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Journal ArticleDOI

Numerical study on heat transfer performance using Al2O3/water nanofluids in six circular channel heat sink for electronic chip

01 Jan 2020-Materials Today: Proceedings (Elsevier BV)-Vol. 21, pp 194-201
TL;DR: In this paper, the performance of electronic chip in the six circular channel heat sink with water and the Al2O3/water nanofluids as coolants was investigated with ANSYS (v12) fluent software.
About: This article is published in Materials Today: Proceedings.The article was published on 2020-01-01. It has received 34 citations till now. The article focuses on the topics: Heat sink & Nanofluid.
Citations
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Journal ArticleDOI
TL;DR: This research investigates the heat and mass transfer in 3-D MHD radiative flow of water based hybrid nanofluid over an extending sheet by employing the strength of numerical computing based Lobatto IIIA method and observed that heat transfer rate increases with the increase in magnetic effect, Biot number and rotation parameter.
Abstract: This research investigates the heat and mass transfer in 3-D MHD radiative flow of water based hybrid nanofluid over an extending sheet by employing the strength of numerical computing based Lobatto IIIA method. Nanoparticles of aluminum oxide (Al2O3) and silver (Ag) are being used with water (H2O) as base fluid. By considering the heat transfer phenomenon due to thermal radiation effects. The physical flow problem is then modeled into set of PDEs, which are then transmuted into equivalent set of nonlinear ODEs by utilizing the appropriate similarity transformations. The system of ODEs is solved by the computational strength of Lobatto IIIA method to get the various graphical and numerical results for analyzing the impact of various physical constraints on velocity and thermal profiles. Additionally, the heat transfers and skin friction analysis for the fluid flow dynamics is also investigated. The relative errors up to the accuracy level of 1e-15, established the worth and reliability of the computational technique. It is observed that heat transfer rate increases with the increase in magnetic effect, Biot number and rotation parameter.

106 citations

Journal ArticleDOI
TL;DR: In this article, a corrugated plate heat exchanger in solar energy systems is used to investigate heat transfer and fluid flow characteristics of various nanofluids by adding various nanoparticles (Al2O3-30nm, SiC-40nm, CuO-30 nm and Fe3O4-25nm) into the base fluid.

96 citations

Journal ArticleDOI
TL;DR: In this article, the impact of nanofluids on heat transfer under different dispersive particles is explained for both numerical and experimental researches, and future directions for research are proposed.

94 citations

Journal ArticleDOI
TL;DR: In this article, the authors investigated the phenomenon of heat and mass transfer in 3D radiative flow of hybrid nanofluid over a rotational disk and found that the rate of heat transfer is proportional to Brinkman number, magnetic effect and concentration of nanoparticles.
Abstract: In this research, the phenomenon of heat and mass transfer in 3D radiative flow of hybrid nanofluid over a rotational disk is investigated. Nanoparticles of Al2O3 and Cu are being used with water (H2O) as base fluid. The mathematical flow model in terms of PDEs is constructed by considering the heat transport mechanism due to Joule heating and viscous dissipation. This set of PDEs is converted into a system of ODEs by introducing the proper similarity transformations, which is then solved with the computational strength of Lobatto IIIA method. Demonstrations of graphical and numerical data are offered to examine the variation of velocity and thermal field against various physical constraints. The variable trend of heat transfer rate and skin friction coefficient through numerical data are also investigated. It is found that rate of heat transfer is proportional to Brinkman number, magnetic effect and concentration of nanoparticles. Achieved accuracy in term of relative error upto the level of 1e-14 shows the reliability and worth of solution methodology.

76 citations

References
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Journal ArticleDOI
TL;DR: In this article, an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat-transfer fluids, which are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluid, and they represent the best hope for enhancing heat transfer.
Abstract: Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.

4,634 citations

Journal ArticleDOI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.

4,214 citations

Journal ArticleDOI
TL;DR: A review on fluid flow and heat transfer characteristics of nanofluids in forced and free convection flows is presented in this article, where the authors identify opportunities for future research.

1,988 citations

Journal ArticleDOI
TL;DR: In this paper, the authors present an exhaustive review of the literature in this area and suggest a direction for future developments, including heat transfer, material science, physics, chemical engineering and synthetic chemistry.
Abstract: Suspended nanoparticles in conventional fluids, called nanofluids, have been the subject of intensive study worldwide since pioneering researchers recently discovered the anomalous thermal behavior of these fluids. The enhanced thermal conductivity of these fluids with small-particle concentration was surprising and could not be explained by existing theories. Micrometer-sized particle-fluid suspensions exhibit no such dramatic enhancement. This difference has led to studies of other modes of heat transfer and efforts to develop a comprehensive theory. This article presents an exhaustive review of these studies and suggests a direction for future developments. The review and suggestions could be useful because the literature in this area is spread over a wide range of disciplines, including heat transfer, material science, physics, chemical engineering and synthetic chemistry.

1,069 citations

Journal ArticleDOI
TL;DR: In this article, a closed loop spray cooling test setup is established for the cooling of high heat flux heat sources, where eight miniature nozzles in a multi-nozzle plate are used to generate a spray array targeting at a 1 × 2 cm2 cooling surface.

290 citations