Next-generation microchannel coolers
07 Feb 2008-Proceedings of SPIE (International Society for Optics and Photonics)-Vol. 6876, pp 687608
TL;DR: In this paper, a next-generation microchannel cooler has been developed for packaging laser diode arrays, which eliminates many of the problems associated with typical copper-based cooling designs and provides excellent thermal performance.
Abstract: A next-generation microchannel cooler has been developed for packaging laser diode arrays th at eliminates many of the problems associated with typical copper-based cooling designs. The coolers are built on well-established Low-Temperature Cofired Ceramic technology and provide excellent thermal performance. They do not require the use of deionized water. This work highlights the strengths of the new cooler technology. The results of a long-term, high-flow-rate test which demonstrates the excellent erosion resistance of these coolers are presented. Three devices have been tested for 2500 hours at a flow rate of 0.25 GPM and show minimal signs of erosion. This data is compared to a similar test conducted with copper coolers. Several design parameters are also addressed for the ceramic coolers. The available form and fit characteristics are addressed, as is the custom-configurable nature of the devices. Keywords: laser diode, microchannel, cooling, diode array, LTCC, ceramic, deionized water, erosion
Citations
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TL;DR: In this article, the fluid flow and heat transfer of liquid cooling microchannels embedded in low temperature co-fired ceramic (LTCC) multilayered electronic packaging substrate have been investigated.
37 citations
TL;DR: A miniaturized micro-channel cooler with micro-pipes that transport cooling liquid was numerically modeled and experimentally studied as discussed by the authors, and a prototype copper cooler with glass micropipes was manufactured and tested.
23 citations
TL;DR: A hybrid experimental/numerical method is proposed for predicting the junction temperature distribution in a high-power laser diode (LD) bar with multiple emitters and the results are presented in conjunction with the wall-plug efficiency and the center wavelength shift.
Abstract: A hybrid experimental/numerical method is proposed for predicting the junction temperature distribution in a high-power laser diode (LD) bar with multiple emitters. A commercial water-cooled LD bar with multiple emitters is used to illustrate and validate the proposed method. A unique experimental setup is developed and implemented first to measure the average junction temperatures of the LD bar emitters. After measuring the heat dissipation of the LD bar, the effective heat transfer coefficient of the cooling system is determined inversely from the numerical simulation using the measured average junction temperature and the heat dissipation. The characterized heat dissipation and effective heat transfer coefficient are used to predict the junction temperature distribution over the LD bar numerically under high operating currents. The results are presented in conjunction with the wall-plug efficiency and the center wavelength shift.
13 citations
Cites background from "Next-generation microchannel cooler..."
...In addition, it can accelerate the erosion process of the surface structures inside microchannels, which will increase the junction temperature and will eventually reduce the lifetime of the LD bar [51,52]....
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TL;DR: In this paper, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array, and numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed.
Abstract: High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.
13 citations
Cites background from "Next-generation microchannel cooler..."
...For certain applications, MCC packaged high power laser arrays with higher reliability and longer lifetime without decreasing high output power are required [6]....
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Patent•
04 Nov 2014TL;DR: In this article, a mesh wafer is used to form a heat spreader, which is then electroplated onto the backside of an integrated circuit (IC) wafer.
Abstract: A method for forming a wafer level heat spreader includes providing a mesh wafer, the mesh wafer having a plurality of openings and mesh regions between the openings, bonding the mesh wafer to a backside of an integrated circuit (IC) wafer, the IC wafer comprising a plurality of circuits; and electroplating a heat sink material through the plurality of openings and onto to the backside of the IC wafer.
13 citations
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TL;DR: In this paper, the proper design of a water system for use with a micro channel cooled laser system is described, and the water chemistry and its impact on erosion and corrosion of the copper based micro channel coolers are discussed.
Abstract: High power direct diode lasers have made significant impact in the industry as an alternative heat source for material processing. In order, to be readily adopted by the industry they have to show >99% uptimes. One of the much-discussed issues associated with copper based micro channel coolers has been the lifetime of the micro channel cooler in High Power Direct Diode Laser (HPDDL) systems. HPDDLs with micro channel coolers have shown long life in some installations, but have shown to work only a few thousands of hours in others. These have been attributed to the erosion, corrosion, or clogging of the micro channel coolers. This paper will describe the proper design of the water system for use with a micro channel cooled laser system. This paper focuses on the water chemistry and its impact on erosion and corrosion of the copper based micro channel coolers. Using previously reported data; we will give erosion rates for different water chemistries.
20 citations
TL;DR: In this paper, the thermal performance of two of these designs is presented and in one case, shown to far exceed the performance of standard copper microchannel-cooled packages, and a microchannel cooler made from ceramic material.
Abstract: Northrop Grumman / Cutting Edge Optronics has developed three designs for microchannel-cooled laser diode arrays in
which the coolant is electrically isolated from the current path. As a result, these arrays do not require the use of
deionized water. The thermal performance of two of these designs is presented and, in one case, shown to far exceed
the performance of standard copper microchannel-cooled packages.
Also presented is a microchannel cooler made from ceramic material. This design leverages existing technology to
create a low-cost, high-performance alternative to copper-based microchannel coolers. This approach offers the greatest
promise for future development due to the vast assortment of existing capabilities that have already been developed for
similar ceramic structures used in the electronics industry.
6 citations