Journal ArticleDOI
Photoselective Deposition of Copper and Nickel on Non-Conducting Substrates by Alkaline Electroless Baths at Room Temperature
Reads0
Chats0
TLDR
An attempt has been made to deposit copper and nickle using room temperature electroless baths on pre-selected areas of alumina and FRP substrates using PdCl2 as activator, which yields a dense deposit of Cu and Ni having good adherence to the substrates.Abstract:
Interest in the metallization of dielectric substrates such as ceramics, plastics is growing because of their wider applications in electronic industries, namely in the fabrication of MIC's, HIC's etc. In this paper an attempt has been made to deposit copper and nickle using room temperature electroless baths on pre-selected areas of alumina and FRP substrates using PdCl2 as activator. The process offers a uniform dense deposit of Ni/Cu selectively on the substrates. For full coverage of the metal on the substrate it has been found that either AgNO3 or PdCl2 as activator has the same effect. The process yields a dense deposit of Cu and Ni having good adherence to the substrates.read more
Citations
More filters
Journal ArticleDOI
Adhesion enhancement for nickel layer deposited on carbon fiber reinforced polymer (CFRP) composites by pretreatment processes for lightning strike
TL;DR: In this article , the surface roughness, wettability, phase and microstructure of carbon fiber-reinforced polymer (CFRP) composites were determined by surface profile-meter, goniometer, X-ray diffraction and scanning electronic microscopy, respectively.
References
More filters
Journal ArticleDOI
Tin (IV) Chloride Solution as a Sensitizer in Photoselective Metal Deposition
TL;DR: In this article, it was shown that Sn(IV) bound to a substrate is capable, in conjunction with Pd(II), of catalyzing NiP plating and that this effect can be inhibited by u.v. light.
Journal ArticleDOI
Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths
Journal ArticleDOI
Variation of Contact Resistance of Electroless Ni‐P on Silicon with the Change of Phosphorous Concentration in the Deposit
B. K. Singh,R. N. Mitra +1 more
Journal ArticleDOI
Electroless NiP processing for hybrid integrated circuits
TL;DR: In this paper, an electroless method for depositing conductive layers on insulating materials can be used in producing hybrid integrated circuits (HIC's), as alternatives to the evaporation and sputter deposition techniques.