Operational limits of a submerged condenser
01 Jan 1972-pp 701-716
TL;DR: In this article, the operating characteristics of an experimental submerged condenser system are described and related to specific operational modes, and the relevant thermal transport mechanism is examined and shown to accurately define the upper and lower bounds of system operation.
Abstract: The operating characteristics of an experimental submerged condenser system are described and related to specific operational modes. The relevant thermal transport mechanism are examined and shown to accurately define the upper and lower bounds of system operation. A non-dimensional vapor bubble collapse length is shown to govern the rate and mechanism of heat transfer at the submerged condenser surface.
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TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Abstract: Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.
285 citations
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TL;DR: In this paper, a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions is presented. But the authors do not consider the effect of temperature variations on the nucleation of microelectronic components.
Abstract: Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.
75 citations
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01 Jan 1994TL;DR: In this paper, the theory and practice of direct liquid cooling of microelectronic components is discussed, and a morphological analysis is suggested for the classification of liquid-cooling concepts.
Abstract: The present work reviews the theory and practice of direct liquid cooling of microelectronic components. A morphological analysis is suggested for the classification of liquid-cooling concepts. While both immersion and microgroove cooling of chips are discussed, the emphasis is on immersion cooling. The performance of individual chips and liquid incapsulated modules, including the submerged condenser, is reviewed in detail, with data presented. Flow-through modules and falling-film techniques are also discussed. Finally, figures-of-merit for coolants are noted.
20 citations
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TL;DR: In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.
Abstract: Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.
19 citations
References
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01 Jun 1959
TL;DR: In this paper, the critical heat flux and the minimum heat flux are derived from these hydrodynamic limits, and results of investigations of nucleate boilin g are discussed and the theory of bubble growth is extended to include the effect of nonuniform temperature fields.
Abstract: A study concerned with the determination of the limiting hydrodynamic conditions which characterize nucleate and transitional boiling was conducted. The critical heat flux and the minimum heat flux are derived from these hydrodynamic limits. Results of investigations of nucleate boilin g are discussed and the theory of bubble growth is extended to include the effect of non-uniform temperature fields. An equation is derived for the product bubble diameter times frequency of bubble emission, and data showing that the diameter of nucleating cavities can he related to the heat flux density and superheat difference are presented. (J.R.D.)
953 citations
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TL;DR: In this article, the authors derived the maximum and minimum heat-transfer rates in the nucleate and the film-boiling regimes, respectively, using the classical results of Helmholtz Kelvan and Rayleigh expressions.
Abstract: Boiling heat transfer in the nucleate region is reviewed The transition film-boiling region is analyzed by considering the stability of a plane vortex sheet separating two inviscid fluids Using the classical results of Helmholtz Kelvan and Rayleigh expressions have been derived that predict the maximum and minimum heat-transfer rates in the nucleate and the film-boiling regimes, respectively The model exhibits the essential features of the phenomenon and shows good agreement with experimental data (auth)
364 citations
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TL;DR: In this article, a solution in successive approximations is presented for the heat diffusion across a spherical boundary with radial motion, provided the temperature variations are appreciable only in a thin layer adjacent to the spherical boundary.
Abstract: A solution in successive approximations is presented for the heat diffusion across a spherical boundary with radial motion. The approximation procedure converges rapidly provided the temperature variations are appreciable only in a thin layer adjacent to the spherical boundary. An explicit solution for the temperature field is given in the zero order when the temperature at infinity and the temperature gradient at the spherical boundary are specified. The first‐order correction for the temperature field may also be found. It may be noted that the requirements for rapid convergence of the approximate solution are satisfied for the particular problem of the growth or collapse of a spherical vapor bubble in a liquid when the translational motion of the bubble is neglected.
231 citations