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Morphological and microstructural characterization of nanostructured pure α-phase W coatings on a wide thickness range

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TLDR
In this paper, the influence of the sputtering power on the adhesion of the coatings to the substrate was investigated by depositing coatings at powers varying from 30 up to 220 W.
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This article is published in Applied Surface Science.The article was published on 2014-10-15 and is currently open access. It has received 33 citations till now. The article focuses on the topics: Coating & Sputter deposition.

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Citations
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Ab initio study of tungsten defects near the surface

TL;DR: In this article, a first principles analysis of the behavior of point defects, namely, self-interstitial atoms, a single vacancy and light impurity atoms such as H and He in tungsten is reported.
Journal ArticleDOI

Corrosion behavior of diverse sputtered coatings for the helium cooled pebbles bed (HCPB) breeder concept

TL;DR: In this paper, the corrosion behavior of several sputtered coatings (nanostructured W, SiC and Al2O3) under the working conditions expected for the helium cooled pebbles bed breeder concept to be used in future nuclear fusion reactors.
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Surface Topography and Deuterium Retention of Polycrystalline Tungsten and Nanocrystalline Tungsten Film Exposed to Deuterium Plasma

TL;DR: In this article, polycrystalline tungsten prepared by powder sintering and naonocrystalline Tungsten film deposited by magnetron sputtering were simultaneously exposed to deuterium plasma with energy energy.
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On the thermal stability of the nanostructured tungsten coatings

TL;DR: In this article, the thermal stability of nanostructured tungsten (NW) coatings was studied in the temperature range from 1000 to 1473 K, where samples were isothermally annealed in vacuum at temperatures from 298 to 1413 K. The morphological and microstructural properties of the samples were characterized by atomic force microscopy (AFM), scanning electron microscopy and X-Ray diffraction (XRD), respectively.
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Fabrication of homogenous multilayered W films by multi-step sputtering deposition: a novel grain boundary enrichment strategy.

TL;DR: Detailed analysis showed that the formation of an HM structure is related to the temperature evolution of the film growing surface during the multi-step sputtering process, which could provide a general engineering approach to enrich film interfaces and allows for the development of thin films with novel microstructures.
References
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Journal ArticleDOI

An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

TL;DR: In this paper, the authors used a Berkovich indenter to determine hardness and elastic modulus from indentation load-displacement data, and showed that the curve of the curve is not linear, even in the initial stages of the unloading process.
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A 2dvEv- bit distributed algorithm for the directed Euler trail problem

TL;DR: The algorithm can be used as a building block for solving other distributed graph problems, and can be slightly modified to run on a strongly-connected diagraph for generating the existent Euler trail or to report that no Euler trails exist.
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WSXM: a software for scanning probe microscopy and a tool for nanotechnology.

TL;DR: The most relevant features of WSXM, a freeware scanning probe microscopy software based on MS-Windows, are described and some relevant procedures of the software are carried out.
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The intrinsic stress of polycrystalline and epitaxial thin metal films

TL;DR: In this article, a thorough discussion of today's understanding of the growth of thin metal films and related atomistic mechanisms responsible for intrinsic stress is presented, where the intrinsic stress either originates from strained regions within the films (grain boundaries, dislocations, voids, impurities, etc.) or at the film/substrate (lattice mismatch, different thermal expansion, etc).
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Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings

TL;DR: Thor Thornton et al. as discussed by the authors used hollow and post-type cathode sputtering apparatuses at argon pressures of 1 and 30 mTorr to evaluate OFHC copper coatings on copper, tantalum, and stainless steel substrates.
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Q1. What are the contributions in "Morphological and microstructural characterization of nanostructured pure α-phase w coatings on a wide thickness range" ?

In a previous work this paper, the authors have presented an overview of the relationship between the safety and Durability of Structures and Materials ( CISDEM ), UPM-CSIC, IMM-CNM, and Isaac Newton 8 PTM.