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Journal ArticleDOI

Packaging with a Flexible Container for Oil-Filled or Evaporative-Cooled Electronic Equipment

C. Goltsos1, m. Mark
01 Sep 1962-Ire Transactions on Product Engineering and Production (IEEE)-Vol. 6, Iss: 3, pp 44-48

AbstractIn electronic packages where high voltages exist, a high dielectric strength environment surrounding the components is necessary. Liquid-filled units have used various oils which in addition to dielectric strength provide good thermal paths for cooling; evaporative-cooled units often use refrigerants. In either case allowance, volume-wise, must be made for thermal expansion of the fluid. A simple, novel, weight-saving technique for accomplishing this consists essentially of replacing the conventional container with a flexible one (for example, fabric-reinforced rubber). The flexible container then expands and contracts accomodating volume variations in the fluid. Design details, test results, and a general evaluation illustrating the adaptability of the flexible container as a practical design tool are discussed.

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Citations
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Journal ArticleDOI
Abstract: Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

75 citations

Journal ArticleDOI
Abstract: Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.

17 citations

Journal ArticleDOI
Abstract: Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.

14 citations

Dissertation
01 Jan 1971
Abstract: Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971.

8 citations

Book ChapterDOI
01 Jan 1972
Abstract: The operating characteristics of an experimental submerged condenser system are described and related to specific operational modes. The relevant thermal transport mechanism are examined and shown to accurately define the upper and lower bounds of system operation. A non-dimensional vapor bubble collapse length is shown to govern the rate and mechanism of heat transfer at the submerged condenser surface.

7 citations