Low-k Dielectric- A Potential Solution for Crosstalk Induced Signal Integrity issues in SWCNT Interconnects

TLDR: This work analyzes crosstalk in bundled SWCNTs with a better model for extracting inter bundle real life coupling capacitances and proposes a novel idea of reducing crosStalk effects by using low-k dielectric materials as isolation between adjacent nets.

Abstract: Crosstalk creates signal integrity issues due to capacitive coupling between adjacent interconnect wires and it is a matter of concern in high frequency interconnects. The reported work on crosstalk induced signal integrity issues in CNT interconnects till date were assuming the value of coupling capacitance as equivalent to the coupling effect between metal interconnects of same dimensions. This work tries to fill that gap; by analyzing crosstalk in bundled SWCNTs with a better model for extracting inter bundle real life coupling capacitances. This work also proposes a novel idea of reducing crosstalk effects by using low-k dielectric materials as isolation between adjacent nets. It is found that compact bundles separated by low-k dielectric can reduce crosstalk effect considerably. Keywords - Crosstalk, signal integrity, SWCNT, MWCNT, Mixed CNT