On-chip cooling by superlattice-based thin-film thermoelectrics
TL;DR: This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
Abstract: There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
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TL;DR: This review aims to comprehensively summarize the state-of-the-art strategies for the realization of high-performance thermoelectric materials and devices by establishing the links between synthesis, structural characteristics, properties, underlying chemistry and physics.
Abstract: The long-standing popularity of thermoelectric materials has contributed to the creation of various thermoelectric devices and stimulated the development of strategies to improve their thermoelectric performance. In this review, we aim to comprehensively summarize the state-of-the-art strategies for the realization of high-performance thermoelectric materials and devices by establishing the links between synthesis, structural characteristics, properties, underlying chemistry and physics, including structural design (point defects, dislocations, interfaces, inclusions, and pores), multidimensional design (quantum dots/wires, nanoparticles, nanowires, nano- or microbelts, few-layered nanosheets, nano- or microplates, thin films, single crystals, and polycrystalline bulks), and advanced device design (thermoelectric modules, miniature generators and coolers, and flexible thermoelectric generators). The outline of each strategy starts with a concise presentation of their fundamentals and carefully selected examples. In the end, we point out the controversies, challenges, and outlooks toward the future development of thermoelectric materials and devices. Overall, this review will serve to help materials scientists, chemists, and physicists, particularly students and young researchers, in selecting suitable strategies for the improvement of thermoelectrics and potentially other relevant energy conversion technologies.
951 citations
TL;DR: In this article, a magnetophoretically formed high aspect ratio nano-nodes are used for hot-spot cooling in microfluidic environments, which can be dynamically chained and docked onto the hot spots to establish tuneable high-aspect ratio nanofins for the heat exchange between these hot spots and the liquid coolant.
Abstract: The limitation of hot spot cooling in microchips represents an important hurdle for the electronics industry to overcome with coolers yet to exceed the efficiencies required. Nanotechnology-enabled heat sinks that can be magnetophoretically formed onto the hot spots within a microfluidic environment are presented. CrO2 nanoparticles, which are dynamically chained and docked onto the hot spots, establish tuneable high-aspect-ratio nanofins for the heat exchange between these hot spots and the liquid coolant. These nanofins can also be grown and released on demand, absorbing and releasing the heat from the hot spots into the microfluidic system. It is shown that both high aspect ratio and flexibility of the fins have a dramatic effect on increasing the heat sinking efficiency. The system has the potential to offer a practical cooling solution for future electronics.
855 citations
TL;DR: The field of thermoelectrics has long been recognized as a potentially transformative power generation technology and the field is now growing steadily due to their ability to convert heat directly into electricity and to develop cost effective, pollution-free forms of energy conversion.
632 citations
TL;DR: A large and tunable Seebeck coefficient of the single-layer MoS(2) paves the way to new applications of this material such as on-chip thermopower generation and waste thermal energy harvesting.
Abstract: We study the photoresponse of single-layer MoS(2) field-effect transistors by scanning photocurrent microscopy. We find that, unlike in many other semiconductors, the photocurrent generation in single-layer MoS(2) is dominated by the photothermoelectric effect and not by the separation of photoexcited electron-hole pairs across the Schottky barriers at the MoS(2)/electrode interfaces. We observe a large value for the Seebeck coefficient for single-layer MoS(2) that by an external electric field can be tuned between -4 × 10(2) and -1 × 10(5) μV K(-1). This large and tunable Seebeck coefficient of the single-layer MoS(2) paves the way to new applications of this material such as on-chip thermopower generation and waste thermal energy harvesting.
541 citations
01 Jan 2013
TL;DR: In this article, the photoresponse of single-layer MoS2 field effect transistors was studied by scanning photocurrent microscopy and it was shown that the photothermoelectric effect is dominant over the separation of photoexcited electron−hole pairs across the Schottky barriers at the MoS 2/electrode interfaces.
Abstract: We study the photoresponse of single-layer MoS2 field- effect transistors by scanning photocurrent microscopy. We find that, unlike in many other semiconductors, the photocurrent generation in single-layer MoS2 is dominated by the photothermoelectric effect and not by the separation of photoexcited electron−hole pairs across the Schottky barriers at the MoS2/electrode interfaces. We observe a large value for the Seebeck coefficient for single-layer MoS2 that by an external electric field can be tuned between −4 × 10 2 and −1 × 10 5 μ VK −1 . This large and tunable Seebeck coefficient of the single-layer MoS2 paves the way to new applications of this material such as on- chip thermopower generation and waste thermal energy harvesting.
486 citations
References
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TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
Abstract: Thermoelectric materials are of interest for applications as heat pumps and power generators. The performance of thermoelectric devices is quantified by a figure of merit, ZT, where Z is a measure of a material's thermoelectric properties and T is the absolute temperature. A material with a figure of merit of around unity was first reported over four decades ago, but since then-despite investigation of various approaches-there has been only modest progress in finding materials with enhanced ZT values at room temperature. Here we report thin-film thermoelectric materials that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys. This amounts to a maximum observed factor of approximately 2.4 for our p-type Bi2Te3/Sb2Te3 superlattice devices. The enhancement is achieved by controlling the transport of phonons and electrons in the superlattices. Preliminary devices exhibit significant cooling (32 K at around room temperature) and the potential to pump a heat flux of up to 700 W cm-2; the localized cooling and heating occurs some 23,000 times faster than in bulk devices. We anticipate that the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications: for example, in thermochemistry-on-a-chip, DNA microarrays, fibre-optic switches and microelectrothermal systems.
4,921 citations
"On-chip cooling by superlattice-bas..." refers background in this paper
...Significant progress has been made in recent years in increasing ZT by using nanostructured materials such as phonon-blockingselectron-transmitting thin-film superlattice...
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TL;DR: Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects, which makes these materials useful for cooling and power generation.
Abstract: The dimensionless thermoelectric figure of merit (ZT) in bismuth antimony telluride (BiSbTe) bulk alloys has remained around 1 for more than 50 years. We show that a peak ZT of 1.4 at 100°C can be achieved in a p-type nanocrystalline BiSbTe bulk alloy. These nanocrystalline bulk materials were made by hot pressing nanopowders that were ball-milled from crystalline ingots under inert conditions. Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects. More importantly, ZT is about 1.2 at room temperature and 0.8 at 250°C, which makes these materials useful for cooling and power generation. Cooling devices that use these materials have produced high-temperature differences of 86°, 106°, and 119°C with hot-side temperatures set at 50°, 100°, and 150°C, respectively. This discovery sets the stage for use of a new nanocomposite approach in developing high-performance low-cost bulk thermoelectric materials.
4,695 citations
Journal Article•
4,230 citations
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.
4,214 citations
14 Jul 1995
TL;DR: In this article, Rowe et al. proposed a method for reducing the thermal conductivity of a thermoelectric generator by reducing the carrier concentration of the generator, which was shown to improve the generator's performance.
Abstract: Introduction, D.M. Rowe General Principles and Theoretical Considerations Thermoelectric Phenomena, D.D. Pollock Coversion Efficiency and Figure-of-Merit, H.J. Goldsmid Thermoelectric Transport Theory, C.M. Bhandari Optimization of Carrier Concentration, C.M. Bhandari and D.M. Rowe Minimizing the Thermal Conductivity, C.M. Bhandari Selective Carrier Scattering in Thermoelectric Materials, Y.I. Ravich Thermomagnetic Phenomena, H.J. Goldsmid Material Preparation Preparation of Thermoelectric Materials from Melts, A. Borshchevsky Powder Metallurgy Techniques, A.N. Scoville PIES Method of Preparing Bismuth Alloys, T. Ohta and T. Kajikawa Preparation of Thermoelectric Materials by Mechanical Alloying, B.A. Cook, J.L. Harringa, and S.H. Han Preparation of Thermoelectric Films, K. Matsubara, T. Koyanagi, K. Nagao, and K. Kishimoto Measurement of Thermoelectric Properties Calculation of Peltier Device Performance, R.J. Buist Measurements of Electrical Properties, I.A. Nishida Measurement of Thermal Properties, R. Taylor Z-Meters, H.H. Woodbury, L.M. Levinson, and S. Lewandowski Methodology for Testing Thermoelectric Materials and Devices, R.J. Buist Thermoelectric Materials Bismuth Telluride, Antimony Telluride, and Their Solid Solutions, H. Scherrer and S. Scherrer Valence Band Structure and the Thermoelectric Figure-of-Merit of (Bi1-xSbx)Te3 Crystals, M. Stordeur Lead Telluride and Its Alloys, V. Fano Properties of the General Tags System, E.A. Skrabek and D.S. Trimmer Thermoelectric Properties of Silicides, C.B. Vining Polycrystalline Iron Disilicide as a Thermoelectric Generator Material, U. Birkholz, E. Gross, and U. Stohrer Thermoelectric Properties of Anisotropic MnSi1.75 , V.K. Zaitsev Low Carrier Mobility Materials for Thermoelectric Applications, V.K. Zaitsev, S.A. Ktitorov, and M.I. Federov Semimetals as Materials for Thermoelectric Generators, M.I. Fedorov and V.K. Zaitsev Silicon Germanium, C.B. Vining Rare Earth Compounds, B.J. Beaudry and K.A. Gschneidner, Jr. Thermoelectric Properties of High-Temperature Superconductors, M. Cassart and J.-P. Issi Boron Carbides, T.L. Aselage and D. Emin Thermoelectric Properties of Metallic Materials, A.T. Burkov and M.V. Vedernikov Neutron Irradiation Damage in SiGe Alloys, J.W. Vandersande New Materials and Performance Limits for Thermoelectric Cooling, G.A. Slack Thermoelectric Generation Miniature Semiconductor Thermoelectric Devices, D.M. Rowe Commercially Available Generators, A.G. McNaughton Modular RTG Technology, R.F. Hartman Peltier Devices as Generators, G. Min and D.M. Rowe Calculations of Generator Performance, M.H. Cobble Generator Applications Terrestrial Applications of Thermoelectric Generators, W.C. Hall Space Applications, G.L. Bennett SP-100 Space Subsystems, J.F. Mondt Safety Aspects of Thermoelectrics in Space, G.L. Bennett Low-Temperature Heat Conversion, K. Matsuura and D.M. Rowe Thermoelectric Refrigeration Introduction, H.J. Goldsmid Module Design and Fabrication, R. Marlow and E. Burke Cooling Thermoelements with Superconducting Leg, M.V. Vedernikov and V.L. Kuznetsov Applications of Thermoelectric Cooling Introduction, H.J. Goldsmid Commercial Peltier Modules, K.-I. Uemura Thermoelectrically Cooled Radiation Detectors, L.I. Anatychuk Reliability of Peltier Coolers in Fiber-Optic Laser Packages, R.M. Redstall and R. Studd Laboratory Equipment, K.-I. Uemura Large-Scale Cooling: Integrated Thermoelectric Element Technology, J.G. Stockholm Medium-Scale Cooling: Thermoelectric Module Technology, J.G. Stockholm Modeling of Thermoelectric Cooling Systems, J.G. Stockholm
4,192 citations