Numerical investigation of natural and mixed convection heat transfer on optimal distribution of discrete heat sources mounted on a substrate
M V Karvinkoppa,Tapano Kumar Hotta +1 more
- Vol. 263, Iss: 6, pp 062066
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In this paper, the numerical investigation of natural and mixed convection heat transfer on optimal distribution of five non-identical protruding discrete heat sources (Aluminium) mounted on a substrate (Bakelite) board was conducted.Abstract:
The paper deals with the numerical investigation of natural and mixed convection heat transfer on optimal distribution of five non-identical protruding discrete heat sources (Aluminium) mounted on a substrate (Bakelite) board. The heat sources are subjected to a uniform heat flux of 2000 W/m2. The temperature of heat sources along with the effect of thermal interaction between them is predicted by carrying out numerical simulations using ANSYS Icepak, and the results are validated with the existing experimental findings. The results suggest that mixed convection is a better method for cooling of discrete heat source modules. Also, the temperature of heat sources is a strong function of their shape, size, and positioning on the substrate. Effect of radiation is studied by painting the surface of heat sources by black paint. The results conclude that, under natural convection heat transfer, the temperature of heat sources drops by 6-13% from polished to black painted surface, while mixed convection results in the drop by 3-15%. The numerical predictions are in strong agreement with experimental results.read more
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Role of PCM based mini-channels for the cooling of multiple protruding IC chips on the SMPS board - A numerical study
Mathew V K,Tapano Kumar Hotta +1 more
Abstract: The paper aims at the transient numerical modelling under mixed convection for the cooling of seven protruding asymmetric IC chips mounted on an SMPS board using the phase change material (n-eicosane). The phase change material (PCM) is kept inside the mini-channels fabricated on the board. The objective is to bring down the temperature (minimize the maximum temperature) of the configuration (SMPS board with 7 IC chips) using the n-eicosane inside the mini-channels. It is seen that n-eicosane absorbs the heat dissipated by the IC chips and thus the maximum temperature of the configuration reduces by 5.5%. The effect of channel hydraulic diameter (2.5 mm ≤ Dh ≤ 3.5 mm) on the temperature of the IC chips is also studied. The results suggest that the mini-channel with lower hydraulic diameter gives a better rate of heat transfer from the IC chips and thus cools these effectively. The study is extended using four different phase change materials out of which, n-eicosane has resulted in maximum temperature drop from the IC chips among different PCMs due to its lower melting point value. A correlation is proposed for the non-dimensional temperature (θ) of the IC chips in terms of Fourier number (Fo) to predict the IC chip temperatures during the melting of PCM.
Journal ArticleDOI
Computational study of PCM cooling for electronic circuit of smart-phone
TL;DR: A passive phase change material cooling strategy is proposed which can utilize the advantage of isotopic heat conduction from the electronic element to give an optimum cooling strategy over the electronic aspect which help in keeping the temperature of the electronicelement below 85 °C.
Journal ArticleDOI
Phase change material based passive battery thermal management system to predict delay effect
TL;DR: In this article, the authors performed PCM-based passive thermal management study over 60 Cell 18,650 lithium-ion battery packs which are considered to be working for automobile applications, and the output field results from numerical investigation are predicted using neural network approach in which a multi-objective optimization strategy is proposed between battery pack delay effect for selected paraffin wax and RT-18 PCM against its given C-rate.
Journal ArticleDOI
Experimental investigation of substrate board orientation effect on the optimal distribution of IC chips under forced convection
V. K. Mathew,Tapano Kumar Hotta +1 more
TL;DR: In this article, steady-state experiments are conducted under the laminar forced convection heat transfer mode for cooling of seven asymmetric IC chips (heat sources) mounted at different positions on the substructure.
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Chun Wah Leung,H. J. Kang +1 more
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