Numerical investigation of laminar heat transfer performance of various cooling channel designs
TL;DR: In this article, the authors investigated the heat transfer performance of various cooling channel designs e.g., parallel, serpentine, wavy, coiled and novel hybrid channels, where the cooling channel is designed to be placed on top of an electronic chip which dissipates heat at a constant flux.
About: This article is published in Applied Thermal Engineering.The article was published on 2011-05-01. It has received 89 citations till now. The article focuses on the topics: Heat transfer & Laminar flow.
Citations
More filters
TL;DR: In this paper, a serpentine-channel cooling plate is modeled parametrically and its characteristics assessed using computational fluid dynamics (CFD) and numerical optimization is carried out by allowing the channel width and position to vary.
405 citations
TL;DR: In this article, an experimental investigation has been conducted on the flow friction and heat transfer in sinusoidal microchannels with rectangular cross sections, and the experimental results, mainly the overall Nusselt number and friction factor, for wavy micro-channels are compared with those of straight baseline channels with the same cross section and footprint length.
247 citations
TL;DR: In this article, the effect of triangular, rectangular and trapezoidal ribs on the laminar heat transfer of water-Ag nanofluid in a ribbed triangular channel under a constant heat flux was numerically studied using finite volume method.
Abstract: In the present study, the effect of triangular, rectangular and trapezoidal ribs on the laminar heat transfer of water-Ag nanofluid in a ribbed triangular channel under a constant heat flux was numerically studied using finite volume method. Height and width of ribs have been assumed to be fixed in order to study the effect of different rib forms. Modeling were performed for laminar flow (Re=1, 50 and 100) and nanofluid volume fractions of 0, 2% and 4%. The results indicated that an increase in volume fraction of solid nanoparticle leads to convectional heat transfer coefficient enhancement of the cooling fluid, whereas increasing the Nusselt number results in a loss of friction coefficient and pressure. Also, along with the fluid velocity increment, there will be an optimal proportion between heat and hydrodynamic transfer behavior which optimizes performance evaluation criteria (PEC) behavior. Among all of the investigated rib forms, the rectangular one made the most changes in the streamlines and the triangular form has the best thermal performance evaluation criteria values. For all studied Reynold numbers, heat transfer values are least for rectangular rib from. Therefore, trapezoidal ribs are recommended in high Reynold numbers.
182 citations
TL;DR: In this paper, the conjugate heat transfer between the heat transfer fluid (HTF) and PCM, which undergoes a cyclic melting and freezing process, is solved numerically using the computational fluid dynamic approach utilizing enthalpy-porosity formulation.
136 citations
TL;DR: In this paper, the authors explored the potential and challenges of using nanofluids in cooling systems for Proton Exchange Membrane Fuel Cells (PEMFCs) in automotive applications.
Abstract: This paper explores the potential and challenges of using nanofluids in cooling systems for Proton Exchange Membrane Fuel Cells (PEMFCs) in automotive applications. PEMFCs have clearly emerged as a promising alternative to existing conventional internal combustion engines (ICEs) in vehicles, mainly due to their relatively high electrical energy conversion efficiency (around 55% based on the high heating value of hydrogen), and zero emissions in operation. Despite their relatively low heat generation and low operating temperature (~65 °C), PEMFCs require a relatively large radiator in their cooling systems, which is unfavourable in automotive applications. Nanofluids have attracted great interest as coolants due to their superior heat transfer properties. This paper thus reviews the using of nanoparticles with a suitable base fluid as a coolant in PEMFCs. It is found that a nanofluid coolant in a PEMFC can reduce the size of the radiator needed to dissipate its thermal load (by up to 10% relative to standard heat transfer fluids), eliminate the need for a deionizing filter, and lower the freezing point of the base fluid.
130 citations
References
More filters
TL;DR: In this paper, Wang et al. used the Poincare section to analyze the fluid mixing in three-dimensional wavy microchannels with rectangular cross-sections and found that the quantity and the location of the vortices may change along the flow direction, leading to chaotic advection.
423 citations
TL;DR: In this article, a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions.
310 citations
TL;DR: In this paper, the effects of channel dimensions, channel wall thickness, bottom thickness and inlet velocity on the pressure drop, thermal resistance and the maximum allowable heat flux are presented.
247 citations
IBM1
TL;DR: This paper provides a broad review of the cooling technologies for computer products from desktop computers to large servers in terms of air, hybrid, liquid, and refrigeration-cooled systems.
Abstract: This paper provides a broad review of the cooling technologies for computer products from desktop computers to large servers. For many years cooling technology has played a key role in enabling and facilitating the packaging and performance improvements in each new generation of computers. The role of internal and external thermal resistance in module level cooling is discussed in terms of heat removal from chips and module and examples are cited. The use of air-cooled heat sinks and liquid-cooled cold plates to improve module cooling is addressed. Immersion cooling as a scheme to accommodate high heat flux at the chip level is also discussed. Cooling at the system level is discussed in terms of air, hybrid, liquid, and refrigeration-cooled systems. The growing problem of data center thermal management is also considered. The paper concludes with a discussion of future challenges related to computer cooling technology.
232 citations
Book•
07 Nov 1980
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Abstract: Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.
185 citations