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Proceedings ArticleDOI

Modeling of thermal via heat transfer performance for power electronics cooling

TL;DR: In this paper, the thermal performances of throughhole thermal vias used for heat transfer between layers on printed circuit boards are investigated by simulation using Computational Fluid Dynamics (CFD) software in order to determine steady state thermal behavior.
Abstract: For power electronics and Light Emitting Diode (LED) lighting applications, thermal management represents a critical factor having important consequences on electrical performance and overall cost of the assembly. Although advanced solutions for heat removal like Isolated Metal Substrates (IMS) base materials or thermally conductive epoxies have entered the market for a few years they still have a high price tag and add significant manufacturing costs to the finished assembly. Obtaining a good thermal management by using conventional materials and manufacturing techniques is often a key design challenge that engineers have to overcome. By creating thermal paths from one layer to another, the equivalent cooling area for an electronic component can be significantly increased thus lowering the junction-to-ambient thermal resistance which is the main indicator of cooling performance. These thermal paths between layers are commonly defined as through-hole plated vias connected to copper areas. Our paper presents a study of the thermal performances of through-hole thermal vias used for heat transfer between layers on printed circuit boards. Different geometries and scenarios are investigated by simulation using Computational Fluid Dynamics (CFD) software in order to determine steady state thermal behavior.
Citations
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Proceedings ArticleDOI
08 Dec 2020
TL;DR: In this article, a copper (Cu) coin structure embedded on a printed circuit board (PCB) was developed to dissipate a 12 W peak power out of the device system working at less than 60 °C.
Abstract: This work developed a copper (Cu) coin structure embedded on a printed circuit board (PCB) to dissipate a 12 W peak power out of the device system working at less than 60 °C. The designed Cu coin was based on the manufacturing limitations and allowed the thermal setup to be mounted on the bottom side of the board for automated test equipment (ATE) applications of the device. Thermal simulations through computational fluid dynamics (CFD) were analyzed and presented both for Cu coin and thermal vertical interconnect access (VIA), to quantify the thermal performances and compare the thermal benefits. Size variations on the designed Cu coin were investigated and quantified setting a thermal decay rate per change in dimension. The actual thermal measurement for the fabricated Cu coin design was presented on the experimental results, matching the simulation values and proving the viability of thermal Cu coin.

2 citations

Journal ArticleDOI
TL;DR: In this article, a solid-state power amplifier module in low-temperature co-fired ceramic (LTCC) technology is presented, which utilizes substrate-integrated waveguides (SIWs) for compactness and low loss.
Abstract: This article reports a solid-state power amplifier module in low-temperature cofired ceramic (LTCC) technology. For compactness and low loss, the package utilizes substrate-integrated waveguides (SIWs). To meet the thermal requirements, the amplifiers are mounted on a metallic plate that is integrated into the LTCC multilayer and transfers the heat to a spreader. Both RF and thermal measurement results for a package with two integrated 10-W gallium nitride (GaN) power amplifiers at the K-band are presented. They demonstrate the suitability of the module for highly integrated transmitters as needed for phased arrays or multiple-feed-per-beam satellite antennas.

1 citations


Cites methods from "Modeling of thermal via heat transf..."

  • ...To thermally connect the SSAPs (1) to the heat spreader, thermal vias are commonly used [24]....

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Journal ArticleDOI
TL;DR: In this paper, the authors propose innovative methods of cooling of minimized surface mount packages, especially in application of power electronics, and present FEM thermal simulation of several possible variants of problem solution and provides results of measurement on physical prototypes with intention to compare.
Abstract: With rise of GaN and SiC semiconductors in last few years, amount of available power semiconductors in minimized surface mount packages significantly increased. Together with rising pressure to increase power density of power conversion systems became effective design of cooling crucial. The aim of this article is to propose innovative methods of cooling of minimized surface mount packages, especially in application of power electronics. Article presents FEM thermal simulation of several possible variants of problem solution and provides results of measurement on physical prototypes with intention to compare. Results shows that the future of cooling in power electronics belongs to printed circuit boards with
Proceedings Article
05 Sep 2022
TL;DR: In this article , a SiC MOSFET was used for active-clamp forward converters with power ratings larger than 500 W as power as the power transfer between primary and secondary is discontinuous leading to large magnetic components.
Abstract: Active-clamp forward converters are typically not applied for converters with power ratings larger than 500 W as power as the power transfer between primary and secondary is discontinuous leading to large magnetic components. This paper, however, proves that silicon carbide (SiC) devices enable this topology as a well-suitable topology for a wide voltage-transfer ratio due to the low switching losses allowing high switching frequencies reducing the size of the magnetic components. A laboratory prototype is designed using a very precise model. It employs SiC MOSFETs of 900 V for the primary and Si synchronous rectifiers of 100 V. The semiconductors are cooled with cost-efficient copper inlays, which effectiveness is demonstrated through a thermal FEM simulation. The developed prototype achieves a maximum efficiency of 95% while maintaining an efficiency above 92% for almost the entire operating region. The high efficiency and the power density of approximately 2 kW/l confirm the proposed concept. Finally, the converter is benchmarked to two LLC resonant converters (Si, SiC) and the prototype is used to verify a highly accurate steady-state model showing errors below 1 %.
Proceedings ArticleDOI
09 Dec 2022
TL;DR: In this paper , the idea of equal-area split vias filling is used to optimize the vias arrangement pattern, and the calculation formula of thermal resistance of PCB thermal vias unit is derived.
Abstract: In order to optimize the heat dissipation capability of power devices attached to Printed circuit board (PCB), thermal vias are usually added to the PCB and heatsink are added on the back side. The idea of equal-area split vias filling is used to optimize the vias arrangement pattern, and the calculation formula of thermal resistance of PCB thermal vias unit is derived. The influence of the diameter of thermal vias, copper plating thickness, filling material and vias spacing on thermal resistance is studied by theoretical calculation formula. The thermal model is simulated using Icepak to compare the effects of the presence or absence of thermal vias on the PCB and the presence or absence of a heatsink on the temperature of the power devices. Finally, the correctness of the theoretical analysis is verified by comparing the theoretical analysis with the simulation results.
References
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Book
07 Nov 1980
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

185 citations


"Modeling of thermal via heat transf..." refers methods in this paper

  • ...By applying (1) for the via geometry presented in figure 2 the thermal resistance of the copper walls for single via is obtained:...

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Proceedings ArticleDOI
05 Dec 2000
TL;DR: In this paper, the accuracy of compact thermal via models with respect to the detailed models has been determined using PBGA 352 as the test vehicle and found that the accuracy is within 3%.
Abstract: Thermal vias and balls are key elements in plastic ball grid array (PBGA) package thermal design as they enhance the package performance. Simulation is a versatile design optimization tool for characterizing the thermal vias and balls. However, the finer geometric details of the vias require excessive memory and modeling and simulation time. Different modeling concepts are being tried in the industry to include finer geometries in the package. This paper shows a methodology of developing compact thermal via models and validating the same with detailed models. The accuracy of compact thermal via models with respect to the detailed models has been determined using PBGA 352 as the test vehicle. It is found that the accuracy is within 3%. The simulation models of PBGA 352 have been validated by measurements and found that the accuracy of model is within 10%. Two and four layer PBGA 352s with different via configurations have been characterized with compact thermal via models, and design guidelines for PBGA 352 packages have been obtained.

22 citations


Additional excerpts

  • ...                        (5)...

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Proceedings ArticleDOI
27 Sep 2004
TL;DR: In this paper, a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks was established to meet cooling and producibility requirements.
Abstract: Establish a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks. A feasibility study proved that the thermal via concept could be implemented to meet cooling and producibility requirements. Reliability testing demonstrated negligible thermal path degradation for a 15-year life equivalent in airborne environment.

10 citations

Proceedings ArticleDOI
04 Jul 2011
TL;DR: In this article, the variation of thermal resistance in LED modules embedded with thermal via was investigated, and the relationship between thermal resistance and structure of thermal via has been obtained through the analysis of thermal resistances with various test vehicles.
Abstract: Light Emitting Diode (LED) has been already familiar that is used as lighting sources of general electronic devices and various displays. LED has many advantages such as long life, low power consumption and high reliability. In the future, as alternative to fluorescent lighting, it is sure that LED in lighting products is expected to receive much attention. However, the components related with advanced LED packages or modules have been issued on the heat from LED chip. And the LED chip is still being developed to the high power devices which are generating more heat. In this study, we investigated the variation of thermal resistance in LED modules embedded with thermal via. Through the analysis of thermal resistance with various test vehicles, we could obtain the concrete relationship between thermal resistance and structure of thermal via.

10 citations


"Modeling of thermal via heat transf..." refers methods in this paper

  • ...Table 2 illustrates the relative error determined by using the simplified conduction mode described in (2) and (3) for 0....

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