MEMS in laminates
20 Jun 2011-pp 262-267
TL;DR: In this paper, the authors demonstrate that good quality MEMS devices can be manufactured in laminates and discuss some of the unique benefits of such devices, such as high degree of integration, pre-packaged, and at low cost.
Abstract: Post-semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) technologies, can be used to manufacture micro-electromechanical systems (MEMS) for sensing and actuation applications. MEMS devices have traditionally been produced using silicon processes, but recent advancements in packaging manufacturing technology have produced processes that can produce feature sizes small enough to be used for building microsystems. A lamination-based manufacturing process allows for a broader selection of materials and fabrication processes than silicon-based manufacturing, and therefore provides greater design freedom for producing functional microdevices. In many cases devices can be fabricated that are more suited to their applications than their silicon counterparts. Furthermore, such microdevices can be built with a high degree of integration, pre-packaged, and at low cost. Indeed, the PCB and packaging industries stand to benefit greatly by expanding their offerings beyond servicing the semiconductor industry and developing their own devices and products. This paper illustrates that good quality MEMS devices can be manufactured in laminates and discusses some of the unique benefits of such devices.
Citations
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TL;DR: In this paper, the authors presented a fabrication process based on printed circuit board manufacturing techniques for creating monolithic, topologically complex, three-dimensional machines in parallel at the millimeter to centimeter scales.
Abstract: Silicon-based MEMS techniques dominate sub-millimeter scale manufacturing, while a myriad of conventional methods exist to produce larger machines measured in centimeters and beyond. So-called mesoscale devices, existing between these length scales, remain difficult to manufacture. We present a versatile fabrication process, loosely based on printed circuit board manufacturing techniques, for creating monolithic, topologically complex, three-dimensional machines in parallel at the millimeter to centimeter scales. The fabrication of a 90?mg flapping wing robotic insect demonstrates the sophistication attainable by these techniques, which are expected to support device manufacturing on an industrial scale.
179 citations
TL;DR: In this paper, a 3D flow focusing PDMS generator was combined with a highly effective hydrophilic surface modification by corona discharge for a spatially patterned droplet generator, allowing reliable generation of double emulsions in water and oleic acid.
Abstract: We fabricated phospholipid liposomes from double emulsion templates produced in a microfluidic 3D flow focusing PDMS droplet generator. We combined the easing of wetting criteria due to 3D flow focusing geometry with a highly effective hydrophilic surface modification by corona discharge for a spatially patterned droplet generator, allowing the reliable generation of double emulsions in water and oleic acid without added surfactants. By controlling the Capillary numbers of the immiscible flows, we defined regions for the stable generation of double emulsions which were transformed into liposomes after solvent extraction.
57 citations
Patent•
10 Feb 2012TL;DR: In this paper, a multi-layer superplanar structure can be formed from distinctly patterned layers, where the layers in the structure can include at least one rigid layer and at least 1 flexible layer; the flexible layer can extend between the rigid segments to serve as a joint.
Abstract: A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.
44 citations
Patent•
11 Feb 2011TL;DR: A passively torque-balanced device as discussed by the authors includes a frame, a drivetrain including a drive actuator mounted to the frame and configured for reciprocating displacement, and at least two end effectors coupled with the remote links.
Abstract: A passively torque-balanced device includes (a) a frame; (b) a drivetrain including a drive actuator mounted to the frame and configured for reciprocating displacement, an input platform configured for displacement by the drive actuator, a plurality of rigid links, including a proximate link and remote links, wherein the rigid links are collectively mounted to the frame, and a plurality of joints joining the rigid links and providing a plurality of non-fully actuated degrees of freedom for displacement of the rigid links, the plurality of joints including a fulcrum joint that is joined both to the input platform and to the proximate rigid link; and (c) at least two end effectors respectively coupled with the remote links and configured for displacement without full actuation.
14 citations
01 May 2016
TL;DR: In this paper, the authors present a novel packaging architecture for fluidic surface mount components in microfluidic printed circuit boards (PCB)s, which incorporates sacrificial layers to protect the fluid cavities and inlets/outlets to the component during mounting and integration on a microfluideic circuit board.
Abstract: We present a novel packaging architecture for fluidic surface mount components in microfluidic printed circuit boards (PCB)s. The package incorporates sacrificial layers to protect the fluid cavities and inlets/outlets to the component during mounting and integration on a microfluidic circuit board. In this paper we describe the general scheme to package and integrate microfluidic components such as valves, pumps, mixers, etc. in microfluidic PCBs. We also report the use of dry film photoresist as a possible protective sealant for fluidic openings on the package. As an example microfluidic packaged surface mount component, we introduce an optofluidic cell counter that can be soldered directly on a PCB and connected to a microfluidic system.
4 citations
References
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01 May 1982
TL;DR: This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures.
Abstract: Single-crystal silicon is being increasingly employed in a variety of new commercial products not because of its well-established electronic properties, but rather because of its excellent mechanical properties. In addition, recent trends in the engineering literature indicate a growing interest in the use of silicon as a mechanical material with the ultimate goal of developing a broad range of inexpensive, batch-fabricated, high-performance sensors and transducers which are easily interfaced with the rapidly proliferating microprocessor. This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures. Finally, the potentials of this new technology are illustrated by numerous detailed examples from the literature. It is clear that silicon will continue to be aggressively exploited in a wide variety of mechanical applications complementary to its traditional role as an electronic material. Furthermore, these multidisciplinary uses of silicon will significantly alter the way we think about all types of miniature mechanical devices and components.
2,723 citations
Journal Article•
TL;DR: In this article, the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures are discussed.
Abstract: Single-crystal silicon is being increasingly employed in a variety of new commercial products not because of its well-established electronic properties, but rather because of its excellent mechanical properties. In addition, recent trends in the engineering literature indicate a growing interest in the use of silicon as a mechanical material with the ultimate goal of developing a broad range of inexpensive, batch-fabricated, high-performance sensors and transducers which are easily interfaced with the rapidly proliferating microprocessor. This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures. Finally, the potentials of this new technology are illustrated by numerous detailed examples from the literature. It is clear that silicon will continue to be aggressively exploited in a wide variety of mechanical applications complementary to its traditional role as an electronic material. Furthermore, these multidisciplinary uses of silicon will significantly alter the way we think about all types of miniature mechanical devices and components.
2,707 citations
Book•
30 Nov 2000TL;DR: The main aim is to provide an introduction to MEMS by describing the processes and materials available and by using examples of commercially available devices, and the concept of using MEMS devices as key elements within complex systems (or even microsystems!) is explored.
Abstract: If you've not been involved in MEMS (MicroElectroMechanical Systems) technology or had the cause to use MEMS devices, then you may wonder what all the fuss is about. What are MEMS anyway? What's the difference between MEMS and MST (MicroSystems Technology)? What are the advantages over existing technologies? If you have ever found yourself pondering over such questions, then this book may be for you. As the title suggests, the main aim is to provide an introduction to MEMS by describing the processes and materials available and by using examples of commercially available devices. The intended readership are those technical managers, engineers, scientists and graduate students who are keen to learn about MEMS but have little or no experience of the technology. I was particularly pleased to note that Maluf has dedicated a whole chapter to the important (and often difficult) area of packaging. The first three chapters provide a general overview of the technology. Within the first three pages we are introduced to the MEMS versus MST question, only to discover that the difference depends on where you live! The United States prefer MEMS, while the Europeans use the handle MST. (Note to self: tell colleagues in MEMS group at Southampton). A good account is given of the basic materials used in the technology, including silicon, silicon oxide/nitride/carbide, metals, polymers, quartz and gallium arsenide. The various processes involved in the creation of MEMS devices are also described. A good treatment is given to etching and bonding in addition to the various deposition techniques. It was interesting to note that the author doesn't make a big issue of the differences between bulk and surface micromachined devices; the approach seems to be `here's your toolbag - get on with it'. One of the great strengths of this book is the coverage of commercial MEMS structures. Arising as they have, from essentially a planar technology, MEMS devices are often elaborate three-dimensional creations, and 2D drawings don't do them much justice. I have to say that I was extremely impressed with the many aesthetic isometric views of some of these wonderful structures. Pressure sensors, inkjet print nozzles, mass flow sensors, accelerometers, valves and micromirrors are all given sufficient treatment to describe the fundamental behaviour and design philosophy, but without the mathematical rigour expected for a traditional journal paper. Chapter 5 addresses the promise of the technology as a means of enabling a new range of applications. The concept of using MEMS devices as key elements within complex systems (or even microsystems!) is explored. The so-called `lab-on-a-chip' approach is described, whereby complex analytical systems are integrated onto a single chip together with the associated micropumps and microvalves. The design and fabrication of MEMS devices are important issues by themselves. A key area, often overlooked, is that of packaging. Painstaking modelling and intricate fabrication methodologies can produce resonator structures oscillating at precisely, say, 125 kHz. The device is then mounted in a dual-in-line carrier and the frequency shifts by 10 kHz because of the additional internal stresses produced. Packaging issues can't be decoupled from those of the micromachined components. Many of these issues, such as protective coatings, thermal management, calibration etc, are covered briefly in the final chapter. Overall, I found this book informative and interesting. It has a broad appeal and gives a good insight into this fascinating and exciting subject area. Neil White
770 citations
01 Jan 2006
TL;DR: This chapter discusses the packaging of MEMS and MOEMS: challenges and a case study, as well as processing technologies, and Analytical techniques for materials characterization.
Abstract: Chapter 1: Introduction and overview of microelectronic packaging. Chapter 2: Materials for microelectronic packaging. Chapter 3: Processing technologies. Chapter 4: Organic printed circuit board materials and processes. Chapter 5: Ceramic substrates. Chapter 6: Electrical considerations, modeling, and simulation. Chapter 7: Thermal considerations. Chapter 8: Mechanical design considerations. Chapter 9: Discrete and embedded passive devices. Chapter 10: Electronic package assembly. Chapter 11: Design considerations. Chapter 12: Radio frequency and microwave packaging. Chapter 13: Power electronics packaging. Chapter 14: Multichip and three-dimensional packaging. Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study. Chapter 16: Reliability considerations. Chapter 17: Cost evaluation and analysis. Chapter 18: Analytical techniques for materials characterization.
199 citations
Book•
01 Jan 2012
TL;DR: In this article, the authors present a prehensive and flexible educational presentation of microfabrication and nanotechnology, focusing on the science of micro fabrication, nanotechnology and micromachining.
Abstract: Fundamentals of microfabrication and nanotechnology third. read book fundamentals of microfabrication and. fundamentals of microfabrication and nanotechnology by. a prehensive and flexible educational presentation. dr marc madou s fundamentals of microfabrication 3rd. pdf fundamentals of microfabrication and nanotechnology. fundamentals of microfabrication and nanotechnology third. 9781420055191 fundamentals of microfabrication and. nanotechnology. fundamentals of microfabrication and nanotechnology third. microfabrication. nanotechnology and micromachining chucklekids in. fundamentals of microfabrication the science of. mems and nanotechnology reading list. resources memsx edx. fundamentals of microfabrication and nanotechnology third. fundamentals of microfabrication and nanotechnology in. fundamentals of microfabrication and nanotechnology. fundamentals of microfabrication and nanotechnology third. fundamentals of microfabrication and nanotechnology jh
195 citations