Performance analysis of carbon nanotube interconnects for VLSI applications
Navin Srivastava,Kaustav Banerjee +1 more
- pp 383-390
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TLDR
It is shown that CNT bundles can outperform copper for long intermediate and global interconnects, and can be engineered to compete with copper for local level interConnects.Abstract:
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects for VLSI circuits, while taking into account the practical limitations in this technology. A model is developed to calculate equivalent circuit parameters for a CNT-bundle interconnect based on interconnect geometry. Using this model, the performance of CNT-bundle interconnects (at local, intermediate and global levels) is compared to copper wires of the future. It is shown that CNT bundles can outperform copper for long intermediate and global interconnects, and can be engineered to compete with copper for local level interconnects. The technological requirements necessary to make CNT bundles viable as future interconnects are also laid out.read more
Citations
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Journal ArticleDOI
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects
TL;DR: In this paper, the state-of-the-art of carbon-based nanomaterials, particularly the one-dimensional (1-D) forms, carbon nanotubes (CNTs) and graphene nanoribbons (GNRs), are reviewed.
Journal ArticleDOI
Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects
TL;DR: In this paper, a detailed investigation of MWCNT-based interconnect performance is presented, for the first time, and a compact equivalent circuit model is presented for evaluating and compared with traditional Cu interconnects, as well as Single-Walled CNT (SWCNT) based interconnect, at different interconnect levels.
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On-Chip Communication Architectures: System on Chip Interconnect
Sudeep Pasricha,Nikil Dutt +1 more
TL;DR: This book is a comprehensive reference on concepts, research and trends in on-chip communication architecture design, and will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on- chip communication architectures.
Journal ArticleDOI
On the Applicability of Single-Walled Carbon Nanotubes as VLSI Interconnects
TL;DR: In this article, the applicability of single-walled carbon nanotubes (SWCNTs) as interconnects in nanoscale integrated circuits has been investigated and a detailed analysis of SWCNT interconnect resistance is presented.
Journal ArticleDOI
Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques
Arthur Nieuwoudt,Yehia Massoud +1 more
TL;DR: In this article, the impact of nanotube diameter on contact and ohmic resistance has been modeled for single-walled carbon nanotubes (SWCNT) bundles, and it is shown that SWCNT bundles can provide up to one order of magnitude reduction in resistance when compared with traditional copper interconnects depending on bundle geometry and individual diameter.
References
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TL;DR: X-ray diffraction and electron microscopy showed that fullerene single-wall nanotubes (SWNTs) are nearly uniform in diameter and that they self-organize into “ropes,” which consist of 100 to 500 SWNTs in a two-dimensional triangular lattice with a lattice constant of 17 angstroms.
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Journal ArticleDOI
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