Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU☆
01 Feb 2009-International Communications in Heat and Mass Transfer (Pergamon)-Vol. 36, Iss: 2, pp 166-171
TL;DR: In this paper, the liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU is studied and the results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipments.
About: This article is published in International Communications in Heat and Mass Transfer.The article was published on 2009-02-01. It has received 111 citations till now. The article focuses on the topics: Water cooling & Thermoelectric cooling.
Citations
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TL;DR: In this paper, the authors reviewed the recent advances of thermoelectric materials, modeling approaches, and applications, and summarized the achievements in past decade have been summarized and the modeling techniques have been described for both the thermoelement modeling and TEC modeling.
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TL;DR: In this article, the application of nanofluids as the working fluid on a heat pipe liquid-block combined with thermoelectric cooling is investigated, and the results obtained from this technique are compared to those from other conventional cooling techniques.
141 citations
TL;DR: In this paper, the performance of thermoelectric cooling of electronic devices with nanofluid in a multiport minichannel heat exchanger is experimentally investigated, and the result showed 40% enhancement in the coefficient of performance (COP) of the TEC module for 0.2% of nanoparticle volume concentration.
122 citations
TL;DR: In this paper, the authors investigated the thermal performance of a thermoelectric water-cooling device for electronic equipment and developed a novel analytical model of thermal analogy network to predict the thermal capability.
97 citations
References
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TL;DR: In this article, the authors investigated heat transfer and pressure drop phenomena over a bank of micro pin fin and found that very low thermal resistances are achievable using a pin fin heat sink.
419 citations
"Liquid cooling in the mini-rectangu..." refers background in this paper
...[17] investigated on the heat transfer and pressure drop over a bank of micro pin fins....
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TL;DR: In this paper, a simple theoretical analysis that indicated more energy and lower MCHS wall temperature could be obtained under the assumption that heat transfer could be enhanced by the presence of nanoparticles was carried out.
367 citations
"Liquid cooling in the mini-rectangu..." refers methods in this paper
...Chein and Chuang [8,15,26] studied the micro channel heat sink performance with and without thermoelectric using nanofluids as coolants....
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TL;DR: In this article, the cooling capacity, junction temperature, coefficient of performance, and required heat sink thermal resistance at the TEC hot side were computed for thermoelectric cooler applications in the electronic cooling.
287 citations
TL;DR: In this article, the effects of the height and thickness of square micro-pin-fin on boiling heat transfer from silicon chips immersed in a pool of degassed or gas-dissolved FC-72 were investigated.
216 citations
"Liquid cooling in the mini-rectangu..." refers background in this paper
...Honda and Wei [4,7] reviewed the researches concerning the boiling heat transfer enhancement for the micro-channel heat sink immersed in dielectric liquids....
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TL;DR: In this article, the authors present an analytical and numerical study on the heat transfer characteristics of forced convection across a microchannel heat sink, and two analytical approaches are used: the porous medium model and the fin approach.
177 citations