Open AccessBook
Microelectronics Packaging Handbook
Reads0
Chats0
About:
The article was published on 1996-12-15 and is currently open access. It has received 1322 citations till now. The article focuses on the topics: Microelectronics & Child-resistant packaging.read more
Citations
More filters
Journal ArticleDOI
Emerging challenges and materials for thermal management of electronics
Arden L. Moore,Li Shi +1 more
TL;DR: In this paper, a number of cubic crystals, two-dimensional layered materials, nanostructure networks and composites, molecular layers and surface functionalization, and aligned polymer structures are examined for potential applications as heat spreading layers and substrates, thermal interface materials, and underfill materials in future-generation electronics.
Journal ArticleDOI
Antenna design for UHF RFID tags: a review and a practical application
TL;DR: An overview of antenna design for passive radio frequency identification (RFID) tags is presented, which outlines a generic design process including range measurement techniques and focuses on one practical application: RFID tag for box tracking in warehouses.
Journal ArticleDOI
Adhesive wafer bonding
TL;DR: A review of the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications can be found in this paper, where the main advantages of this technique include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers.
Journal ArticleDOI
Three-dimensional silicon integration
John U. Knickerbocker,P.S. Andry,B. Dang,R. Horton,Mario J. Interrante,Chirag S. Patel,Robert J. Polastre,Katsuyuki Sakuma,R. Sirdeshmukh,Edmund J. Sprogis,Sri M. Sri-Jayantha,A. M. Stephens,Anna W. Topol,Cornelia K. Tsang,B. C. Webb,Steven L. Wright +15 more
TL;DR: 3D technology from IBM is highlighted, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and examples of 3D emerging industry product applications that could create marketable systems are provided.
Journal ArticleDOI
Thermal properties of diamond/copper composite material
TL;DR: The composite of diamond and copper have a potential for a heat spreading substrate with high performance and high reliability because not only its thermal conductivity is high but its coefficient of thermal expansion can be tailored according to a semiconductor material of electronics devices.