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Millimeter-wave CMOS design

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In this paper, the effects of parasitics on the high-frequency performance of 130-nm CMOS transistors are investigated, and a peak f/sub max/ of 135 GHz has been achieved with optimal device layout.
Abstract: 
This paper describes the design and modeling of CMOS transistors, integrated passives, and circuit blocks at millimeter-wave (mm-wave) frequencies. The effects of parasitics on the high-frequency performance of 130-nm CMOS transistors are investigated, and a peak f/sub max/ of 135 GHz has been achieved with optimal device layout. The inductive quality factor (Q/sub L/) is proposed as a more representative metric for transmission lines, and for a standard CMOS back-end process, coplanar waveguide (CPW) lines are determined to possess a higher Q/sub L/ than microstrip lines. Techniques for accurate modeling of active and passive components at mm-wave frequencies are presented. The proposed methodology was used to design two wideband mm-wave CMOS amplifiers operating at 40 GHz and 60 GHz. The 40-GHz amplifier achieves a peak |S/sub 21/| = 19 dB, output P/sub 1dB/ = -0.9 dBm, IIP3 = -7.4 dBm, and consumes 24 mA from a 1.5-V supply. The 60-GHz amplifier achieves a peak |S/sub 21/| = 12 dB, output P/sub 1dB/ = +2.0 dBm, NF = 8.8 dB, and consumes 36 mA from a 1.5-V supply. The amplifiers were fabricated in a standard 130-nm 6-metal layer bulk-CMOS process, demonstrating that complex mm-wave circuits are possible in today's mainstream CMOS technologies.

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Citations
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Millimeter-Wave Cellular Wireless Networks: Potentials and Challenges

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Millimeter Wave Channel Modeling and Cellular Capacity Evaluation

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State of the Art in 60-GHz Integrated Circuits and Systems for Wireless Communications

TL;DR: An overview of the technological advances in millimeter-wave circuit components, antennas, and propagation that will soon allow 60-GHz transceivers to provide multigigabit per second (multi-Gb/s) wireless communication data transfers in the consumer marketplace is presented.
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Multibeam Antenna Technologies for 5G Wireless Communications

TL;DR: This paper provides an overview of the existing multibeam antenna technologies which include the passiveMultibeam antennas (MBAs) based on quasi-optical components and beamforming circuits, multibeams phased-array antennas enabled by various phase-shifting methods, and digital MBAs with different system architectures.
References
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TL;DR: In this article, two-and three-dimensional boundary value problems are studied for two-dimensional waveguides with Cylindrical Conducting Boundaries (CCLB).
Journal ArticleDOI

On-chip spiral inductors with patterned ground shields for Si-based RF ICs

TL;DR: In this paper, a patterned ground shield is inserted between an on-chip spiral inductor and silicon substrate to increase the quality of a 2 GHz LC tank by up to 33% and reduce substrate coupling between two adjacent inductors.
Proceedings ArticleDOI

On-chip Spiral Inductors With Patterned Ground Shields For Si-based RF IC's

TL;DR: In this paper, a patterned ground shield is proposed to reduce the unwanted substrate effects by shielding the electric field of an on-chip spiral inductor from the silicon substrate, which can be realized in standard silicon technologies without additional processing steps.
Proceedings ArticleDOI

An improved de-embedding technique for on-wafer high-frequency characterization

TL;DR: In this paper, an improved correction procedure for on-wafer S-parameter measurements has been developed and implemented, which takes the effects of series parasitics into account in a simple, straightforward way.
Journal ArticleDOI

A 24-GHz CMOS front-end

TL;DR: In this paper, the first 24 GHz CMOS front-end in a 0.18/spl mu/m process was reported, which consists of a low-noise amplifier (LNA) and a mixer and downconverts an RF input at 24 GHz to an IF of 5 GHz.
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