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Interdigital sensors and transducers

08 Nov 2004-Vol. 92, Iss: 5, pp 808-845
TL;DR: Capacitive, inductive, dielectric, piezoacoustic, chemical, biological, and microelectromechanical interdigital sensors and transducers are brought under one umbrella to discuss fabrication techniques, modeling of sensor parameters, application examples, and directions of future research.
Abstract: This review paper focuses on interdigital electrodes-a geometric structure encountered in a wide variety of sensor and transducer designs. Physical and chemical principles behind the operation of these devices vary so much across different fields of science and technology that the common features present in all devices are often overlooked. This paper attempts to bring under one umbrella capacitive, inductive, dielectric, piezoacoustic, chemical, biological, and microelectromechanical interdigital sensors and transducers. The paper also provides historical perspective, discusses fabrication techniques, modeling of sensor parameters, application examples, and directions of future research.

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Interdigital Sensors and Transducers
ALEXANDER V. MAMISHEV, MEMBER, IEEE
,
KISHORE SUNDARA-RAJAN
, STUDENT MEMBER, IEEE
, FUMIN YANG
, STUDENT MEMBER, IEEE
,
YANQING DU
, MEMBER, IEEE
,
AND
MARKUS ZAHN, FELLOW, IEEE
Invited Paper
This review paper focuses on interdigital electrodes—a geo-
metric structure encountered in a wide variety of sensor and
transducer designs. Physical and chemical principles behind the
operation of these devices vary so much across different fields of
science and technology that the common features present in all
devices are often overlooked. This paper attempts to bring under
one umbrella capacitive, inductive, dielectric, piezoacoustic, chem-
ical, biological, and microelectromechanical interdigital sensors
and transducers. The paper also provides historical perspective,
discusses fabrication techniques, modeling of sensor parameters,
application examples, and directions of future research.
Keywords—Dielectric measurements, interdigital sensors, non-
destructive testing (NDT), sensor design, sensor modeling, spec-
troscopy, surface acoustic waves (SAWs), transducers.
I. INTRODUCTION
A. Motivation for This Paper
Interdigital electrodes are among the most commonly used
periodic electrode structures. Recent advances in such fields
as nondestructive testing (NDT), microelectromechanical
systems (MEMS), telecommunications, chemical sensing,
piezoacoustics, and biotechnology involve interdigital elec-
trodes in very different ways. At the same time, a number of
Manuscript received February 16, 2003; revised December 30, 2003. This
work was supported in part by the National Science Foundation under CA-
REER Award 0093716, in part by the Center for Process Analytical Chem-
istry, in part by the Electric Power Research Institute, in part by the Univer-
sity of Washington Royalty Research Fund, in part by the Link Foundation,
in part by the Air Force Office of Sponsored Research, and in part by the
American Public Power Association.
A. V. Mamishev, K. Sundara-Rajan, and F. Yang are with the Sensors,
Energy, and Automation Laboratory (SEAL), Department of Elec-
trical Engineering, University of Washington, Seattle, WA 98195 USA
(e-mail: mamishev@ee.washington.edu; kishore@ee.washington.edu;
fuminy@ee.washington.edu).
Y. Du is with Underwriters Laboratories, Santa Clara, CA 95050 USA
(e-mail: Yanqing.Du@us.ul.com).
M. Zahn is with the Department of Electrical Engineering and Computer
Science, Massachusetts Institute of Technology, Cambridge, MA 02139
USA (e-mail: zahn@mit.edu).
Digital Object Identifier 10.1109/JPROC.2004.826603
common features are shared among these applications. The
purpose of this paper is to outline common features and to
highlight the differences of sensor geometry, manufacturing
techniques, choice of materials, analytical and numerical
modeling, design optimization, system integration, and
data analysis. It is difficult and perhaps even excessive to
maintain equally deep and comprehensive treatment of all
these subjects. Instead, the fringing electric field sensors are
given the deepest emphasis in this manuscript. Significant
aspects of other types of sensors are discussed, while repe-
tition is avoided. References are provided to major review
papers and books in each section devoted to a particular
field of interdigital electrode applications, such as dielectric
imaging, acoustic sensors, and MEMS.
It is not possible to develop a universal sensor and a uni-
versal parameter estimation algorithm that would provide
the maximum information about material properties in all
applications. Each application requires a judicious choice
of sensor design and associated parameter estimation algo-
rithms. As a technical system develops, the requirements for
each element become clearer and affect the requirements for
each element of the trinity shown in Fig. 1. For example, it
may become clear during the development stage that the one-
sided access to the material under test (MUT) is not necessary
due to the specifics of the manufacturing process. In this case,
the electrode layout design should not be limited to interdig-
ital structures only. The dual-sided access has advantages of
larger, easily measurable capacitances and a more uniform
field distribution. The examples of appropriate matching of
sensors and parameter estimation algorithms with different
applications are encountered throughout this paper.
B. Terminology
The explosion in the quantity of scientific information has
brought its share of confusion to the subject of interdigital
sensors. As a result, lack of coordination of research efforts
is not uncommon in this field. For example, theoretical
0018-9219/04$20.00 © 2004 IEEE
808 PROCEEDINGS OF THE IEEE, VOL. 92, NO. 5, MAY 2004
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Fig. 1. Every sensing application requires an optimum
combination of inherently dependent elements of the measurement
system comprising sensor design and parameter estimation
algorithms.
expressions obtained for capacitance of interdigital piezo-
electric sensors are rarely mentioned in papers published in
the fields of dielectrometry or MEMS; researchers in one
country are often unaware of efforts in other countries; and
sensor designers repeat mistakes of previous generations.
Ambiguity of terminology does not help this situation: not
everyone associates periodic microstrip electrode structures
with interdigital patterns. Moreover, the word “interdigital”
itself does not have direct analogs in other languages. Thus,
this most frequent term is often replaced by such equivalents
as “periodic,” “microstrip,” “comb,” and “grating,” as well
as such variations as “interdigitated” and “combed.” The
overlap of the terms is not complete, for example, not every
microstrip circuit is interdigital, and not every interdigital
circuit is strictly periodic.
The term
interdigital, selected for use throughout this
paper, refers to a digitlike or fingerlike periodic pattern of
parallel in-plane electrodes used to build up the capacitance
associated with the electric fields that penetrate into the
material sample or sensitive coating.
Another term frequently misunderstood in context of
interdigital sensors is wavelength. One should distinguish
between the radiation wavelength of electromagnetic waves
and the wavelength of the spatial periodicity, or spatial
wavelength, of the geometrical structure. The former is the
wavelength
with the frequency equal to the frequency of
the voltage source applied to the sensor electrodes
(1)
where
is the speed of light and is the frequency of the
voltage source. This variable is typically discussed in con-
text of radio frequency (RF) and microwave circuits. For ex-
ample, a 600-MHz electromagnetic wave has the wavelength
of 50 cm. The spatial wavelength of the periodic interdigital
structure is the distance between the centerlines of the adja-
cent fingers belonging to the same electrode.
Using the terms capacitance and conductance for the de-
scription of terminal characteristics of an interdigital sensor
may be misleading, especially when one encounters effec-
tive negative values of capacitance or conductance. Strictly
speaking, these are mutual capacitance (or transcapacitance)
and mutual conductance (or transconductance), as defined
in multielectrode circuits. For the overwhelming majority of
cases, this distinction is not important enough to justify the
use of longer, more cumbersome terms.
Sensors, transducers, and detectors, as explained below,
are related; hence, these terms are often used interchange-
ably. The choice of the term usually depends on the function
of the device that one wants to emphasize.
A sensor is a device whose output can be quantified and
changes with one or more physical phenomena. This output
information can be used for process monitoring and control.
A transducer is a device that converts one form of energy into
another form. The measurement of physical variables asso-
ciated with the resulting form of energy allows estimation of
the physical variables associated with the input energy. A de-
tector is a device indicating presence, absence, or change of
the signal qualitatively, either as a binary signal or as a low
resolution signal with several states.
C. Historical Perspective
Historically, the first and still the most common reason
for making an interdigital electrode structure is to increase
the effective length, and, therefore, the capacitance between
the electrodes. Perhaps the earliest example of interdigital
electrode design is found in the patent of N. Tesla, issued
in 1891 [1]. In this example, each “finger” is a rectangular
plate, immersed in an insulating liquid. The total capaci-
tance of the “electrical condenser” proposed by Tesla in-
creases approximately linearly with the number of plates.
This principle is sometimes used in modern capacitors as
well. Theoretical expressions for calculation of capacitance
between coplanar strips appeared in the 1920s [2]. Antenna
designers use such periodic strip patterns to control the radia-
tion patterns. The technology, later named microdielectrom-
etry, started more than 20 years ago as a modification of the
charge-flow transistor (CFT), originally developed for mon-
itoring the sheet resistance of thin-film materials [3]. The
CFT was an MOS-compatible device based on contempo-
rary principles of transistor electronics [4], [5]. In this device,
the time delay between the application of the gate voltage
and a complete inversion of the channel region is dependent
on the sheet resistance of the MUT. Subsequent experiments
demonstrated that bulk conduction effects can be separated
from surface conduction. The separation of these two phe-
nomena gave additional valuable insights into the conduction
properties of the materials under test. Extensive use of inter-
digital electrodes for sensing applications started in the 1960s
[6] along with other forms of coplanar electrode structures
[7]. Later, independent dielectrometry studies with single [3],
and multiple [8], [9] penetration depths using interdigital
electrodes have continued in several countries. Commercial-
ization of multiple penetration depth dielectrometry in the
United States had been initiated in the 1980s and 1990s [10],
[11].
The existence of surface acoustic waves (SAWs) in an
isotropic material was first demonstrated by Lord Rayleigh
in 1885 [12]. SAW technology, as applied to modern elec-
tronic systems, arose originally from radar technology. In
1965, White and Voltmer [13] demonstrated the basic SAW
delay line structure by depositing two thin-metal interdigital
transducers (IDTs) on a polished piezoelectric plate. Until
the 1980s, this technology has been mainly used for military
MAMISHEV et al.: INTERDIGITAL SENSORS AND TRANSDUCERS 809
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applications. Starting from the 1980s, SAW devices began to
be used for consumer electronics and in telecommunications.
SAW devices have been made to meet the needs of acoustic
filter technology [6], [14] and later spanned fields of commu-
nication, signal processing, chemical sensing, nondestructive
evaluation, and biomedical applications. Extensive reviews
of acoustic sensor technology have been written [15], [16]
and somewhat reduce the need for the acoustic sensor tech-
nology coverage in this paper.
D. Common Features
One-side access. Several inherent advantages of the
planar interdigital geometry attract device designers. One
of the most important ones, especially for the NDT sensors
and piezoacoustic transducers, is that only a single-side
access to the test material is required. One can penetrate
the sample with electric, magnetic, or acoustic fields from
one side of the sample, leaving the other side open to the
environment which can allow absorption of gas, moisture,
or chemicals, which can change electrical properties of the
MUT. A sensitive layer of chemical or biological nature
deposited over the electrodes can also interact with a gas or
liquid environment, allowing monitoring of concentration
of chemicals in such materials as air, transformer oil, or
the human body. In some situations, the other side of the
material sample may be too far away or inaccessible due to
design limitations for an electrode so that one-sided access
is essential.
Control of signal strength. By changing the area of the
sensor, the number of fingers, and the spacing between them,
one can control the strength of the output signal. A tradeoff
between the signal-to-noise ratio and the minimum sensing
area is selected based on the application requirements. In
microchip sensors, the size of the sensitive area is usually
of little consequence, whereas in imaging devices it plays a
major role.
Imaging capability. A relatively new field of research
is interdigital frequency-wavelength dielectrometry, a
close relative of electrical impedance tomography. This
technology employs interdigital electrode pairs of variable
spatial periodicity. The depth of penetration of quasi-static
electric field lines into the material is frequency independent
and proportional to the spatial wavelength, defined as the
distance between the centerlines of neighboring electrodes
of the same polarity. The differing penetration depths
of multiple wavelengths make possible spatial profiling
of dielectric and conduction properties and geometry of
semi-insulating materials. That is, properties of individual
layers across the thickness of a stratified medium can be
determined without direct access to each layer. Movement of
the sensor along the material surface with subsequent signal
processing makes possible, in principle, three-dimensional
(3-D) imaging of dielectric properties of insulating materials.
The dielectric properties can be related to many other phys-
ical properties, such as porosity, density, structural integrity,
and chemical content of materials under test. At very high
radian frequency
, the skin depth further
limits the penetration of electric and magnetic fields into a
medium with conductivity
and magnetic permeability .
Multiple physical effects in the same structure.In
addition to sensing applications, fringing electric fields are
used increasingly to generate mechanical forces, especially
in MEMS. Scaling of motors and actuators to the distances
on the order of tens of micrometers make electric fields a
feasible choice for actuation of moving parts, whereas mag-
netic fields dominate the traditional macro scale designs. A
strong electric field enhancement at the ends of interdigital
electrodes generates a lateral force, which is used for
comb displacement. Electrical force levitation is achievable
using fringing fields in the direction perpendicular to the
interdigital pattern plane.
Simplified modeling. When the aspect ratio of the
electrode finger length to the spatial wavelength is large,
the numerical simulation and theoretical modeling is greatly
simplified because it can be done in the approximate
two-dimensional (2-D) limit rather than in 3-D. For this
reason, interdigital electrodes are popular when extensive
modeling is required for the interpretation of experimental
results. For example, elaborate models of electrical or
acoustical interactions of interdigital sensors and trans-
ducers with stratified media are often developed using 2-D
approximations. There is a trend, however, toward full
3-D simulations, taking advantage of continuing dramatic
increases in computer speed.
Spectrum. Fig. 2 shows the frequency spectrum for
acoustic and electromagnetic phenomena and instrumenta-
tion ranges. The lowest frequencies, starting at 1
Hz are
used for laboratory measurement of conduction properties,
where low-level conduction phenomena are difficult to
otherwise measure. The frequencies below 1 Hz are not
suitable for real-time industrial monitoring and are used
mostly in the laboratory studies of physical phenomena.
The characteristics of wave propagation drive the selection
of frequency ranges above 1 Hz. Especially significant are
such properties as spatial resolution, penetration depth,
attenuation, and external interference.
II. P
HYSICAL PRINCIPLES
A. Electric Field Sensing
A fringing field dielectrometry sensor has the same prin-
ciple of operation as the more conventional parallel-plate
or coaxial cylinder dielectric sensor cell. The voltage is ap-
plied to the electrodes, and the impedance across the elec-
trodes is measured. However, unlike the parallel-plate cell,
the fringing field sensor does not require two-sided access
to the MUT. Fig. 3 shows a gradual transition from the par-
allel-plate capacitor to a fringing field capacitor. In all three
cases, electric field lines pass through the MUT; therefore,
the capacitance and conductance between the two electrodes
depends on the material dielectric properties as well as on the
electrode and material geometry.
Interdigital dielectrometry is a subset of interdigital elec-
trode sensor applications that relies on direct measurement
810 PROCEEDINGS OF THE IEEE, VOL. 92, NO. 5, MAY 2004
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Fig. 2. Frequency spectrum for acoustic and electromagnetic interdigital sensors (partly based on
[16], [192], and [193]).
Fig. 3. A fringing field dielectrometry sensor can be visualized
as: (a) a parallel-plate capacitor whose (b) electrodes open up to
provide (c) a one-sided access to the MUT.
of dielectric properties of insulating and semi-insulating ma-
terials from one side [17][19]. The basic idea is to apply
a spatially periodic electrical potential to the surface of the
MUT. The combination of signals produced by variation of
the spatial period of the interdigital comb electrodes com-
bined with the variation of electrical excitation frequency
potentially provides extensive information about the spatial
profiles and dielectric spectroscopy of the MUT. Since the
changes in the dielectric properties are usually induced by
changes in various physical, chemical, or structural proper-
ties of materials, the dielectrometry measurements provide
effective means for indirect nondestructive evaluation of vital
parameters in a variety of industrial and scientific applica-
tions [10], [20].
Usually, the capacitance between two coplanar strips, as
shown in Fig. 3(c), is comparable to the stray capacitance
of the leads (conductors that connect the electrodes with the
electrical excitation source). Therefore, in order to build up
an easily measurable electrode structure, the coplanar strip
pattern may be repeated many times.
The art and science of designing sensors with multiple in-
terdigital electrode pairs and processing the output signals
to gain knowledge about the MUT is the subject of multi-
wavelength interdigital frequency wavenumber (
- ) dielec-
trometry which has been under development for about three
decades. The penetration depth of the fringing quasi-static
electric fields above the interdigital electrodes is proportional
to the spacing between the centerlines of the sensing and the
driven fingers and is independent of frequency. Overviews of
important concepts related to this technology are available in
[11] and [20][25].
One of the most attractive features of multiwavelength
dielectrometry is the ability to measure complex spatially
inhomogeneous distributions of properties from one side. As
the complexity of spatial distribution grows and the number
of unknown variables in each experiment increases, the
parameter estimation algorithms become more complicated,
computationally intensive, and less accurate and reliable. Ul-
timately, every major type of spatial distribution of material
properties requires a different parameter estimation algo-
rithm. The types of spatial distributions include, but are not
limited to, homogeneous materials, multiple-layer materials,
local discontinuities (such as cracks and electrical trees),
global discontinuities of microstructure (such as grains or
fibers forming the material), and, finally, smoothly varying
properties. On the electrical properties side, materials under
test may be purely insulating or weakly conductive. Various
phenomena may affect sensor response, including frequency
dispersion, electrode polarization due to an electrochemical
double layer, quality of interfacial contact, and many others.
A conceptual schematic of an
-k dielectrometry sensor
measurement is presented in Fig. 4. For a homogeneous lossy
dielectric medium of semi-infinite extent, periodic variation
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Fig. 4. A generic interdigital dielectrometry sensor [25], [50].
of quasi-static electric potential along the surface in the di-
rection produces an exponentially decaying pattern of elec-
tric fields penetrating into the medium in the
direction. The
variation of shade in the MUT indicates the possible variation
of material properties and, thus, variations in the complex di-
electric permittivity
with the distance from the surface.
Concepts of the forward and the inverse problems are
widely used in the literature related to this technology. Here,
the forward problem is defined as the task of determining the
electric field distribution and the interelectrode admittance
matrix when the geometry, material properties, and external
excitations are given. Correspondingly, the inverse problem
requires determining either material properties or associated
geometry, or both, when the imposed excitations and experi-
mental values of the sensor admittance matrix are available.
Each application that involves theoretical modeling usually
requires solving the forward problem.
The forward problem can be solved using several ap-
proaches. One of them is to use a continuum model [26].
From the electro-quasi-static field point of view, in a ho-
mogeneous lossy dielectric, the electric scalar potential of
the field excited by the driven electrode is a solution to
Laplaces equation. At any constant
position, the electric
field distribution far away from the sensor edges is periodic
in the
direction and assumed uniform in the direction.
For a homogeneous dielectric of semi-infinite extent, the
scalar potential can be written as an infinite series of sinu-
soidal Fourier modes of fundamental spatial wavelength
that decays away in the direction
(2)
where
is the wavenumber of each
mode. For
excitations at radian frequency , such
that
, the complex surface capac-
itance density
relates at a planar surface
Fig. 5. Half-wavelength cross section with a superimposed
equivalent
-circuit model.
constant to the potential at that surface for the th
Fourier mode of the homogeneous dielectric of semi-infinite
extent as
(3)
where
(4)
is the complex permittivity with
as material dielectric per-
mittivity and
as ohmic conductivity. Then, knowledge of
at the electrode surface lets us calculate the terminal cur-
rent from the potential distribution at that surface. It is also
possible to solve the forward problem with commercial fi-
nite-element software [27], with finite-difference techniques,
or by using analytical approximations [28].
Fig. 5 shows the equivalent circuit of the sensor superim-
posed onto the schematic view of a sensor half-wavelength.
Note that each wavelength has an opposite conducting guard
plane at the bottom of the substrate. For each wavelength,
a follower op-amp drives the guard plane at the substrate
bottom at the voltage
, thus eliminating any cur-
rent between the sensing and guard electrodes through the
substrate. Therefore, the effect of
and on circuit re-
sponse is eliminated, which simplifies response analysis and
improves device sensitivity.
The concept of imposed frequency wavenumber (
- )
goes beyond dielectrometry applications. Earlier studies led
by J. R. Melcher employed interdigital electrodes to study
electrohydrodynamic surface waves and instabilities [29],
effects on static electrification in insulating liquids [30],
[31], and electromechanics of electrochemical double layers
in liquid electrolytes [32].
The penetration depth of the fringing electric fields above
the interdigital electrodes is proportional to the spacing
between the centerlines of the sensing and the driven fin-
gers. Fig. 6 illustrates the idea of multiple penetration depths
for a three-wavelength sensor. The variation of the material
properties across the thickness of the MUT in the
direction
can be approximately found by simultaneously solving three
complex equations describing this three-wavelength experi-
mental arrangement as a piecewise three-layer system.
812 PROCEEDINGS OF THE IEEE, VOL. 92, NO. 5, MAY 2004
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