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Journal ArticleDOI

Influence of 60-MeV Proton-Irradiation on Standard and Strained n- and p-Channel MuGFETs

TL;DR: In this paper, the effect of proton irradiation on MOSFETs performance was investigated through basic and analog parameters considering four different splits, i.e., unstrained, uniaxial, bao-linear, uni-expansions, and u-dual.
Abstract: In this work the proton irradiation influence on Multiple Gate MOSFETs (MuGFETs) performance is investigated. This analysis was performed through basic and analog parameters considering four different splits (unstrained, uniaxial, biaxial, uniaxial+biaxial). Although the influence of radiation is more pronounced for p-channel devices, in pMuGFETs devices, the radiation promotes a higher immunity to the back interface conduction resulting in the analog performance improvement. On the other hand, the proton irradiation results in a degradation of the post-irradiated n-channel transistors behavior. The unit gain frequency showed to be strongly dependent on stress efficiency and the radiation results in an increase of the unit gain frequency for splits with high stress effectiveness for both cases p- and nMuGFETs.
Citations
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Proceedings ArticleDOI
02 Dec 2013
TL;DR: In this paper, the potential of ultra-thin body and buried oxide (UTBB) technologies for digital, analog, and memory applications is discussed, with the focus on low frequency noise and radiation hardness aspects.
Abstract: UTBB (ultra-thin body and ultra-thin buried oxide) technologies are highly competitive for scaled technologies down to the 14 nm range. This paper reviews their potential for digital, analog and memory applications. Attention is also given to low frequency noise and radiation hardness aspects.

6 citations


Cites result from "Influence of 60-MeV Proton-Irradiat..."

  • ...Similar as for FinFETs [28], the radiation degrades the DIBL in UTBB devices with longer channel lengths....

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Proceedings ArticleDOI
01 Jan 2016
TL;DR: In this paper, the effect of proton radiation and strain on the zero temperature coefficient (ZTC) in SOI nFinFETs was studied. But the authors focused on the impact of the VZTC bias point on the performance of the FET.
Abstract: This paper presents for the first time the study of proton radiation and strain influence on the Zero Temperature Coefficient (ZTC) in SOI nFinFETs based on experimental data and simple analytical model. The strain improves the mobility and consequently the transconductance (gm) and reduces the threshold voltage (VTH) due to the bandgap reduction. Proton radiation degrades gm and decreases VTH mainly for wider fins. We observed experimentally that both parameters (gm and VTH) influence the ZTC bias point, which is also supported by the ZTC analytical model. The VTH influences directly the VZTC in amplitude and the radiation the gm temperature degradation factor (c), consequently leading to undesired changes of VZTC with temperature.

3 citations


Cites background from "Influence of 60-MeV Proton-Irradiat..."

  • ...Depending on their energy the radiation particles travel deep through the devices, thereby changing the devices characteristics due the generation of charges in the silicon oxide or interface traps [5-6]....

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Journal ArticleDOI
TL;DR: In this article, the total ionizing dose degradation of 600 keV proton-irradiated silicon triple gate SOI tunnel FETs (TFETs) with SOI FinFETs fabricated with the same structure on the same wafer was compared.
Abstract: This paper compares, for the first time, the total ionizing dose degradation of 600 keV proton-irradiated silicon triple gate SOI tunnel FETs (TFETs) with SOI FinFETs fabricated with the same structure on the same wafer. This work is based on electrical measurements and TCAD simulations. Devices with different dimensions were exposed up to 10 Mrad(Si) dose of proton radiation. For transistors with narrow fin width, the radiation influence is negligible in both devices types. For WFIN = 250 nm and a proton radiation dose up to 10 Mrad(Si), on the other hand, a severe influence is observed in nFinFETs and pFinFETs present on the same die as the p-type TFETs. In the TFETs, no marked influence is observed. Only for a TFET of WFIN = 500 nm and 10 Mrad(Si) one can observe some radiation influence. The main degradation is caused by the buried oxide positive fixed charges and the interface traps which was also confirmed by TCAD simulations. The tunneling current of Tunnel-FETs presents a much better radiation hardness compared to the drift-diffusion current of SOI FinFETs.

3 citations

Proceedings ArticleDOI
01 Jan 2016
TL;DR: In this article, the authors study the effect of proton radiation on SOI analog parameters based on the device inversion coefficient (IC) and define an optimal analog condition by basing the analysis on the inversion coefficients, even considering the radiation impact.
Abstract: This paper studies the proton radiation influence on SOI FinFET analog parameters based on the device inversion coefficient (IC). The analysis focuses on some figures of merit in analog design like the transistor efficiency, the unity gain frequency and the intrinsic voltage gain. Although the proton radiation affects the device performance, it is possible to define an optimal analog condition by basing the analysis on the inversion coefficient, even considering the radiation impact. N-channel devices are affected in a different manner when compared to p-channel counterparts, which can be decisive depending on the application.

2 citations

Journal ArticleDOI
TL;DR: In this paper, the influence of proton-irradiation in the voltage gain of two-stage operational transconductance amplifier (OTA) designed with silicon-on-insulator (SOI) fin field effect transistors (FinFETs) is studied.
Abstract: In this work, the influence of proton-irradiation in the voltage gain of two-stage operational transconductance amplifier (OTA) designed with silicon-on-insulator (SOI) fin field effect transistors (FinFETs) is studied. The OTA simulations were performed using Verilog-A approach based on experimental data extracted from the SOI FinFET electrical characterization, before and after proton-irradiation. The OTA is designed with SOI FinFETs of fin widths (W fin) of 20 nm, 120 nm, and 870 nm, all in the same predefined inversion region (g m/I D = 8 V−1). All evaluated OTA circuits exposed to proton-irradiation presented a voltage gain increase (compared with pre-irradiation circuits), of 0.87 dB, 1.19 dB, and 6.16 dB for fin widths of 20 nm, 120 nm, and 870 nm, respectively. The results show that despite the typical radiation effect of degradation of the individual transistors (it being more severe for larger fin width SOI FinFET), these effects combined in OTA circuits result in an unexpected improvement in DC voltage gain, especially for wider fins. Focusing on the fin width impact on the OTA voltage gain, before and after proton-irradiation, it is much greater for narrow fin width SOI FinFET thanks to the better Early voltage.

2 citations


Cites background or result from "Influence of 60-MeV Proton-Irradiat..."

  • ...Although previous works have already analyzed the protonirradiation and its influence on analog figures-of-merit for the same devices [5, 15], this work proposes the analysis of the influence of the proton-irradiation on the voltage gain of an operational transconductance amplifier (OTA), where the OTA is designed using detailed experimental data extracted...

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  • ...Regarding the proton irradiation, it is noticeable that the SS of the devices is affected, as already suggested in previous works [5, 17]....

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  • ...For all studied devices, the radiation influence on gate oxide can be disregarded due to its small thickness [5]....

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  • ...Other studies that used the same irradiated devices can be found in [5, 15, 17]....

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References
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Book
31 Mar 1991
TL;DR: In this paper, the authors present a set of techniques for defect detection in SOI materials, including the following: 2.1.1 Silicon-on-Zirconia (SOZ), 2.2.2 E-beam recrystallization, 2.3.3, 3.4.4, and 3.5.5 Other defect assessment techniques.
Abstract: 1 Introduction.- 2 SOI Materials.- 2.1 Introduction.- 2.2 Heteroepitaxial techniques.- 2.2.1 Silicon-on-Sapphire (SOS).- 2.2.2 Other heteroepitaxial SOI materials.- 2.2.2.1 Silicon-on-Zirconia (SOZ).- 2.2.2.2 Silicon-on-Spinel.- 2.2.2.3 Silicon on Calcium Fluoride.- 2.3 Dielectric Isolation (DI).- 2.4 Polysilicon melting and recrystallization.- 2.4.1 Laser recrystallization.- 2.4.2 E-beam recrystallization.- 2.4.3 Zone-melting recrystallization.- 2.5 Homoepitaxial techniques.- 2.5.1 Epitaxial lateral overgrowth.- 2.5.2 Lateral solid-phase epitaxy.- 2.6 FIPOS.- 2.7 Ion beam synthesis of a buried insulator.- 2.7.1 Separation by implanted oxygen (SIMOX).- 2.7.1.1 "Standard"SIMOX.- 2.7.1.2 Low-dose SIMOX.- 2.7.1.3 ITOX.- 2.7.1.4 SMOXMLD.- 2.7.1.5 Related techniques.- 2.7.1.6 Material quality.- 2.7.2 Separation by implanted nitrogen (SIMNI).- 2.7.3 Separation by implanted oxygen and nitrogen (SIMON).- 2.7.4 Separation by implanted Carbon.- 2.8 Wafer Bonding and Etch Back (BESOI).- 2.8.1 Hydrophilic wafer bonding.- 2.8.2 Etch back.- 2.9 Layer transfer techniques.- 2.9.1 Smart-Cut(R).- 2.9.1.1 Hydrogen / rare gas implantation.- 2.9.1.2 Bonding to a stiffener.- 2.9.1.3 Annealing.- 2.9.1.4 Splitting.- 2.9.1.5 Further developments.- 2.9.2 Eltran(R).- 2.9.2.1 Porous silicon formation.- 2.9.2.2 The original Eltran(R) process.- 2.9.2.3 Second-generation Eltran(R) process.- 2.9.3 Transferred layer material quality.- 2.10 Strained silicon on insulator (SSOI).- 2.11 Silicon on diamond.- 2.12 Silicon-on-nothing (SON).- 3 SOI Materials Characterization.- 3.1 Introduction.- 3.2 Film thickness measurement.- 3.2.1 Spectroscopic reflectometry.- 3.2.2 Spectroscopic ellipsometry.- 3.2.3 Electrical thickness measurement.- 3.3 Crystal quality.- 3.3.1 Crystal orientation.- 3.3.2 Degree of crystallinity.- 3.3.3 Defects in the silicon film.- 3.3.3.1 Most common defects.- 3.3.3.2 Chemical decoration of defects.- 3.3.3.3 Detection of defects by light scattering.- 3.3.3.4 Other defect assessment techniques.- 3.3.3.5 Stress in the silicon film.- 3.3.4 Defects in the buried oxide.- 3.3.5 Bond quality and bonding energy.- 3.4 Carrier lifetime.- 3.4.1 Surface Photovoltage.- 3.4.2 Photoluminescence.- 3.4.3 Measurements on MOS transistors.- 3.4.3.1 Accumulation-mode transistor.- 3.4.3.2 Inversion-mode transistor.- 3.4.3.3 Bipolar effect.- 3.5 Silicon/Insulator interfaces.- 3.5.1 Capacitance measurements.- 3.5.2 Charge pumping.- 3.5.3 ?-MOSFET.- 4 SOI CMOS Technology.- 4.1 SOI CMOS processing.- 4.1.1 Fabrication yield and fabrication cost.- 4.2 Field isolation.- 4.2.1 LOCOS.- 4.2.2 Mesa isolation.- 4.2.3 Shallow trench isolation.- 4.2.4 Narrow-channel effects.- 4.3 Channel doping profile.- 4.4 Source and drain engineering.- 4.4.1 Silicide source and drain.- 4.4.2 Elevated source and drain.- 4.4.3 Tungsten clad.- 4.4.4 Schottky source and drain.- 4.5 Gate stack.- 4.5.1 Gate material.- 4.5.2 Gate dielectric.- 4.5.3 Gate etch.- 4.6 SOI MOSFET layout.- 4.6.1 Body contact.- 4.7 SOI-bulk CMOS design comparison.- 4.8 ESD protection.- 5 The SOI MOSFET.- 5.1 Capacitances.- 5.1.1 Source and drain capacitance.- 5.1.2 Gate capacitance.- 5.2 Fully and partially depleted devices.- 5.3 Threshold voltage.- 5.3.1 Body effect.- 5.3.2 Short-channel effects.- 5.4 Current-voltage characteristics.- 5.4.1 Lim & Fossum model.- 5.4.2 C?-continuous model.- 5.5 Transconductance.- 5.5.1 gm/ID ratio.- 5.5.2 Mobility.- 5.6 Basic parameter extraction.- 5.6.1 Threshold voltage and mobility.- 5.6.2 Source and drain resistance.- 5.7 Subthreshold slope.- 5.8 Ultra-thin SOI MOSFETs.- 5.8.1 Threshold voltage.- 5.8.2 Mobility.- 5.9 Impact ionization and high-field effects.- 5.9.1 Kink effect.- 5.9.2 Hot-carrier degradation.- 5.10 Floating-body and parasitic BJT effects.- 5.10.1 Anomalous subthreshold slope.- 5.10.2 Reduced drain breakdown voltage.- 5.10.3 Other floating-body effects.- 5.11 Self heating.- 5.12 Accumulation-mode MOSFET.- 5.12.1 I-V characteristics.- 5.12.2 Subthreshold slope.- 5.13 Unified body-effect representation.- 5.14 RF MOSFETs.- 5.15 CAD models for SOI MOSFETs.- 6 Other SOI Devices.- 6.1 Multiple-gate SOI MOSFETs.- 6.1.1 Multiple-gate SOI MOSFET structures.- 6.1.1.1 Double-gate SOI MOSFETs.- 6.1.1.2 Triple-gate SOI MOSFETs.- 6.1.1.3 Surrounding-gate SOI MOSFETs.- 6.1.1.4 Triple-plus gate SOI MOSFETs..- 6.1.2 Device characteristics.- 6.1.2.1 Current drive.- 6.1.2.2 Short-channel effects.- 6.1.2.3 Threshold voltage.- 6.1.2.4 Volume inversion.- 6.1.2.5 Mobility.- 6.2 MTCMOS/DTMOS.- 6.3 High-voltage devices.- 6.3.1 VDMOS and LDMOS.- 6.3.2 Other high-voltage devices.- 6.4 Junction Field-Effect Transistor.- 6.5 Lubistor.- 6.6 Bipolar junction transistors.- 6.7 Photodiodes.- 6.8 G4 FET.- 6.9 Quantum-effect devices.- 7 The SOI MOSFET in a Harsh Environment.- 7.1 Ionizing radiations.- 7.1.1 Single-event phenomena.- 7.1.2 Total dose effects.- 7.1.3 Dose-rate effects.- 7.2 High-temperature operation.- 7.2.1 Leakage current.- 7.2.2 Threshold voltage.- 7.2.3 Output conductance.- 7.2.4 Subthreshold slope.- 8 SOI Circuits.- 8.1 Introduction.- 8.2 Mainstream CMOS applications.- 8.2.1 Digital circuits.- 8.2.2 Low-voltage, low-power digital circuits.- 8.2.3 Memory circuits.- 8.2.3.1 Non volatile memory devices.- 8.2.3.2 Capacitorless DRAM.- 8.2.4 Analog circuits.- 8.2.5 Mixed-mode circuits.- 8.3 Niche applications.- 8.3.1 High-temperature circuits.- 8.3.2 Radiation-hardened circuits.- 8.3.3 Smart-power circuits.- 8.4 Three-dimensional integration.

1,627 citations


"Influence of 60-MeV Proton-Irradiat..." refers background in this paper

  • ...S ILICON-on-Insulator (SOI) CMOS technology has demonstrated a significant improvement over bulk counterparts for operating in radiation-harsh environments due to the buried oxide that isolates the transistor active area from the substrate [1]–[3]....

    [...]

Journal ArticleDOI
TL;DR: In this article, the charge coupling between the front and back gates of thin-film silicon-on-insulator (SOI) MOSFETs is analyzed, and closed-form expressions for the threshold voltage under all possible steady-state conditions are derived.
Abstract: The charge coupling between the front and back gates of thin-film silicon-on-insulator (SOI: e.g,, recrystallized Si on SiO 2 ) MOSFET's is analyzed, and closed-form expressions for the threshold voltage under all possible steady-state conditions are derived. The expressions clearly show the dependence of the linear-region channel conductance on the back-gate bias and on the device parameters, including those of the back silicon-insulator interface. The analysis is supported by current-voltage measurements of laser-recrystallized SOI MOSFET's. The results suggest how the back-gate bias may be used to optimize the performance of the SOI MOSFET in particular applications.

662 citations


"Influence of 60-MeV Proton-Irradiat..." refers background in this paper

  • ...The charges in the buried oxide affect the front gate characteristics due to the coupling between the front and back interfaces [4]....

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Journal ArticleDOI
TL;DR: In this paper, a detailed theoretical model for the physics of strain effects in bulk semiconductors and surface Si, Ge, and III-V channel metal-oxide-semiconductor field effect transistors is presented.
Abstract: A detailed theoretical picture is given for the physics of strain effects in bulk semiconductors and surface Si, Ge, and III–V channel metal-oxide-semiconductor field-effect transistors. For the technologically important in-plane biaxial and longitudinal uniaxial stress, changes in energy band splitting and warping, effective mass, and scattering are investigated by symmetry, tight-binding, and k⋅p methods. The results show both types of stress split the Si conduction band while only longitudinal uniaxial stress along ⟨110⟩ splits the Ge conduction band. The longitudinal uniaxial stress warps the conduction band in all semiconductors. The physics of the strain altered valence bands for Si, Ge, and III–V semiconductors are shown to be similar although the strain enhancement of hole mobility is largest for longitudinal uniaxial compression in ⟨110⟩ channel devices and channel materials with substantial differences between heavy and light hole masses such as Ge and GaAs. Furthermore, for all these materials,...

467 citations


"Influence of 60-MeV Proton-Irradiat..." refers methods in this paper

  • ...For pMOS devices, a compressive stress is applied since this type of stress results in a hole mobility increase by modifying the silicon valence band structure [13]....

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Book
21 Aug 2002
TL;DR: In this paper, the basic radiation damage mechanism in Semiconductor Materials and Devices and Displacement Damage in Group IV and Group III Semiconductors are discussed. And GaAs Based Field Effect Transistors for Radiation-Hard Applications.
Abstract: Radiation Environments and Component Selection Strategy.- Basic Radiation Damage Mechanisms in Semiconductor Materials and Devices.- Displacement Damage in Group IV Semiconductor Materials.- Radiation Damage in GaAs.- Space Radiation Aspects of Silicon Bipolar Technologies.- Radiation Damage in Silicon MOS Devices.- GaAs Based Field Effect Transistors for Radiation-Hard Applications.- Opto-Electronic Components for Space.- Advanced Semiconductor Materials and Devices - Outlook.

375 citations


"Influence of 60-MeV Proton-Irradiat..." refers background in this paper

  • ...S ILICON-on-Insulator (SOI) CMOS technology has demonstrated a significant improvement over bulk counterparts for operating in radiation-harsh environments due to the buried oxide that isolates the transistor active area from the substrate [1]–[3]....

    [...]

Journal ArticleDOI
TL;DR: The dependence of the subthreshold-swing degradation on fin width is reported for irradiated 100-nm-gate-length, fully depleted n-channel FinFETs in this paper.
Abstract: The dependence of the subthreshold-swing (SS) degradation on fin width is reported for irradiated 100-nm-gate- length, fully depleted n -channel FinFETs. The wider the fin is, the greater the radiation-induced SS degradation. The higher tolerance to radiation-induced charge for the narrower FinFETs is attributed to the additional lateral gate control over the body potential. The irradiation and room temperature annealing results suggest that the SS increase for wider FinFETs is due primarily to nonuniform trapped charge in the buried oxide (BOX). The subthreshold characteristics of FinFETs with two fins are more likely to exhibit a nonuniform subthreshold slope (NUSS), resulting from fin-to-fin variability, than FinFETs with 20 fins, where the corresponding Id -V gs curve is the composite of the 20 individual Id-V gs curves.

82 citations


"Influence of 60-MeV Proton-Irradiat..." refers background in this paper

  • ...Previous work [14] already reported the influence of the back oxide charges on the SS behavior....

    [...]