Ni-P-B Electroless Plating
01 Jan 2002-Journal of The Surface Finishing Society of Japan (The Surface Finishing Society of Japan)-Vol. 53, Iss: 1, pp 28-30
About: This article is published in Journal of The Surface Finishing Society of Japan.The article was published on 2002-01-01 and is currently open access. It has received 1 citations till now. The article focuses on the topics: Gold plating & Electroless nickel plating.
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Patent•
25 Oct 2018
TL;DR: In a Ni-P-B plating film formation method, electroplating is performed in a plating bath containing Ni ions, phosphite ions, alkylamine borane, acetic acid, at least one kind of primary brightening agent and a secondary brightening agents comprising at least 1 kind of surfactant as discussed by the authors.
Abstract: In a Ni-P-B plating film formation method, electroplating is performed in a plating bath containing Ni ions, phosphite ions, alkylamine borane, acetic acid, at least one kind of primary brightening agent and a secondary brightening agent comprising at least one kind of surfactant. In said plating bath, the alkylamine borane concentration is at least 1.37 mmol/L and the acetic acid concentration is at least 0.70 mol/L and less than 2.80 mol/L. As a result, it is possible to form, with high production efficiency, a plating film with a high hardness of at least Hv 700 without having to perform baking while reducing the occurrence of appearance defects such as haze and abnormal deposits even if the current density is increased to at least 80 A/dm2 to increase the film formation rate.