in the solid state gives rise to high surface areas (up to 430 m2/g) and low refractive indices (1.19−1.79 at 633 nm), which suggest very low dielectric constants at optical frequencies. Polymer films were found to be amorphous. The decomposition temperature (Td) for all of the polymers is above 500 °C, and no glass transition temperatures can be found below 450 °C by differential scanning calorimetry (DSC), indicating excellent prospects for high-temperature applications. Th...
151 citations
TL;DR: In this article, a series of low-dielectric constant polyimide (PI) composite films containing SBA-15 or SBA16 type mesoporous silica were successfully prepared via in situ polymerization and following thermal imidization.
127 citations
References
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Book•
01 Jan 1964
TL;DR: Theoretical analysis of molecular vibrational and rotational spectra has been studied in this paper, with a focus on the Vibrational Origin of Group Frequencies (VIB).
Abstract: Vibrational and Rotational Spectra. IR Experimental Considerations. Molecular Symmetry. The Vibrational Origin of Group Frequencies. Methyl and Methylene Groups. Triple Bonds and Cumulated Double Bonds. Olefin Groups. Aromatic and Heteroaromatic Rings. Carbonyl Compounds. Ethers, Alcohols, and Phenols. Amines, C=N, and N=O Compounds. Compounds Conking Boron, Silicon, Phosphorus, Sulfur, or Halogen. Major Spectra-Structure Correlations by Spectral Regions. The Theoretical Analysis of Molecular Vibrations.
5,173 citations
TL;DR: A new exciting interdisciplinary research field has evolved following the discovery that conjugated polymers can emit light when put into light-emitting diodes.
Abstract: A new exciting interdisciplinary research field has evolved following the discovery that conjugated polymers can emit light when put into light-emitting diodes. A myriad of light-emitting polymers (examples of which are shown below) shining in various colors have been developed through chemical intuition and structural design.
3,015 citations
1,856 citations
Book•
23 Jul 1996TL;DR: The history of the development of polyimides can be found in this article, where the authors describe the development and development of the Polyimides, the synthesis and synthesis of polyamideimides and their application in high-performance electronics Packaging and Optoelectronic Applications.
Abstract: "Introduction History of the Invention and Development of the Polyimides, C. E. Sroog Synthesis Synthesis of Polyimides, Tohru Takekoshi Synthesis of Polyamideimides, Yoshio Imai Synthesis of Fluorinated Polyimides, Shigekuni Sasaki and Shiro Nishi Photosensitive Polyimides, Molecular Design and Synthesis, Toshihiko Omote Chemistry and Kinetics of Polyimide Formation, James M. Sonnett and Thomas P. Gannett Vapor Phase Deposition of Polyimides, Thomas Strunskus and Michael Grunze Bulk Properties and Modifications Thermal Curing in Polyimide Films and Coatings, John C. Coburn and Michael T. Pottinger Infrared Curing of Polyimides, John G. Stephanie and Paul G. Rickerl Sorption and Diffusion of Water Vapor in Polyimide Films, Ken-ichi Okamoto Charge Transfer in Aromatic Polyimides, Joseph M. Salley and Curtis W. Frank Dielectric Properties of Polyimides and Factors Influencing Such Properties, Ressano De Souza-Machado, Shien-Yang Wu, and Denice D. Denton Degradation and Stability of Polyimides, James A. Cella Surface Characterization, Modification, and Adhesion Aspects Surface Characterization of Polyimides, Fabio Garbassi, Marco Morra, and Ernesto Occhiello Plasma Surface Modification and Etching of Polyimides, Frank D. Egitto and Luis J. Matienzo Laser Ablation of Polyimides, George H. Pettit Ion Beam Modification of Polyimides, Eal H. Lee Wet Chemical Modification of Polyimide Surfaces: Chemistry and Application, Kang-Wook Lee and Alfred Viehbeck Tribological Behavior of Polyimides, U.S. Tewari and J. Bijwe Adhesion of Polyimides to Various Substrates, L. Paivikki Buchwalter Adhesion of Metal Films to Polyimides, Luis J. Matienzo and William N. Unertl Applications Polyimides for Gas Separation, Michael Langsam Applications of Polyimides as Photosensitive Materials, Jean-Marc Bureau and Jean-Paul Droguet Polyimides in High-Performance Electronics Packaging and Optoelectronic Applications, Claudius Feger and Hilmar Franke Polyimides as Langmuir-Blodgett Films, Mitsumasa Iwamoto and Masa-aki Kakimoto "
1,418 citations
1,326 citations