Proceedings ArticleDOI
Performance evaluation and reliability of thermal vias
B.S. McCoy,M.A. Zimmermann +1 more
- Vol. 2, pp 1250-1256
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TLDR
In this paper, a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks was established to meet cooling and producibility requirements.Abstract:
Establish a high-yield design approach for surface mount power packages utilizing PWB thermal vias, elastomeric material and heatsinks. A feasibility study proved that the thermal via concept could be implemented to meet cooling and producibility requirements. Reliability testing demonstrated negligible thermal path degradation for a 15-year life equivalent in airborne environment.read more
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Journal ArticleDOI
Thermal Modeling and Design Optimization of PCB Vias and Pads
TL;DR: In this article, an axisymmetric thermal resistance model is developed for PCB thermal pads where the heat conduction, convection, and radiation all exist; due to the interdependence between the conductive/radiative heat transfer coefficients and the board temperatures, an algorithm is proposed to fast obtain the board-ambient thermal resistance and to predict the semiconductor junction temperature.
Journal ArticleDOI
Interleaved Single-Stage LLC Converter Design Utilizing Half- and Full-Bridge Configurations for Wide Voltage Transfer Ratio Applications
TL;DR: This article presents a single-stage interleaved LLC resonant converter of 3.6 kW and shows that phase-shift operation and asymmetrical duty-cycle modulation can be utilized for power balancing for full-bridge and half-bridge configurations, respectively, such that a much smaller output capacitor can be employed.
Proceedings ArticleDOI
A review of thermal management in power converters with thermal vias
TL;DR: In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters is presented, based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied.
Proceedings ArticleDOI
A comparison of thermal vias patterns used for thermal management in power converter
TL;DR: In this article, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of power electronics devices is presented based on the results from available literature and practical manufacturing guidelines, four different via patterns for single power devices are selected.
Proceedings ArticleDOI
Performance comparison of thermal interface materials for power electronics applications
TL;DR: In this article, a detailed comparison of the properties of various off-the-shelf available TIMs to be specifically used between PCB with thermal vias and heat sink is presented, and experimental results are presented to determine the thermal performance of various TIMs.