Liquid immersion cooling of small electronic devices
TL;DR: In this paper, the authors examined liquid immersion techniques for cooling minute heat sources and found that nucleate boiling may introduce mechanical stresses, contamination and physical design problems, and two alternatives to boiling (forced convection and bubble induced mixing) were also investigated which reduced or bypassed some of these problems.
About: This article is published in Microelectronics Reliability.The article was published on 1973-04-01. It has received 47 citations till now. The article focuses on the topics: Nucleate boiling & Convective heat transfer.
Citations
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TL;DR: The use of gas bubbles and slugs in microfiltration and ultra-filtration with flow inside tubes and fibres, across flat sheets and outside fibres is discussed in this article.
477 citations
IBM1
TL;DR: In this article, the improvements in the device characteristics of n-channel MOSFET's that occur at low temperatures are considered. Butler et al. presented a device design for an enhancement mode FET with a channel length of I µm that is suitable for operation at liquid nitrogen temperature.
Abstract: The improvements in the device characteristics of n-channel MOSFET's that occur at low temperatures are considered in this paper. The device parameters for polysilicon gate FET's with channel lengths of the order of 1 µm have been studied both experimentally and theoretically at temperatures ranging from room temperature down to liquid nitrogen temperature. Excellent agreement was found between the experimental dc device characteristics and those predicted by a two-dimensional current transport model, indicating that device behavior is well understood and predictable over this entire temperature range. A device design is presented for an enhancement mode FET with a channel length of I µm that is suitable for operation at liquid nitrogen temperature.
305 citations
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Abstract: Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.
285 citations
TL;DR: In this article, a bubble generation system that creates individual, spherical vapor bubbles from 2 to 500 μm in diameter is presented, where polysilicon resistors with a typical size of 50 x 2 x 0.53 μm 3 are fabricated by means of micromachining.
Abstract: Thermal bubble formation in the microscale is of importance for both scientific research and practical applications. A bubble generation system that creates individual, spherical vapor bubbles from 2 to 500 μm in diameter is presented. Line shape, polysilicon resistors with a typical size of 50 x 2 x 0.53 μm 3 are fabricated by means of micromachining. They function as resistive heaters and generate thermal microbubbles in working liquids such as Fluorinert fluids (inert, dielectric fluids available from the 3M company), water, and methanol. Important experimental phenomena are reported, including Marangoni effects in the microscale; controllability of the size of microbubbles; and bubble nucleation hysteresis. A one-dimensional electrothermal model has been developed and simulated in order to investigate the bubble nucleation phenomena. It is concluded that homogeneous nucleation occurs on the microresistors according to the electrothermal model and experimental measurements.
89 citations
TL;DR: In this article, the authors demonstrate immersion cooling in water of high-power density electronics, and also develop design guidelines for cooling of electronic components through the use of novel electrically insulating coatings coupled with attractive electrically conducting cooling media.
68 citations
References
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TL;DR: In this paper, a hydrodynamic model of stagnation flow is proposed for saturated nucleate boiling over a flat surface, and a relation between the heat-transfer coefficient and the thermal boundary-layer thickness induced by rising bubbles is obtained, and good agreement with measured results in the low heat-flux region is indicated.
128 citations
TL;DR: In this article, the effect of component size on convective heat transfer from small devices (with surface areas between 2·00 and 0·01 sq cm) was investigated analytically and experimentally.
62 citations
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TL;DR: In this paper, the development of new packaging techniques for electronic equipment and assesses the need for new thermal analysis techniques are discussed and thermal problems in future equipment are considered and possible future cooling systems are presented.
8 citations