Modeling of thermal via heat transfer performance for power electronics cooling
15 Dec 2011-pp 107-110
TL;DR: In this paper, the thermal performances of throughhole thermal vias used for heat transfer between layers on printed circuit boards are investigated by simulation using Computational Fluid Dynamics (CFD) software in order to determine steady state thermal behavior.
Abstract: For power electronics and Light Emitting Diode (LED) lighting applications, thermal management represents a critical factor having important consequences on electrical performance and overall cost of the assembly. Although advanced solutions for heat removal like Isolated Metal Substrates (IMS) base materials or thermally conductive epoxies have entered the market for a few years they still have a high price tag and add significant manufacturing costs to the finished assembly. Obtaining a good thermal management by using conventional materials and manufacturing techniques is often a key design challenge that engineers have to overcome. By creating thermal paths from one layer to another, the equivalent cooling area for an electronic component can be significantly increased thus lowering the junction-to-ambient thermal resistance which is the main indicator of cooling performance. These thermal paths between layers are commonly defined as through-hole plated vias connected to copper areas. Our paper presents a study of the thermal performances of through-hole thermal vias used for heat transfer between layers on printed circuit boards. Different geometries and scenarios are investigated by simulation using Computational Fluid Dynamics (CFD) software in order to determine steady state thermal behavior.
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TL;DR: In this article, an axisymmetric thermal resistance model is developed for PCB thermal pads where the heat conduction, convection, and radiation all exist; due to the interdependence between the conductive/radiative heat transfer coefficients and the board temperatures, an algorithm is proposed to fast obtain the board-ambient thermal resistance and to predict the semiconductor junction temperature.
Abstract: Miniature power semiconductor devices mounted on printed circuit boards (PCBs) are normally cooled by means of PCB vias, copper pads, and/or heatsinks. Various reference PCB thermal designs have been provided by semiconductor manufacturers and researchers. However, the recommendations are not optimal, and there are some discrepancies among them, which may confuse electrical engineers. This paper aims to develop analytical thermal resistance models for PCB vias and pads, and further to obtain the optimal design for thermal resistance minimization. First, the PCB via array is thermally modeled in terms of multiple design parameters. A systematic parametric analysis leads to an optimal trajectory for the via diameter at different PCB specifications. Then, an axisymmetric thermal resistance model is developed for PCB thermal pads where the heat conduction, convection, and radiation all exist; due to the interdependence between the conductive/radiative heat transfer coefficients and the board temperatures, an algorithm is proposed to fast obtain the board-ambient thermal resistance and to predict the semiconductor junction temperature. Finally, the proposed thermal models and design optimization algorithms are verified by computational fluid dynamics simulations and experimental measurements.
33 citations
17 Mar 2013
TL;DR: In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters is presented, based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied.
Abstract: One important challenge in power electronics design is removing the heat cost effectively from the power devices. A thermal via is a small diameter hole plated with copper and is used to transfer the heat from one side of the printed circuit board (PCB) to the other side. In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters are presented. Key advantages of using PCB's for thermal management are also presented. Based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied. Each of the four via patterns is laid out multiple times on the same PCB. A power component in a D2PAK is soldered to each of the patterns. The PCB is attached to a liquid cooled cold plate. The devices are powered up and a thermal imaging camera is used to record the temperature of the device. The experimental results presented closely matches with the theoretical prediction and helps in identifying the most efficient thermal via pattern.
19 citations
Cites background from "Modeling of thermal via heat transf..."
...These PTH are referred to as thermal vias [1]-[6] as shown in Fig....
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...The value of CS is highly dependent on the thermal via pattern design of PCB [1]-[6]....
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28 Oct 2013
TL;DR: In this article, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of power electronics devices is presented based on the results from available literature and practical manufacturing guidelines, four different via patterns for single power devices are selected.
Abstract: A daunting challenge in packaging design for power electronics products is removing the heat from the power devices in a cost effective manner In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of power electronics devices are presented Based on the results from the available literature and practical manufacturing guidelines, four different via patterns for single power devices are selected Each of the four via patterns is laid out multiple times with their via holes are filled with a filler material and their performance are compared to non-filled thermal vias One dimensional analysis is performed to characterize the thermal performance of the thermal via patterns The experimental results presented closely matches the theoretical prediction to identify the most efficient thermal via pattern
17 citations
Cites background or methods from "Modeling of thermal via heat transf..."
...These PTH are referred to as thermal vias [1]-[6] as shown in Fig....
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...In order to achieve lower thermal resistance of the thermal vias, the designer has to reduce the thermal via pitch size, increase the via copper barrel thickness, fill the via hole with a filler material and increase the number of copper layers [1-6], [9]....
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...The value of ΘCS is highly dependent on the thermal via pattern design of PCB [1]-[6]....
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...In this paper, design of thermal vias currently available in literature [1]-[6] is presented in section II....
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16 Mar 2014
TL;DR: In this article, a detailed comparison of the properties of various off-the-shelf available TIMs to be specifically used between PCB with thermal vias and heat sink is presented, and experimental results are presented to determine the thermal performance of various TIMs.
Abstract: One important challenge in power electronics design is removing the heat cost effectively from the power devices mounted on thermal vias on a printed circuited board (PCB). Thermal vias is a cluster of small diameter hole plated with copper and is used to transfer the heat from one side of the PCB where the power device is soldered to the other side which is generally mounted on a heat sink using a thermal interface material (TIM). To minimize the contact resistance and provide electrical insulation between the PCB and heat sink, TIMs are used to fill the air gaps and are an essential part of an assembly when solid surfaces are attached together. This paper presents a detailed comparison of the properties of various off-the-shelf available TIMs to be specifically used between PCB with thermal vias and heat sink. Experimental results are presented to determine the thermal performance of various TIMs.
12 citations
Cites background from "Modeling of thermal via heat transf..."
...These PTH are referred to as thermal vias [1]-[6] as shown in Fig....
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...The value of ΘCS is highly dependent on the thermal resistance of the thermal via pattern design of PCB [1]-[6] as well the thermal resistance of the TIM....
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01 Aug 2013
TL;DR: In this article, a detailed thermal simulation of the performance of FR-4 PCBs having various "via configuration" is made, and the results indicate the thermal resistance from the simulation is significantly affected by compact thermal via configurations.
Abstract: A detailed thermal simulation of the performance of FR-4 PCBs having various "via configuration" is made in this study. The results indicate the thermal resistance from the simulation is significantly affected by compact thermal via configurations. Thermal resistance can be improved by increasing via number and also with copper filled via. For further explanation of the significant drop of thermal resistance at PCBs with thermal via, the detailed thermal resistance distribution at the thermal module are further examined. The significant drop in thermal resistance mainly occur in FR-4 PCBs with the help of thermal via. However, there is observed a maximum number of via which contribute to optimized thermal resistance across the PCB.
4 citations
Cites background from "Modeling of thermal via heat transf..."
...[4] Vias are holes that are drilled in the board and plated with copper which can be divided into "thru" vias and "buried" vias....
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References
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Book•
07 Nov 1980
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
185 citations
"Modeling of thermal via heat transf..." refers methods in this paper
...By applying (1) for the via geometry presented in figure 2 the thermal resistance of the copper walls for single via is obtained:...
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05 Dec 2000
TL;DR: In this paper, the accuracy of compact thermal via models with respect to the detailed models has been determined using PBGA 352 as the test vehicle and found that the accuracy is within 3%.
Abstract: Thermal vias and balls are key elements in plastic ball grid array (PBGA) package thermal design as they enhance the package performance. Simulation is a versatile design optimization tool for characterizing the thermal vias and balls. However, the finer geometric details of the vias require excessive memory and modeling and simulation time. Different modeling concepts are being tried in the industry to include finer geometries in the package. This paper shows a methodology of developing compact thermal via models and validating the same with detailed models. The accuracy of compact thermal via models with respect to the detailed models has been determined using PBGA 352 as the test vehicle. It is found that the accuracy is within 3%. The simulation models of PBGA 352 have been validated by measurements and found that the accuracy of model is within 10%. Two and four layer PBGA 352s with different via configurations have been characterized with compact thermal via models, and design guidelines for PBGA 352 packages have been obtained.
22 citations
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27 Sep 2004
TL;DR: In this paper, a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks was established to meet cooling and producibility requirements.
Abstract: Establish a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks. A feasibility study proved that the thermal via concept could be implemented to meet cooling and producibility requirements. Reliability testing demonstrated negligible thermal path degradation for a 15-year life equivalent in airborne environment.
10 citations
04 Jul 2011
TL;DR: In this article, the variation of thermal resistance in LED modules embedded with thermal via was investigated, and the relationship between thermal resistance and structure of thermal via has been obtained through the analysis of thermal resistances with various test vehicles.
Abstract: Light Emitting Diode (LED) has been already familiar that is used as lighting sources of general electronic devices and various displays. LED has many advantages such as long life, low power consumption and high reliability. In the future, as alternative to fluorescent lighting, it is sure that LED in lighting products is expected to receive much attention. However, the components related with advanced LED packages or modules have been issued on the heat from LED chip. And the LED chip is still being developed to the high power devices which are generating more heat. In this study, we investigated the variation of thermal resistance in LED modules embedded with thermal via. Through the analysis of thermal resistance with various test vehicles, we could obtain the concrete relationship between thermal resistance and structure of thermal via.
10 citations
"Modeling of thermal via heat transf..." refers methods in this paper
...Table 2 illustrates the relative error determined by using the simplified conduction mode described in (2) and (3) for 0....
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