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Journal ArticleDOI

Microstructural characterizations of magnetron sputtered Ti films on glass substrate

TL;DR: In this article, magnetron sputtered Ti thin films were characterized by X-ray diffraction, scanning electron microscopy and atomic force microscopy, showing an increasing trend with power, pressure, and temperature from the Atomic Force Microscopy analysis.
About: This article is published in Journal of Materials Processing Technology.The article was published on 2009-04-01. It has received 111 citations till now. The article focuses on the topics: Thin film & Sputtering.
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TL;DR: Observations, for the first time, provide direct evidence that plants take up Ag2S-NPs without a marked selectivity in regard to particle size and without substantial transformation during translocation from roots to shoots.
Abstract: Silver nanoparticles (Ag-NPs) are used in a wide range of everyday products, leading to increasing concerns regarding their accumulation in soils and subsequent impact on plants. Using single particle inductively coupled plasma mass spectrometry (spICP-MS) and synchrotron-based techniques including X-ray absorption spectroscopy (XAS) and X-ray fluorescence microscopy (XFM), we characterized the uptake, speciation, and translocation of insoluble Ag2S-NPs (an environmentally-relevant form of Ag-NPs in soils) within two plant species, a monocot and a dicot. Exposure to 10 mg Ag L−1 as Ag2S-NPs for one week resulted in a substantial increase in leaf Ag concentrations (3.8 to 5.8 μg Ag g−1 dry mass). Examination using XAS revealed that most of the Ag was present as Ag2S (>91%). Furthermore, analyses using spICP-MS confirmed that these Ag2S particles within the leaves had a markedly similar size distribution to those supplied within the hydroponic solution. These observations, for the first time, provide direct evidence that plants take up Ag2S-NPs without a marked selectivity in regard to particle size and without substantial transformation (dissolution or aggregation) during translocation from roots to shoots. Furthermore, after uptake, these Ag2S-NPs reduced growth, partially due to the solubilisation of Ag+in planta, which resulted in an upregulation of genes involved in the ethylene signalling pathway. Additionally, the upregulation of the plant defense system as a result of Ag2S-NPs exposure may have contributed to the decrease in plant growth. These results highlight the risks associated with Ag-NP accumulation in plants and subsequent trophic transfer via the food chain.

99 citations

Journal ArticleDOI
TL;DR: In this paper, Ni-TiN nanocomposites have been deposited on Si (100) substrate at Ar:N-2 = 1:1, 1:2 or 1:3 at ambient temperature by reactive co-sputtering of Ti and Ni targets used as RF and DC sources.
Abstract: Thin films of Ni-TiN nanocomposites have been deposited on Si (100) substrate at Ar:N-2 = 1:1, 1:2 or 1:3 at ambient temperature by reactive co-sputtering of Ti and Ni targets used as RF and DC sources, respectively. X-ray diffraction (XRD) studies have shown and as preferred orientations for Ni and TiN, respectively. X-ray photoelectron spectroscopic examination of the films has shown Ti/N to be approximate to 1 for Ar:N-2 = 1:2, and 1 for Ar:N-2 = 1:1 or 1:3, respectively. Scanning and transmission electron microscopic studies have shown that with an increase in Ar:N-2 from 1:1 to 1:3, both porosity content and grain sizes are reduced, while the TiN volume fraction obtained by Rietveld analysis of XRD peaks is increased from 22 to 44%. The magnitude of compressive residual stress in both Ni and TIN phases is found to increase with the decrease in Ar:N-2 ratio. Nanoindentation studies have shown that hardness and elastic moduli of films increase with TiN content closely following the rule of mixtures, whereas the scratch resistance scales with hardness. Furthermore, resistivity measured by Van der Pauw four-point probe method appears to be proportional to the TiN volume fraction. (C) 2013 Elsevier B.V. All rights reserved.

47 citations

Journal ArticleDOI
TL;DR: In this paper, a DC magnetron sputtering was used to sputter a pure Ti target containing different amounts of Ag pellets, resulting in a relatively large range of composition, which gave rise to varied morphological, structural and some selected property responses.

39 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of thickness on the properties of titanium (Ti) film deposited on Si/SiO2 (100) substrate using two different methods: magnetron sputtering and electron beam (e-beam) evaporation technique.
Abstract: This paper reports effect of thickness on the properties of titanium (Ti) film deposited on Si/SiO2 (100) substrate using two different methods: d.c. magnetron sputtering and electron beam (e-beam) evaporation technique. The structural and morphological characterization of Ti film were performed using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). XRD pattern revealed that the films deposited using d.c. magnetron sputtering have HCP symmetry with preferred orientation along (002) plane, while those deposited with e-beam evaporation possessed fcc symmetry with preferred orientation along (200) plane. The presence of metallic Ti was also confirmed by XPS analysis. FESEM images depicted that the finite sized grains were uniformly distributed on the surface and AFM micrographs revealed roughness of the film. The electrical resistivity measured using four-point probe showed that the film deposited using d.c. magnetron sputtering has lower resistivity of ∼13 μΩcm than the film deposited using e-beam evaporation technique, i.e. ∼60 μΩcm. The hardness of Ti films deposited using d.c. magnetron sputtering has lower value (∼7·9 GPa) than the film deposited using e-beam technique (∼9·4 GPa).

35 citations


Cites background from "Microstructural characterizations o..."

  • ...Moreover, hcp structure of Ti using d.c. sputtering has been shown in various reports (Song et al 2007; Chawla et al 2009)....

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References
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01 Jan 2001

19,319 citations

Journal ArticleDOI

2,605 citations


"Microstructural characterizations o..." refers methods in this paper

  • ...The lattice parameters ‘a’ and ‘c’ of Ti films were alculated using the equation (Cullity and Stock, 2001): 1 d2 = 4 3 (h2 + hk + k2) a2 + l 2 c2 (3) here d is the interplanar distance obtained from the position f the (1 0 0) peak using the Bragg condition, a and c are the latice parameters (being…...

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Journal ArticleDOI
TL;DR: In this paper, a review of the physical vapor deposition (PVD) of thin films is presented, focusing mainly on evaporation and sputtering processes and the physics of their growth and structure.
Abstract: Thick films will be defined here as those sufficiently thick to permit evolutionary selection processes during growth to influence their structures. High rates are defined as those sufficient to deposit thick films in a reasonable time. To avoid superficiality, this review is restricted to evaporation and sputtering, i.e. to physical vapor deposition (PVD). PVD is finding increased use for applications ranging from micro­ electronics to corrosion-barrier and wear-resistant coatings, and to the synthesis of free-standing shapes with unique mechanical properties. The emphasis here is on metallic deposits and on the physics of their growth and structure. Particular attention is given to sputtering, because recent developments ih sputtering tech­ nology make thick film deposition feasible, and because the subject has not been reviewed. Several reviews have concentrated on thick film deposition by evaporation (1, 2). Structure zone models (3-5) [particularly the model proposed by Movchan & Demchishin (3), which predicts three structural forms or zones as a function of T/Tm. where T is the substrate temperature and Tm is the coating-material melting point] have come into increased use in interpreting coating microstructures. There­ fore this review is organized from thc viewpoint of the zone models. After a brief survey of certain pertinent features of evaporation and sputtering, subsequent sections discuss each of the structural zones, metallurgical phase formation, and the mechanical properties of coatings. In this review the structure zones are defined in terms of dominant physical processes rather than structural forms. This generalization permits a broader correlation with experimental observations.

1,979 citations


"Microstructural characterizations o..." refers result in this paper

  • ...The morphology of Ti thin films deposited under varying sputtering power, substrate temperature and sputtering pressure are in accordance with the structural zone models discussed in the literature (Thornton, 1977)....

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Journal ArticleDOI
TL;DR: Titanium and titanium alloys are excellent candidates for aerospace applications owing to their high strength to weight ratio and excellent corrosion resistance as discussed by the authors.However, titanium usage is strongly limited by its higher cost relative to competing materials, primarily aluminum alloys and steels.
Abstract: Titanium and titanium alloys are excellent candidates for aerospace applications owing to their high strength to weight ratio and excellent corrosion resistance. Titanium usage is, however, strongly limited by its higher cost relative to competing materials, primarily aluminum alloys and steels. Hence the advantages of using titanium must be balanced against this added cost. The titanium alloys used for aerospace applications, some of the characteristics of these alloys, the rationale for utilizing them, and some specific applications of different types of actual usage, and constraints, are discussed as an expansion of previous reviews of β alloy applications. [1,2]

1,938 citations