On the charging and thermal characterization of a micro/nano structured thermal ground plane
H. Peter J. de Bock,Shakti Singh Chauhan,Pramod Chamarthy,Stanton Earl Weaver,Tao Deng,Frank M. Gerner,Mohammed T. Ababneh,Kripa K. Varanasi +7 more
- pp 1-6
Reads0
Chats0
TLDR
In this paper, the authors describe the need for and design of a charging station to accurately dispense the working fluid and a thermal characterization experiment to characterize performance, including detailed analysis of accuracy and validation of the setup.Abstract:
As power densities in electronic devices have increased dramatically over the last decade, advanced thermal management solutions are required. A significant part of the thermal resistance budget is commonly taken up by the heat spreader, which serves to reduce the input heat flux and connect to an increased area for heat removal. Thermal ground planes are devices that address this issue by utilizing two-phase heat transfer achieving higher effective thermal conductivities than conventional solid heat spreaders. This study describes the need for and design of a charging station to accurately dispense the working fluid and a thermal characterization experiment to characterize performance. The design study includes detailed analysis of accuracy and validation of the setup.read more
Citations
More filters
Journal ArticleDOI
Planar vapor chamber with hybrid evaporator wicks for the thermal management of high-heat-flux and high-power optoelectronic devices
Y. Sungtaek Ju,Massoud Kaviany,Youngsuk Nam,Youngsuk Nam,Stephen Sharratt,Gisuk Hwang,Ivan Catton,Evan Fleming,P. Dussinger +8 more
TL;DR: In this article, a hybrid wick was proposed to combine distributed high-permeability liquid supply structures with thin (monolayer) evaporation layers to achieve both low thermal resistance and high limiting heat fluxes over large heating areas.
Book ChapterDOI
Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications
TL;DR: In this paper, a number of recent investigations have focused on the design, characterization, and fabrication of ultrathin vapor chambers for proximate heat spreading away from small hot spots, and the predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes.
Journal ArticleDOI
Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
TL;DR: The Defense Advanced Research Project Agency's (DARPA's) thermal ground plane (TGP) effort was aimed at combining the advantages of vapor chambers or two-dimensional (2D) heat pipes and solid conductors by building thin, high effective thermal conductivity, flat heat pipes out of materials with thermal expansion coefficients that match current electronic devices.
Proceedings ArticleDOI
Advanced thermal management technologies for defense electronics
TL;DR: The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT).
Proceedings ArticleDOI
Impingement cooled embedded diamond multiphysics co-design
Vincent Gambin,Benjamin Poust,Dino Ferizovic,Monte Watanabe,Gary Mandrusiak,David Lin,Thomas J. Dusseault +6 more
TL;DR: In this paper, an innovative imbedded cooling concept called Impingement Cooled Embedded Diamond (ICED) is proposed for RF thermal management, which uses liquid flowing through diamond-lined microchannels etched into the back of a GaN-on-SiC RF die to manage heat produced by the transistors.
References
More filters
Book
Heat Pipe Science And Technology
TL;DR: In this article, the authors present a detailed analysis of non-conventional heat pipe properties, including variable conductance heat pipes, and their properties in terms of heat transfer and mass transfer.
Journal ArticleDOI
High performance miniature heat pipe
TL;DR: In this article, high performance miniature heat pipes are developed for the cooling of high heat flux electronics using new capillary structures made of a folded copper sheet fin using electric-discharge-machining technique.
Proceedings ArticleDOI
Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools
TL;DR: In this article, the authors discuss both current capabilities and future requirements for passive and active cooling technologies, as well as modeling technologies which can be used by designers to predict optimal thermal/energy management solutions.
Journal ArticleDOI
On the fill charge and the sensitivity analysis of a V-shaped micro heat pipe
TL;DR: In this article, the optimal fill charge and the sensitivity analysis of a micro-grooved heat pipe are presented using a macroscopic approach to calculate the optimal-fill charge, the height and the temperature of the coolant liquid for a V-shaped micro-greased heat pipe.
Related Papers (5)
Modeling of thermal via heat transfer performance for power electronics cooling
Catalin Negrea,Paul Svasta +1 more